{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,30]],"date-time":"2025-07-30T12:56:58Z","timestamp":1753880218811,"version":"3.41.2"},"reference-count":0,"publisher":"American Society of Mechanical Engineers","content-domain":{"domain":["asmedigitalcollection.asme.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2015,7,6]]},"abstract":"<jats:p>In the present work two different types of case studies are modelled, carried out involving the fusing of a material using the CFD (Computational Fluid Dynamics) software Ansys Fluent, using the VOF method (Volume of Fluid) to capture the position of the existing interfaces and the Solidification\/melting method which uses an enthalpy-porosity approach to simulate the fusion of the material.<\/jats:p>\n               <jats:p>The first case focus itself in the analysis of fusing process and dropping behavior of the melted plate in the presence of a thermal source. The validation is made using a study found in the bibliography and then using water as the melting material given that its behavior is well known. Then tin is used as the melting material followed by the use of SAC 405 as the melting plate. This study compares various materials properties and verifies the influence of some of these particular properties by changing them (surface tension and heat of fusion).<\/jats:p>\n               <jats:p>The second case focus on the simulation of a geometry obtained at balance at a constant temperature by the SAC 405 soldering alloy in the presence of a component and the copper substrate on top of a PCB.<\/jats:p>","DOI":"10.1115\/ipack2015-48720","type":"proceedings-article","created":{"date-parts":[[2015,11,19]],"date-time":"2015-11-19T09:31:33Z","timestamp":1447925493000},"update-policy":"https:\/\/doi.org\/10.1115\/crossmarkpolicy-asme","source":"Crossref","is-referenced-by-count":2,"title":["Modeling the Reflow Soldering Process in PCB\u2019s"],"prefix":"10.1115","author":[{"given":"Jo\u00e3o","family":"Costa","sequence":"first","affiliation":[{"name":"University of Minho, Guimar\u00e3es, Portugal"}]},{"given":"Delfim","family":"Soares","sequence":"additional","affiliation":[{"name":"University of Minho, Guimar\u00e3es, Portugal"}]},{"given":"Senhorinha F.","family":"Teixeira","sequence":"additional","affiliation":[{"name":"University of Minho, Guimar\u00e3es, Portugal"}]},{"given":"F\u00e1tima","family":"Cerqueira","sequence":"additional","affiliation":[{"name":"University of Minho, Braga, Portugal"}]},{"given":"Francisco","family":"Macedo","sequence":"additional","affiliation":[{"name":"University of Minho, Braga, Portugal"}]},{"given":"Nelson","family":"Rodrigues","sequence":"additional","affiliation":[{"name":"University of Minho, Guimar\u00e3es, Portugal"}]},{"given":"Luis","family":"Ribas","sequence":"additional","affiliation":[{"name":"Bosch Car Multimedia, Braga, Portugal"}]},{"given":"Jos\u00e9 Carlos","family":"Teixeira","sequence":"additional","affiliation":[{"name":"University of Minho, Guimar\u00e3es, Portugal"}]}],"member":"33","published-online":{"date-parts":[[2015,11,19]]},"event":{"name":"ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels","start":{"date-parts":[[2015,7,6]]},"sponsor":["Electronic and Photonic Packaging Division"],"location":"San Francisco, California, USA","end":{"date-parts":[[2015,7,9]]},"acronym":"InterPACK2015"},"container-title":["Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales"],"original-title":[],"link":[{"URL":"http:\/\/asmedigitalcollection.asme.org\/InterPACK\/proceedings-pdf\/doi\/10.1115\/IPACK2015-48720\/2505525\/v002t02a014-ipack2015-48720.pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,9,2]],"date-time":"2019-09-02T09:54:12Z","timestamp":1567418052000},"score":1,"resource":{"primary":{"URL":"https:\/\/asmedigitalcollection.asme.org\/InterPACK\/proceedings\/InterPACK2015\/56895\/San%20Francisco,%20California,%20USA\/265205"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,7,6]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1115\/ipack2015-48720","relation":{},"subject":[],"published":{"date-parts":[[2015,7,6]]},"article-number":"V002T02A014"}}