{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T12:03:27Z","timestamp":1725451407298},"reference-count":8,"publisher":"ASMEDC","content-domain":{"domain":["asmedigitalcollection.asme.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2005,1,1]]},"abstract":"<jats:p>The increase of processing speed in applications such as servers, laptops and workstations requires heat-sinking technologies with higher levels of power dissipation than the current methods. For this reason, this paper presents an experimental study of heat transfer in water-cooled milli - channel heat sinks. The experimental process consists of fabrication and testing of rectangular plates with multiple parallel channels oriented in the flow direction. Variations in the number of channels, channel diameter, and volumetric flow were considered in order to study the conjugate heat transfer phenomena. Overall heat transfer coefficients in single-phase flow regimes are presented and analyzed.<\/jats:p>","DOI":"10.1115\/imece2005-82438","type":"proceedings-article","created":{"date-parts":[[2008,4,3]],"date-time":"2008-04-03T13:12:30Z","timestamp":1207228350000},"page":"151-155","update-policy":"http:\/\/dx.doi.org\/10.1115\/crossmarkpolicy-asme","source":"Crossref","is-referenced-by-count":0,"title":["Experimental Study of Single-Phase Heat Transfer in Circular Milli-Channels for Cooling of Micro Components"],"prefix":"10.1115","author":[{"given":"Antonio","family":"Ramos","sequence":"first","affiliation":[{"name":"Universidad del Norte"}]},{"given":"Antonio J.","family":"Bula","sequence":"additional","affiliation":[{"name":"Universidad del Norte"}]},{"given":"Maria","family":"Cely","sequence":"additional","affiliation":[{"name":"Universidad del Norte"}]}],"member":"33","published-online":{"date-parts":[[2008,2,5]]},"reference":[{"doi-asserted-by":"crossref","unstructured":"Webb, R., 2004, \u201cNext generation for electronic cooling with heat rejection to air.\u201d Journal of Heat Transfer. Vol 127. No 1. January 2005.","key":"2020010913162776000_r1","DOI":"10.1115\/1.1800512"},{"unstructured":"Ortega, A., 2003, \u201cAir cooling of electronic components: review of research developments in the period 1981-2001 and their impact on our understanding of cooling limits,\u201d 2003 ASME IMECE, Washington D.C. Nov. 2003, paper # IMECE 2003-42412","key":"2020010913162776000_r2"},{"doi-asserted-by":"crossref","unstructured":"Tuckerman\n              D. B.\n            , and PeaseR. F. W., 1981, \u201cHigh performance heat sinking for VLSI,\u201d IEEE Electron Dev. Lett.2, pp. 126\u2013129","key":"2020010913162776000_r3","DOI":"10.1109\/EDL.1981.25367"},{"doi-asserted-by":"crossref","unstructured":"Rahman\n              M. M.\n            \n          , Measurements of heat transfer in micro channel heat sinks, Int. Commun. 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