{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T18:13:05Z","timestamp":1740161585196,"version":"3.37.3"},"reference-count":26,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"9","license":[{"start":{"date-parts":[[2023,9,1]],"date-time":"2023-09-01T00:00:00Z","timestamp":1693526400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,9,1]],"date-time":"2023-09-01T00:00:00Z","timestamp":1693526400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,9,1]],"date-time":"2023-09-01T00:00:00Z","timestamp":1693526400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"European Structural and Investment Funds in the Fundo Europeu de Desenvolvimento Regional (FEDER) Component through the Operational Competitiveness and Internationalization Programme","award":["39479","POCI-01-0247-FEDER-39479"],"award-info":[{"award-number":["39479","POCI-01-0247-FEDER-39479"]}]},{"DOI":"10.13039\/501100001871","name":"FEDER Funds through the COMPETE 2020 Program and National Funds through Funda\u00e7\u00e3o para a Ci\u00eancia e a Tecnologia","doi-asserted-by":"publisher","award":["UIDB\/05256\/2020 (IPC)","UIDP\/05256\/2020 (IPC)","UIDB\/04436\/2020 (CMEMS)","UIDP\/04436\/2020 (CMEMS)"],"award-info":[{"award-number":["UIDB\/05256\/2020 (IPC)","UIDP\/05256\/2020 (IPC)","UIDB\/04436\/2020 (CMEMS)","UIDP\/04436\/2020 (CMEMS)"]}],"id":[{"id":"10.13039\/501100001871","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Compon., Packag. Manufact. Technol."],"published-print":{"date-parts":[[2023,9]]},"DOI":"10.1109\/tcpmt.2023.3312565","type":"journal-article","created":{"date-parts":[[2023,9,6]],"date-time":"2023-09-06T17:30:06Z","timestamp":1694021406000},"page":"1380-1387","source":"Crossref","is-referenced-by-count":1,"title":["Temperature Calibration for Distributed Temperature Sensing of Printed Circuit Boards Using Optical Fiber Sensors"],"prefix":"10.1109","volume":"13","author":[{"given":"Tiago Maur\u00edcio","family":"Leite","sequence":"first","affiliation":[{"name":"BOSCH Car Multimédia, Braga, Portugal"}]},{"given":"Cl\u00e1udia","family":"Freitas","sequence":"additional","affiliation":[{"name":"IPC\/LASI–Institute for Polymers and Composites\/Associated Laboratory of Intelligent Systems, University of Minho, Guimaraes, Portugal"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0067-0886","authenticated-orcid":false,"given":"Roberto","family":"Magalh\u00e3es","sequence":"additional","affiliation":[{"name":"BOSCH Car Multimédia, Braga, Portugal"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0672-2894","authenticated-orcid":false,"given":"Alexandre","family":"Ferreira da Silva","sequence":"additional","affiliation":[{"name":"Department of Industrial Electronics, CMEMS-UMinho, University of Minho, Guimaraes, Portugal"}]},{"given":"Jos\u00e9 Ricardo","family":"Alves","sequence":"additional","affiliation":[{"name":"BOSCH Car Multimédia, Braga, Portugal"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1210-2915","authenticated-orcid":false,"given":"J\u00falio C.","family":"Viana","sequence":"additional","affiliation":[{"name":"IPC\/LASI–Institute for Polymers and Composites\/Associated Laboratory of Intelligent Systems, University of Minho, Guimaraes, Portugal"}]},{"given":"Isabel","family":"Delgado","sequence":"additional","affiliation":[{"name":"BOSCH Car Multimédia, Braga, Portugal"}]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref13","DOI":"10.1109\/IMPACT.2014.7048436"},{"doi-asserted-by":"publisher","key":"ref12","DOI":"10.1109\/TDMR.2009.2023847"},{"doi-asserted-by":"publisher","key":"ref15","DOI":"10.3390\/s18041072"},{"doi-asserted-by":"publisher","key":"ref14","DOI":"10.1088\/0957-0233\/27\/6\/065101"},{"key":"ref11","doi-asserted-by":"crossref","first-page":"8181","DOI":"10.1109\/TIE.2018.2885686","article-title":"Distributed optical fiber sensors for PCB-strain analysis","volume":"66","author":"gomes","year":"2019","journal-title":"IEEE Trans Ind Electron"},{"doi-asserted-by":"publisher","key":"ref10","DOI":"10.1016\/j.optcom.2010.05.037"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1109\/STHERM.2011.5767212"},{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1109\/TCAPT.2003.821685"},{"doi-asserted-by":"publisher","key":"ref17","DOI":"10.1038\/s41598-020-66470-3"},{"doi-asserted-by":"publisher","key":"ref16","DOI":"10.1117\/12.922082"},{"key":"ref19","first-page":"363","article-title":"OFDR distributed temperature and strain measurements with optical fibre sensing cables: Application to drain pipeline monitoring in a nuclear power plant","author":"maurin","year":"2016","journal-title":"Proc 7th Eur Workshop Struct Health Monit"},{"key":"ref18","article-title":"Monitoring distributed temperatures along superconducting degaussing cables via Rayleigh backscattering in optical fibers","author":"boyd","year":"2011","journal-title":"Proc Intell Ships Symp IX"},{"year":"2014","journal-title":"Distributed Fiber Optic Sensing Temperature Coefficient for Polyimide Coated Low Bend Loss Fiber in the ?40 °C to 200 °C Range","key":"ref24"},{"key":"ref23","first-page":"1920","article-title":"Accuracy and survivability of distributed fiber optic temperature sensors","author":"rahim","year":"2015","journal-title":"Proc 53rd AIAA Aerosp Sci Meeting"},{"doi-asserted-by":"publisher","key":"ref26","DOI":"10.1016\/j.porgcoat.2023.107557"},{"year":"2014","journal-title":"Distributed Fiber Optic Sensing Temperature Coefficient for Polyimide Coated Low Bend Loss Fiber in the 10 °C to 80 °C Range","key":"ref25"},{"key":"ref20","first-page":"7249","article-title":"Thermal cycling testing of distributed fiber optic temperature sensors for high-temperature applications","volume":"9","author":"lisowski","year":"2015","journal-title":"Proc 20th Int Top Meeting Nucl Reactor Thermal Hydraul"},{"year":"2017","journal-title":"Optical Distributed Sensor Interrogator","key":"ref22"},{"year":"2020","journal-title":"High-Definition Fiber Optic Strain Sensors","key":"ref21"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1016\/S1068-5200(02)00527-8"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1006\/ofte.1996.0036"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.3390\/s150818666"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1007\/978-3-319-42625-9_9"},{"year":"2002","author":"fartash","journal-title":"Printed circuit board with embedded thermocouple junctions","key":"ref3"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1016\/S0924-4247(99)00368-4"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1109\/JLT.2017.2771748"}],"container-title":["IEEE Transactions on Components, Packaging and Manufacturing Technology"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/5503870\/10287668\/10242096.pdf?arnumber=10242096","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,11,6]],"date-time":"2023-11-06T19:33:18Z","timestamp":1699299198000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10242096\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,9]]},"references-count":26,"journal-issue":{"issue":"9"},"URL":"https:\/\/doi.org\/10.1109\/tcpmt.2023.3312565","relation":{},"ISSN":["2156-3950","2156-3985"],"issn-type":[{"type":"print","value":"2156-3950"},{"type":"electronic","value":"2156-3985"}],"subject":[],"published":{"date-parts":[[2023,9]]}}}