{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,7]],"date-time":"2026-08-07T19:52:03Z","timestamp":1786132323348,"version":"build-2736575974"},"reference-count":0,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T00:00:00Z","timestamp":1767225600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T00:00:00Z","timestamp":1767225600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T00:00:00Z","timestamp":1767225600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"crossref","award":["W2541020"],"award-info":[{"award-number":["W2541020"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"crossref"}]},{"name":"Research Project","award":["A1098531023601318"],"award-info":[{"award-number":["A1098531023601318"]}]},{"DOI":"10.13039\/501100002855","name":"Ministry of Science and Technology of the People's Republic of China","doi-asserted-by":"crossref","award":["G07KYBZ20230620"],"award-info":[{"award-number":["G07KYBZ20230620"]}],"id":[{"id":"10.13039\/501100002855","id-type":"DOI","asserted-by":"crossref"}]},{"DOI":"10.13039\/501100005408","name":"University of Electronic Science and Technology of China","doi-asserted-by":"crossref","award":["UESTC Extracurricular Innovation and Practice Program for Freshmen"],"award-info":[{"award-number":["UESTC Extracurricular Innovation and Practice Program for Freshmen"]}],"id":[{"id":"10.13039\/501100005408","id-type":"DOI","asserted-by":"crossref"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ultrasonics"],"published-print":{"date-parts":[[2026]]},"DOI":"10.1109\/tuson.2026.3720569","type":"journal-article","created":{"date-parts":[[2026,8,5]],"date-time":"2026-08-05T19:09:31Z","timestamp":1785956971000},"page":"1-1","source":"Crossref","is-referenced-by-count":0,"title":["Equivalent Circuit Analysis of Double Mode Surface Acoustic Wave Filters with Series- or Parallel-Connected One-Port Resonator"],"prefix":"10.1109","author":[{"ORCID":"https:\/\/orcid.org\/0009-0009-8960-3230","authenticated-orcid":false,"given":"Muxiang","family":"Su","sequence":"first","affiliation":[{"name":"University of Electronic Science and Technology of China","place":["Chengdu, China"],"department":["School of Integrated Circuit Science and Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-0695-1752","authenticated-orcid":false,"given":"Zijiang","family":"Yang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China","place":["Chengdu, China"],"department":["School of Integrated Circuit Science and Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Fuxian","family":"Zhang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China","place":["Chengdu, China"],"department":["School of Integrated Circuit Science and Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8752-5234","authenticated-orcid":false,"given":"Jingfu","family":"Bao","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China","place":["Chengdu, China"],"department":["School of Integrated Circuit Science and Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7377-6457","authenticated-orcid":false,"given":"Ken-ya","family":"Hashimoto","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China","place":["Chengdu, China"],"department":["School of Integrated Circuit Science and Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","container-title":["IEEE Transactions on Ultrasonics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11073821\/11249724\/11643308.pdf?arnumber=11643308","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,8,7]],"date-time":"2026-08-07T19:17:11Z","timestamp":1786130231000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11643308\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/tuson.2026.3720569","relation":{},"ISSN":["3066-9464"],"issn-type":[{"value":"3066-9464","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026]]}}}