{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,15]],"date-time":"2026-05-15T23:17:21Z","timestamp":1778887041446,"version":"3.51.4"},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,12]]},"DOI":"10.1109\/eptc.2017.8277575","type":"proceedings-article","created":{"date-parts":[[2018,2,1]],"date-time":"2018-02-01T16:44:09Z","timestamp":1517503449000},"page":"1-4","source":"Crossref","is-referenced-by-count":2,"title":["Ultra-small packaged micro-cooler for medical applications"],"prefix":"10.1109","author":[{"given":"J.","family":"Fernandes","sequence":"first","affiliation":[]},{"given":"P.","family":"Anacleto","sequence":"additional","affiliation":[]},{"given":"L. A.","family":"Rocha","sequence":"additional","affiliation":[]},{"given":"J.","family":"Gaspar","sequence":"additional","affiliation":[]},{"given":"P. M.","family":"Mendes","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","article-title":"Guideline for Pan-European R&D&I, Co-Operation in the Electronics Value Chain","year":"2013","journal-title":"Appendix to Chapter 7"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1049\/iet-nbt.2011.0017"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/EuMC.2015.7345703"},{"key":"ref5","article-title":"Self-Folding process for integrated 3D structures in complex microsystems","author":"fernandes","year":"2017","journal-title":"43rd International conference on micro and nanoengineering"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/IMPACT.2015.7365184"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898490"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.expneurol.2017.06.008"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2015.2450731"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.seizure.2008.06.005"}],"event":{"name":"2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)","location":"Singapore","start":{"date-parts":[[2017,12,6]]},"end":{"date-parts":[[2017,12,9]]}},"container-title":["2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8267583\/8277424\/08277575.pdf?arnumber=8277575","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,3,12]],"date-time":"2018-03-12T17:50:30Z","timestamp":1520877030000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8277575\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,12]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/eptc.2017.8277575","relation":{},"subject":[],"published":{"date-parts":[[2017,12]]}}}