{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,28]],"date-time":"2025-06-28T06:24:22Z","timestamp":1751091862368,"version":"3.28.0"},"reference-count":25,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,5,7]],"date-time":"2023-05-07T00:00:00Z","timestamp":1683417600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,5,7]],"date-time":"2023-05-07T00:00:00Z","timestamp":1683417600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,5,7]]},"DOI":"10.1109\/spi57109.2023.10145530","type":"proceedings-article","created":{"date-parts":[[2023,6,12]],"date-time":"2023-06-12T17:56:35Z","timestamp":1686592595000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["Improving the reliability of power LEDs with diamond boards"],"prefix":"10.1109","author":[{"given":"Joana C.","family":"Mendes","sequence":"first","affiliation":[{"name":"Instituto de Telecomunicações and University of Aveiro,Aveiro,Portugal"}]},{"given":"Luis A.","family":"Rodrigues","sequence":"additional","affiliation":[{"name":"Instituto de Telecomunicações and University of Aveiro,Aveiro,Portugal"}]},{"given":"Sushmitha","family":"Kyatam","sequence":"additional","affiliation":[{"name":"Instituto de Telecomunicações and University of Aveiro,Aveiro,Portugal"}]},{"given":"Luis N.","family":"Alves","sequence":"additional","affiliation":[{"name":"Instituto de Telecomunicações and University of Aveiro,Aveiro,Portugal"}]},{"given":"Luiz","family":"Pereira","sequence":"additional","affiliation":[{"name":"Institute for Nanostructures, Nanomodulation and Nanofabrication, University of Aveiro,Department of Physics and I3N,Aveiro,Portugal"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"crossref","first-page":"777","DOI":"10.1109\/LPT.2021.3095557","volume":"33","author":"Li","year":"2021","journal-title":"IEEE Photonics Technol. Lett."},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/sslchina37640.2015"},{"key":"ref4","first-page":"1377","volume-title":"Proc. - 2010 11th Int. Conf. Electron. Packag. Technol. High Density Packag. ICEPT-HDP","author":"Zhong","year":"2010"},{"key":"ref5","first-page":"1","article-title":"Cross Strait Quad-Regional Radio Sci. Wirel. Technol.","volume-title":"Conf. CSQRWC","author":"Wang","year":"2019"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/sslchinaifws49075.2019"},{"key":"ref7","first-page":"1","volume-title":"Proc. Int. Conf. Inven. Syst. Control. ICISC 2017","author":"Paul","year":"2017"},{"key":"ref8","first-page":"85","volume-title":"16th Int. Conf. Electron. Packag. Technol. ICEPT 2015","author":"Luo","year":"2015"},{"key":"ref9","doi-asserted-by":"crossref","first-page":"1410","DOI":"10.1109\/TPEL.2013.2260769","volume":"29","author":"Juntunen","year":"2014","journal-title":"IEEE Trans. Power Electron."},{"key":"ref10","first-page":"267","article-title":"Thermomechanical Phenom. Electron. Syst.","volume-title":"Proceedings Intersoc. Conf.","author":"Pounds","year":"2014"},{"key":"ref11","doi-asserted-by":"crossref","first-page":"109144","DOI":"10.1016\/j.diamond.2022.109144","volume":"127","author":"Kyatam","year":"2022","journal-title":"Diam. Relat. Mater."},{"key":"ref12","doi-asserted-by":"crossref","first-page":"1453","DOI":"10.1109\/TCPMT.2017.2703826","volume":"7","author":"Huang","year":"2017","journal-title":"IEEE Trans. Components, Packag. Manuf. Technol."},{"key":"ref13","doi-asserted-by":"crossref","first-page":"H222","DOI":"10.1149\/1.3110040","volume":"12","author":"Horng","year":"2009","journal-title":"Electrochem. Solid-State Lett."},{"key":"ref14","doi-asserted-by":"crossref","first-page":"1174","DOI":"10.1109\/TED.2017.2656240","volume":"64","author":"Liang","year":"2017","journal-title":"IEEE Trans. Electron Devices"},{"key":"ref15","doi-asserted-by":"crossref","first-page":"161","DOI":"10.1109\/TDMR.2013.2248365","volume":"14","author":"Tsai","year":"2014","journal-title":"IEEE Trans. Device Mater. Reliab."},{"key":"ref16","doi-asserted-by":"crossref","first-page":"854","DOI":"10.1109\/JEDS.2021.3115027","volume":"9","author":"Kyatam","year":"2021","journal-title":"IEEE J. Electron Devices Soc."},{"key":"ref17","first-page":"29","volume-title":"Proc. Tech. Pap.-2007 Int. Microsystems, Packag. Assem. Circuits Technol. Conf. IMPACT","author":"Chun","year":"2007"},{"key":"ref18","first-page":"2","volume-title":"Int. Microsystems Packag. Assem. Circuits Technol. Conf. IMPACT 2010 Int. 3D IC Conf. Proc.","author":"Tang","year":"2010"},{"key":"ref19","doi-asserted-by":"crossref","first-page":"3375","DOI":"10.1109\/TED.2008.2006534","volume":"55","author":"Fan","year":"2008","journal-title":"IEEE Trans. Electron Devices"},{"key":"ref20","doi-asserted-by":"crossref","first-page":"3740171","DOI":"10.1088\/0022-3727\/43\/37\/374017","volume":"43","author":"Gracio","year":"2010","journal-title":"J. Phys. D. Appl. Phys."},{"key":"ref21","doi-asserted-by":"crossref","first-page":"1617","DOI":"10.1109\/PROC.1967.5915","volume":"55","author":"Swan","year":"1967","journal-title":"Proc. IEEE"},{"key":"ref22","doi-asserted-by":"crossref","first-page":"845","DOI":"10.1109\/LPT.2008.921826","volume":"20","author":"Chen","year":"2008","journal-title":"IEEE Photonics Technol. Lett."},{"key":"ref23","doi-asserted-by":"crossref","first-page":"206","DOI":"10.1007\/s12598-011-0225-5","volume":"30","author":"Fan","year":"2011","journal-title":"Rare Met."},{"key":"ref24","doi-asserted-by":"crossref","first-page":"100856","DOI":"10.1016\/j.photonics.2020.100856","volume":"42","author":"Xie","year":"2020","journal-title":"Photonics Nanostructures - Fundam. Appl."},{"key":"ref26","doi-asserted-by":"crossref","first-page":"15","DOI":"10.1007\/978-1-4614-5091-7_2","volume-title":"Thermal management for LED applications","author":"Li","year":"2014"},{"key":"ref27","doi-asserted-by":"crossref","first-page":"338","DOI":"10.1109\/T-ED.1969.16754","volume":"16","author":"Black","year":"1969","journal-title":"IEEE Trans. Electron Devices"}],"event":{"name":"2023 IEEE 27th Workshop on Signal and Power Integrity (SPI)","start":{"date-parts":[[2023,5,7]]},"location":"Aveiro, Portugal","end":{"date-parts":[[2023,5,10]]}},"container-title":["2023 IEEE 27th Workshop on Signal and Power Integrity (SPI)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10145490\/10145514\/10145530.pdf?arnumber=10145530","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T09:23:45Z","timestamp":1709285025000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10145530\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,5,7]]},"references-count":25,"URL":"https:\/\/doi.org\/10.1109\/spi57109.2023.10145530","relation":{},"subject":[],"published":{"date-parts":[[2023,5,7]]}}}