{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,7]],"date-time":"2026-08-07T16:23:32Z","timestamp":1786119812984,"version":"build-2736575974"},"reference-count":11,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2026,5,1]],"date-time":"2026-05-01T00:00:00Z","timestamp":1777593600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,5,1]],"date-time":"2026-05-01T00:00:00Z","timestamp":1777593600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,1]],"date-time":"2026-05-01T00:00:00Z","timestamp":1777593600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Pulse"],"published-print":{"date-parts":[[2026,5]]},"DOI":"10.1109\/mpuls.2026.3700210","type":"journal-article","created":{"date-parts":[[2026,8,5]],"date-time":"2026-08-05T19:06:29Z","timestamp":1785956789000},"page":"6-12","source":"Crossref","is-referenced-by-count":0,"title":["AI-Enabled Headband Uses Personalized Vibration to Ease Sinus Congestion"],"prefix":"10.1109","volume":"17","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-9244-376X","authenticated-orcid":false,"given":"Leslie","family":"Mertz","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","volume-title":"SoundHealth","year":"2026"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1164\/rccm.200202-138BC"},{"key":"ref3","volume-title":"Marvell introduces world\u2019s first silicon solution that embeds WLAN into digital cordless, VoIP, video phones, and other consumer electronics","year":"2005"},{"key":"ref4","volume-title":"Applied micro ships microserver chips in challenge to Intel","author":"Randewich","year":"2014"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/OJEMB.2024.3516320"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1002\/alr.22877"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1002\/alr.23284"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1038\/srep29947"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1038\/s41598-024-76059-9"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.13078\/jsm.250006"},{"key":"ref11","volume-title":"Nobel Prize in Physiology or Medicine 2021","year":"2026"}],"container-title":["IEEE Pulse"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/5454060\/11643469\/11643470.pdf?arnumber=11643470","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,8,6]],"date-time":"2026-08-06T19:14:50Z","timestamp":1786043690000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11643470\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5]]},"references-count":11,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/mpuls.2026.3700210","relation":{},"ISSN":["2154-2287","2154-2317"],"issn-type":[{"value":"2154-2287","type":"print"},{"value":"2154-2317","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,5]]}}}