{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T13:29:57Z","timestamp":1730294997329,"version":"3.28.0"},"reference-count":20,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,8]]},"DOI":"10.1109\/sbcci.2018.8533252","type":"proceedings-article","created":{"date-parts":[[2018,11,16]],"date-time":"2018-11-16T02:32:18Z","timestamp":1542335538000},"page":"1-5","source":"Crossref","is-referenced-by-count":3,"title":["3D-HEVC DMM-1 Parallelism Exploration Targeting Multicore Systems"],"prefix":"10.1109","author":[{"given":"Gustavo","family":"Sanchez","sequence":"first","affiliation":[]},{"given":"Luciano","family":"Agostini","sequence":"additional","affiliation":[]},{"given":"Leonel","family":"Sousa","sequence":"additional","affiliation":[]},{"given":"Cesar","family":"Marcon","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ICECS.2016.7841204"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ICIP.2014.7025649"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/VCIP.2014.7051523"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2012.2221525"},{"key":"ref14","first-page":"1","article-title":"Fast intra mode decision for depth coding in 3D-HEVC","author":"zhang","year":"2016","journal-title":"Multidimensional Systems and Signal Processing"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TMM.2016.2625261"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/99.660313"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/PCS.2012.6213277"},{"key":"ref18","article-title":"Test Model 10 of 3D-HEVC and MV-HEVC","author":"chen","year":"2014","journal-title":"ISO\/IEC JTC1\/SC29\/WG11"},{"key":"ref19","article-title":"Common Test Conditions of 3DV Core Experiments","author":"rusanovskyy","year":"2013","journal-title":"ISO\/IEC JTC1\/SC29\/WG11 MPEG2011"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TBC.2011.2120730"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSTSP.2013.2283657"},{"year":"0","key":"ref6"},{"key":"ref5","first-page":"93","article-title":"Depth-image-based rendering (DIBR), compression, and transmission for a new approach on 3D-TV","volume":"5291","author":"fehn","year":"2004","journal-title":"Stereoscopic Displays and Virtual Reality Systems (SPIE)"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICIP.2014.7025651"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2015.2407791"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TIP.2013.2264820"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2012.2221191"},{"journal-title":"3D-CE1 Depth Intra Skip (DIS) Mode","year":"2015","author":"lee","key":"ref9"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1117\/1.JEI.24.2.023011"}],"event":{"name":"2018 31st Symposium on Integrated Circuits and Systems Design (SBCCI)","start":{"date-parts":[[2018,8,27]]},"location":"Bento Goncalves","end":{"date-parts":[[2018,8,31]]}},"container-title":["2018 31st Symposium on Integrated Circuits and Systems Design (SBCCI)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8513831\/8533220\/08533252.pdf?arnumber=8533252","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,26]],"date-time":"2022-01-26T21:25:44Z","timestamp":1643232344000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8533252\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,8]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/sbcci.2018.8533252","relation":{},"subject":[],"published":{"date-parts":[[2018,8]]}}}