{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,30]],"date-time":"2025-07-30T12:54:27Z","timestamp":1753880067017,"version":"3.41.2"},"reference-count":23,"publisher":"ASME International","issue":"1","license":[{"start":{"date-parts":[[2021,8,6]],"date-time":"2021-08-06T00:00:00Z","timestamp":1628208000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.asme.org\/publications-submissions\/publishing-information\/legal-policies"}],"content-domain":{"domain":["asmedigitalcollection.asme.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2022,3,1]]},"abstract":"<jats:title>Abstract<\/jats:title>\n               <jats:p>One of the most important procedures in the electronics industry is the assembly of electronic components onto printed circuit boards (PCBs) through the soldering process. Among the various soldering methods available, wave soldering is a very effective technique. In this process, the components are placed onto the PCB, which, subsequently, is coated with a flux and then passed across a preheat zone. In the end, the assembly is moved by the conveyor and passed over the surface of the molten solder wave in order to create a reliable connection both mechanically and electrically. Although this process has been frequently used, there are soldering defects that remain unsolved and continue to emerge, such as the missing of surface-mount components in the PCB after the soldering process. Aiming to understand if such defects are related to the force exerted by the solder wave in the PCB, a numerical and experimental study was performed in this article. For this purpose, a computational fluid dynamic model was developed by using the fluent software to describe the interaction between the solder jet and the PCB with the integrated circuits, and the multiphase method, volume of fluid, was also applied to track the solder\u2013air interface boundary. The results obtained were numerically validated by using an experimental setup designed and built to this end. In general, the data obtained showed to be in good agreement and it was concluded that the force exerted by the solder wave is approximately 0.02\u2009N.<\/jats:p>","DOI":"10.1115\/1.4050981","type":"journal-article","created":{"date-parts":[[2021,4,24]],"date-time":"2021-04-24T07:23:57Z","timestamp":1619249037000},"update-policy":"https:\/\/doi.org\/10.1115\/crossmarkpolicy-asme","source":"Crossref","is-referenced-by-count":8,"title":["Numerical Modeling of the Wave Soldering Process and Experimental Validation"],"prefix":"10.1115","volume":"144","author":[{"given":"Violeta","family":"Carvalho","sequence":"first","affiliation":[{"name":"MEtRICs Research Center, Mechanical Engineering Department, University of Minho, Campus de Azur\u00e9m, Guimar\u00e3es 4800-058, Portugal"}]},{"given":"Bruno","family":"Arcipreste","sequence":"additional","affiliation":[{"name":"MEtRICs Research Center, Mechanical Engineering Department, University of Minho, Campus de Azur\u00e9m, Guimar\u00e3es 4800-058, Portugal"}]},{"given":"Delfim","family":"Soares","sequence":"additional","affiliation":[{"name":"CMEMS Research Center, University of Minho, Campus de Azur\u00e9m, Guimar\u00e3es 4800-058, Portugal"}]},{"given":"Lu\u00eds","family":"Ribas","sequence":"additional","affiliation":[{"name":"Bosch Car Multimedia, Braga, Apartado 2458, Portugal"}]},{"given":"Nelson","family":"Rodrigues","sequence":"additional","affiliation":[{"name":"MEtRICs Research Center, Mechanical Engineering Department, University of Minho, Campus de Azur\u00e9m, Guimar\u00e3es 4800-058, Portugal; ALGORITMI Research Center, Production and Systems Department, University of Minho, Campus de Azur\u00e9m, Guimar\u00e3es 4800-058, Portugal"}]},{"given":"Senhorinha F. C. F.","family":"Teixeira","sequence":"additional","affiliation":[{"name":"ALGORITMI Research Center, Production and Systems Department, University of Minho, Campus de Azur\u00e9m, Guimar\u00e3es 4800-058, Portugal"}]},{"given":"Jos\u00e9 Carlos","family":"Teixeira","sequence":"additional","affiliation":[{"name":"MEtRICs Research Center, Mechanical Engineering Department, University of Minho, Campus de Azur\u00e9m, Guimar\u00e3es 4800-058, Portugal"}]}],"member":"33","published-online":{"date-parts":[[2021,8,6]]},"reference":[{"key":"2021080608292602900_bib1","first-page":"81","article-title":"Printed Circuit Board (PCB): Design and Test","year":"2019","journal-title":"Hardware Security: A Hands-on Learning Approach"},{"key":"2021080608292602900_bib2","doi-asserted-by":"crossref","first-page":"400","DOI":"10.1016\/j.ijheatmasstransfer.2014.01.037","article-title":"CFD Modeling of Pin Shape Effects on Capillary Flow During Wave Soldering","volume":"72","year":"2014","journal-title":"Int. J. Heat Mass Transfer"},{"key":"2021080608292602900_bib3","first-page":"112","article-title":"Soldering in Electronics","volume":"112","year":"1990","journal-title":"ASME J. Electron. Packag."},{"edition":"6th ed.","volume-title":"Printed Circuits Handbook","year":"2008","key":"2021080608292602900_bib4"},{"issue":"2","key":"2021080608292602900_bib5","doi-asserted-by":"crossref","first-page":"149","DOI":"10.1115\/1.2905380","article-title":"Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering","volume":"113","year":"1991","journal-title":"ASME J. Electron. Packag."