{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T01:26:51Z","timestamp":1725413211483},"reference-count":0,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/asmc.2006.1638748","type":"proceedings-article","created":{"date-parts":[[2006,6,21]],"date-time":"2006-06-21T15:42:54Z","timestamp":1150904574000},"page":"180-184","source":"Crossref","is-referenced-by-count":0,"title":["Methods for Fast Yield Learning in A DRAM Wafer Fab using a Remote Packaging and Test Site."],"prefix":"10.1109","author":[{"given":"R.","family":"Trahan","sequence":"first","affiliation":[]},{"given":"W.","family":"Hill","sequence":"additional","affiliation":[]},{"given":"R.","family":"Chapman","sequence":"additional","affiliation":[]},{"given":"A.","family":"Bicho","sequence":"additional","affiliation":[]},{"given":"N.","family":"Gumaer","sequence":"additional","affiliation":[]},{"given":"M.","family":"Gomes","sequence":"additional","affiliation":[]}],"member":"263","event":{"name":"The 17th Annual SEMI\/IEEE ASMC 2006 Conference","location":"Boston, MA"},"container-title":["The 17th Annual SEMI\/IEEE ASMC 2006 Conference"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/10915\/34362\/01638748.pdf?arnumber=1638748","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,14]],"date-time":"2017-03-14T17:45:33Z","timestamp":1489513533000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1638748\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/asmc.2006.1638748","relation":{},"subject":[]}}