{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,25]],"date-time":"2025-11-25T06:49:00Z","timestamp":1764053340416,"version":"3.28.0"},"reference-count":5,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,12]]},"DOI":"10.1109\/eptc.2013.6745754","type":"proceedings-article","created":{"date-parts":[[2014,2,21]],"date-time":"2014-02-21T16:20:38Z","timestamp":1392999638000},"page":"415-419","source":"Crossref","is-referenced-by-count":4,"title":["Wafer reconstruction: An alternative 3D integration process flow"],"prefix":"10.1109","author":[{"given":"Teng","family":"Wang","sequence":"first","affiliation":[]},{"given":"Jose Luis","family":"Silva","sequence":"additional","affiliation":[]},{"given":"Robert","family":"Daily","sequence":"additional","affiliation":[]},{"given":"Giovanni","family":"Capuz","sequence":"additional","affiliation":[]},{"given":"Mario","family":"Gonzalez","sequence":"additional","affiliation":[]},{"given":"Kenneth June","family":"Rebibis","sequence":"additional","affiliation":[]},{"given":"Steffen","family":"Kroehnert","sequence":"additional","affiliation":[]},{"given":"Eric","family":"Beyne","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1364\/JOSA.11.000233"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898528"},{"key":"1","first-page":"1","article-title":"3D system integration technologies","volume":"2006","author":"beyne","year":"0","journal-title":"2006 International Symposium on VLSI Technology Systems and Applications VTSA"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1007\/BF00550148"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1063\/1.1729049"}],"event":{"name":"2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)","start":{"date-parts":[[2013,12,11]]},"location":"Singapore","end":{"date-parts":[[2013,12,13]]}},"container-title":["2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6732180\/6745670\/06745754.pdf?arnumber=6745754","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T17:00:18Z","timestamp":1490288418000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6745754\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,12]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/eptc.2013.6745754","relation":{},"subject":[],"published":{"date-parts":[[2013,12]]}}}