{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,22]],"date-time":"2025-08-22T05:10:52Z","timestamp":1755839452494,"version":"3.37.3"},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,10,10]],"date-time":"2022-10-10T00:00:00Z","timestamp":1665360000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,10,10]],"date-time":"2022-10-10T00:00:00Z","timestamp":1665360000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100003052","name":"Ministry of Trade, Industry and Energy","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003052","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100008903","name":"Ministry of Health & Welfare","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100008903","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003569","name":"Ministry of Food and Drug Safety","doi-asserted-by":"publisher","award":["1711174481"],"award-info":[{"award-number":["1711174481"]}],"id":[{"id":"10.13039\/501100003569","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation (NRF)","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,10,10]]},"DOI":"10.1109\/ius54386.2022.9958066","type":"proceedings-article","created":{"date-parts":[[2022,12,1]],"date-time":"2022-12-01T20:54:16Z","timestamp":1669928056000},"page":"1-4","source":"Crossref","is-referenced-by-count":2,"title":["Giant Pressure Output Efficiency of Capacitive Micromachined Ultrasonic Transducers Using Nano-Silicon-Springs"],"prefix":"10.1109","author":[{"given":"Hae Youn","family":"Kim","sequence":"first","affiliation":[{"name":"Bionics Research Center, Korea Institute of Science and Technology,Seoul,Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8570-1145","authenticated-orcid":false,"given":"Dong-Hyun","family":"Kang","sequence":"additional","affiliation":[{"name":"Bionics Research Center, Korea Institute of Science and Technology,Seoul,Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shyinyong","family":"Shim","sequence":"additional","affiliation":[{"name":"Bionics Research Center, Korea Institute of Science and Technology,Seoul,Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jung-mok","family":"Seo","sequence":"additional","affiliation":[{"name":"Yonsei University,Department of Electrical and Electronic Engineering,Seoul,Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3940-7898","authenticated-orcid":false,"given":"Butrus T.","family":"Khuri-Yakub","sequence":"additional","affiliation":[{"name":"Stanford University,Department of Electrical Engineering,Stanford,CA,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7702-716X","authenticated-orcid":false,"given":"Bvung Chul","family":"Lee","sequence":"additional","affiliation":[{"name":"Bionics Research Center, Korea Institute of Science and Technology,Seoul,Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1053\/j.sult.2011.09.003"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.3390\/app11041418"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1515\/aoa-2016-0058"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.3390\/mi10020152"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1126\/sciadv.1501382"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IUS46767.2020.9251528"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.3390\/s18082520"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TUFFC.2009.1013"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1038\/s41378-022-00392-0"}],"event":{"name":"2022 IEEE International Ultrasonics Symposium (IUS)","start":{"date-parts":[[2022,10,10]]},"location":"Venice, Italy","end":{"date-parts":[[2022,10,13]]}},"container-title":["2022 IEEE International Ultrasonics Symposium (IUS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9957114\/9957143\/09958066.pdf?arnumber=9958066","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,2,14]],"date-time":"2025-02-14T07:36:16Z","timestamp":1739518576000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9958066\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10,10]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/ius54386.2022.9958066","relation":{},"subject":[],"published":{"date-parts":[[2022,10,10]]}}}