{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T19:25:55Z","timestamp":1725564355976},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,12]]},"DOI":"10.1109\/wsc.2014.7020105","type":"proceedings-article","created":{"date-parts":[[2015,1,27]],"date-time":"2015-01-27T15:30:56Z","timestamp":1422372656000},"page":"2609-2616","source":"Crossref","is-referenced-by-count":1,"title":["Modeling fatigue life of power semiconductor devices with &amp;#x03B5;-N fields"],"prefix":"10.1109","author":[{"given":"Olivia","family":"Bluder","sequence":"first","affiliation":[]},{"given":"Kathrin","family":"Plankensteiner","sequence":"additional","affiliation":[]},{"given":"Michael","family":"Nelhiebel","sequence":"additional","affiliation":[]},{"given":"Walther","family":"Heinz","sequence":"additional","affiliation":[]},{"given":"Christian","family":"Leitner","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.engfracmech.2008.04.011"},{"journal-title":"A Unified Statistical Methodology for Modeling Fatigue Damage","year":"2009","author":"castillo","key":"ref3"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2011.06.042"},{"key":"ref5","article-title":"Influence of Initial Microstructure on Thermo-mechanical Fatigue Behaviour of Cu Films on Substrates","author":"heinz","year":"2014","journal-title":"Proceedings of Materials for Advanced Metallization MAM 2014"},{"key":"ref8","first-page":"155","article-title":"Design of a Real-time System for in-situ Characterization of Smart Power Switches during Cycle Stress Testing","author":"steinwender","year":"2010","journal-title":"Proceedings of VIP 2010"},{"journal-title":"Materials Science of Thin Films","year":"2001","author":"ohring","key":"ref7"},{"article-title":"Thermal and Electro-thermal Modeling of Electronic Devices and Systems for High-power and High-frequency Applications","year":"2012","author":"bernardoni","key":"ref2"},{"journal-title":"Uber die Festigkeitsversuche mit Eisen und Stahl","year":"1870","author":"w\u00f6hler","key":"ref9"},{"journal-title":"Short Circuit Reliability Characterization of Smart Power Devices for 12V Systems AEC - Q100&#x2013;012","year":"2006","key":"ref1"}],"event":{"name":"2014 Winter Simulation Conference - (WSC 2014)","start":{"date-parts":[[2014,12,7]]},"location":"Savanah, GA, USA","end":{"date-parts":[[2014,12,10]]}},"container-title":["Proceedings of the Winter Simulation Conference 2014"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7002492\/7019868\/07020105.pdf?arnumber=7020105","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T04:25:39Z","timestamp":1490329539000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7020105\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,12]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/wsc.2014.7020105","relation":{},"subject":[],"published":{"date-parts":[[2014,12]]}}}