{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,10]],"date-time":"2026-07-10T15:27:24Z","timestamp":1783697244415,"version":"3.55.0"},"reference-count":30,"publisher":"American Association for the Advancement of Science (AAAS)","issue":"23","funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52388201"],"award-info":[{"award-number":["52388201"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012166","name":"National key R&D program of China","doi-asserted-by":"crossref","award":["2025YFF0520300"],"award-info":[{"award-number":["2025YFF0520300"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"crossref"}]}],"content-domain":{"domain":["www.science.org"],"crossmark-restriction":true},"short-container-title":["Sci. Adv."],"published-print":{"date-parts":[[2026,6,5]]},"abstract":"<jats:p>Size effects are ubiquitous in the structural, mechanical, and physical properties of materials, making it highly desirable to study the intrinsic properties of thick objects through high-resolution structural analysis in transmission electron microscopy. Although deep-subangstrom resolution has been achieved with multislice electron ptychography, the sample thickness is typically very limited. By combining energy filtering and extended local-orbital ptychography (eLOP) that retrieves varying aberrations during electron beam scanning, here, we report ptychographic reconstructions for silicon as thick as 85\u00a0nanometers, approximately three times larger than usual thickness threshold for conventional multislice electron ptychography. The elimination of aberration variations contributes to accurate reconstructions with an information limit of 18\u00a0picometers and atomic position precision of 0.39\u00a0picometers. Accurate ptychographic reconstructions for thick objects can facilitate the discovery or interpretation of intrinsic structural and physical phenomena in solids, which is of great importance in physics, chemistry, materials science, and semiconductor device engineering.<\/jats:p>","DOI":"10.1126\/sciadv.aec9348","type":"journal-article","created":{"date-parts":[[2026,6,3]],"date-time":"2026-06-03T17:59:03Z","timestamp":1780509543000},"update-policy":"https:\/\/doi.org\/10.34133\/aaas_crossmark","source":"Crossref","is-referenced-by-count":1,"title":["Imaging thick objects with deep-subangstrom resolution and deep-subpicometer precision"],"prefix":"10.1126","volume":"12","author":[{"ORCID":"https:\/\/orcid.org\/0009-0003-5074-2731","authenticated-orcid":true,"given":"Wenfeng","family":"Yang","sequence":"first","affiliation":[{"name":"School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China."},{"name":"MOE Key Laboratory of Advanced Materials, Tsinghua University, Beijing 100084, China."},{"name":"State Key Laboratory of New Ceramics and Fine Processing, Tsinghua University, Beijing 100084, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9543-923X","authenticated-orcid":true,"given":"Haozhi","family":"Sha","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China."},{"name":"MOE Key Laboratory of Advanced Materials, Tsinghua University, Beijing 100084, China."},{"name":"State Key Laboratory of New Ceramics and Fine Processing, Tsinghua University, Beijing 100084, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4639-0502","authenticated-orcid":true,"given":"Jizhe","family":"Cui","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China."},{"name":"MOE Key Laboratory of Advanced Materials, Tsinghua University, Beijing 100084, China."},{"name":"State Key Laboratory of New Ceramics and Fine Processing, Tsinghua University, Beijing 100084, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1687-3597","authenticated-orcid":true,"given":"Rong","family":"Yu","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China."},{"name":"MOE Key Laboratory of Advanced Materials, Tsinghua University, Beijing 100084, China."},{"name":"State Key Laboratory of New Ceramics and Fine Processing, Tsinghua University, Beijing 100084, China."}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"221","reference":[{"key":"e_1_3_2_2_2","doi-asserted-by":"crossref","unstructured":"D. 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Cui H. Sha L. Mao K. Sun W. Yang R. Yu Imaging counting and positioning single interstitial atoms in solids. arXiv:2405.18164 [cond-mat.mtrl-sci] (2024)."},{"key":"e_1_3_2_24_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-023-44268-x"},{"key":"e_1_3_2_25_2","doi-asserted-by":"publisher","DOI":"10.1364\/OE.24.008360"},{"key":"e_1_3_2_26_2","doi-asserted-by":"publisher","DOI":"10.1107\/S0365110X57002194"},{"key":"e_1_3_2_27_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.ultramic.2014.10.011"},{"key":"e_1_3_2_28_2","unstructured":"W. Yang R. Yu Phase evolution of the object function [video] Zenodo (2025); 10.5281\/zenodo.15379693."},{"key":"e_1_3_2_29_2","doi-asserted-by":"publisher","DOI":"10.1016\/0304-3991(94)90092-2"},{"key":"e_1_3_2_30_2","doi-asserted-by":"publisher","DOI":"10.1016\/S0304-3991(97)00102-2"},{"key":"e_1_3_2_31_2","unstructured":"W. Yang R. Yu Datasets used for eLOP [dataset] Zenodo (2025); 10.5281\/zenodo.13989515."}],"container-title":["Science Advances"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.science.org\/doi\/pdf\/10.1126\/sciadv.aec9348","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,3]],"date-time":"2026-06-03T18:00:15Z","timestamp":1780509615000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.science.org\/doi\/10.1126\/sciadv.aec9348"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,6,5]]},"references-count":30,"journal-issue":{"issue":"23","published-print":{"date-parts":[[2026,6,5]]}},"alternative-id":["10.1126\/sciadv.aec9348"],"URL":"https:\/\/doi.org\/10.1126\/sciadv.aec9348","relation":{},"ISSN":["2375-2548"],"issn-type":[{"value":"2375-2548","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,6,5]]},"assertion":[{"value":"2025-10-09","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2026-04-24","order":2,"name":"accepted","label":"Accepted","group":{"name":"publication_history","label":"Publication History"}},{"value":"2026-06-03","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}],"article-number":"eaec9348"}}