},{"key":"2021080608292602900_bib6","first-page":"308","article-title":"Identification and Chemical Characterization of Particulate Matter From Wave Soldering Processes at a Printed Circuit Board Manufacturing Company","volume":"203\u2013204","year":"2012","journal-title":"J. Hazard. Mater."},{"key":"2021080608292602900_bib7","first-page":"275","article-title":"Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter During Wave Soldering","volume":"6","year":"2014","journal-title":"Adv. Mech. Eng."},{"article-title":"Numerical Modeling of Wave Soldering in PCB","volume-title":"ASME","year":"2014","key":"2021080608292602900_bib8"},{"volume-title":"Handbook of Lead-Free Solder Technology for Microelectronic Assemblies","year":"2005","key":"2021080608292602900_bib9"},{"issue":"3","key":"2021080608292602900_bib10","doi-asserted-by":"crossref","first-page":"184","DOI":"10.1115\/1.2227058","article-title":"A Model for Assessing the Shape of Solder Joints in the Presence of PCB and Package Warpage","volume":"128","year":"2006","journal-title":"ASME J. Electron. Packag."},{"issue":"2","key":"2021080608292602900_bib11","doi-asserted-by":"crossref","first-page":"207","DOI":"10.1115\/1.2792623","article-title":"Fatigue Life Estimation of Solder Joints in SMT-PGA Packages","volume":"120","year":"1998","journal-title":"ASME J. Electron. Packag."},{"issue":"3","key":"2021080608292602900_bib12","doi-asserted-by":"crossref","first-page":"4604","DOI":"10.1016\/j.eswa.2008.05.016","article-title":"Application of Self-Organizing Maps in Analysis of Wave Soldering Process","volume":"36","year":"2009","journal-title":"Expert Syst. Appl."},{"issue":"1","key":"2021080608292602900_bib13","doi-asserted-by":"crossref","first-page":"45","DOI":"10.1115\/1.1401737","article-title":"Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering","volume":"124","year":"2002","journal-title":"ASME J. Electron. Packag."},{"year":"2007","key":"2021080608292602900_bib14","article-title":"Damage Initiation and Evolution in Voided and Unvoided Lead Free Solder Joints Under Cyclic Thermo Mechanical Loading"},{"key":"2021080608292602900_bib15","first-page":"1","article-title":"The Successive-Initiation Modeling Strategy for Modeling Damage Progression: Application to Voided Solder Interconnects","volume-title":"Seventh International Conference Thermal Mechanical and Multiphysics Simulation Experiments in Micro-Electronics and Micro-Systems","year":"2006"},{"key":"2021080608292602900_bib16","doi-asserted-by":"crossref","first-page":"116","DOI":"10.1016\/j.icheatmasstransfer.2013.08.003","article-title":"Influence of Pin Offset in PCB Through-Hole During Wave Soldering Process: CFD Modeling Approach","volume":"48","year":"2013","journal-title":"Int. Commun. Heat Mass Transfer"},{"key":"2021080608292602900_bib17","first-page":"1","article-title":"Effects of Solder Temperature on Pin Through-Hole During Wave Soldering: Thermal-Fluid Structure Interaction Analysis","volume":"2014","year":"2014","journal-title":"Sci. World J."},{"key":"2021080608292602900_bib18","doi-asserted-by":"crossref","first-page":"45","DOI":"10.1016\/j.simpat.2015.06.001","article-title":"Optimization of Pin Through Hole Connector in Thermal Fluid-Structure Interaction Analysis of Wave Soldering Process Using Response Surface Methodology","volume":"57","year":"2015","journal-title":"Simul. Model. Pract. Theory"},{"key":"2021080608292602900_bib19","doi-asserted-by":"crossref","first-page":"13","DOI":"10.1016\/j.finel.2015.08.004","article-title":"Optimisation of Thermo-Fatigue Reliability of Solder Joints in Surface Mount Resistor Assembly Using Taguchi Method","volume":"107","year":"2015","journal-title":"Finite Elem. Anal. Des."},{"issue":"1","key":"2021080608292602900_bib20","doi-asserted-by":"crossref","first-page":"214","DOI":"10.1016\/j.asoc.2009.11.011","article-title":"Quality-Oriented Optimization of Wave Soldering Process by Using Self-Organizing Maps","volume":"11","year":"2011","journal-title":"Appl. Soft Comput. J."},{"volume-title":"An Introduction to Computational Fluid Dynamics, the Finite Volume Method, Second","year":"2007","key":"2021080608292602900_bib21"},{"article-title":"ANSYS\u00ae Fluent User's Guide","year":"2020","author":"ANSYS","key":"2021080608292602900_bib22"},{"article-title":"Optimizing the Wave Soldering Process","volume-title":"Solder Joint Reliability","year":"1991","key":"2021080608292602900_bib23"}],"container-title":["Journal of Electronic Packaging"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/asmedigitalcollection.asme.org\/electronicpackaging\/article-pdf\/144\/1\/011011\/6737617\/ep_144_01_011011.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"syndication"},{"URL":"http:\/\/asmedigitalcollection.asme.org\/electronicpackaging\/article-pdf\/144\/1\/011011\/6737617\/ep_144_01_011011.pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,8,6]],"date-time":"2021-08-06T08:37:21Z","timestamp":1628239041000},"score":1,"resource":{"primary":{"URL":"https:\/\/asmedigitalcollection.asme.org\/electronicpackaging\/article\/144\/1\/011011\/1108155\/Numerical-Modeling-of-the-Wave-Soldering-Process"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,8,6]]},"references-count":23,"journal-issue":{"issue":"1","published-print":{"date-parts":[[2022,3,1]]}},"URL":"https:\/\/doi.org\/10.1115\/1.4050981","relation":{},"ISSN":["1043-7398","1528-9044"],"issn-type":[{"type":"print","value":"1043-7398"},{"type":"electronic","value":"1528-9044"}],"subject":[],"published":{"date-parts":[[2021,8,6]]},"article-number":"011011"}}