{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,15]],"date-time":"2026-10-15T12:30:05Z","timestamp":1792067405527,"version":"4.4.0"},"reference-count":56,"publisher":"American Association for the Advancement of Science (AAAS)","issue":"24","funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52427809"],"award-info":[{"award-number":["52427809"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52375568"],"award-info":[{"award-number":["52375568"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52525502"],"award-info":[{"award-number":["52525502"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["www.science.org"],"crossmark-restriction":true},"short-container-title":["Sci. Adv."],"published-print":{"date-parts":[[2026,6,12]]},"abstract":"<jats:p>Precise, highly spatial resolution surface pressure measurement is critical for reliable state assessment of unmanned systems, such as the flight safety of unmanned aerial vehicles. Conventionally, the acquisition of such high-resolution data requires dense, expensive sensing arrays or relies on external computational resources. Here, we introduce a flexible electronic skin featuring a sparse sensing network integrated with in-sensor numerical hyperdimensional computing, thereby facilitating super-resolution sensing and in-sensor learning. This innovative approach processes sparse inputs to produce high-resolution pressure field maps on-device, enabling rapid real-time analysis and precise flight state identification. The numerical hyperdimensional computing enhances the efficiency of in-sensor learning, overcoming the limitations of conventional vector symbolic architectures previously confined to classification tasks. Furthermore, the integration of hyperdimensional computing substantially boosts the performance of the flexible sensing skin. Compared to the computer-aided super-resolution method, our approach reduces power consumption from ~40\u00a0watts to ~0.09\u00a0milliwatts, memory usage from ~2274 to ~32 kilobytes, and latency from ~115 to ~10\u00a0milliseconds, respectively. The achieved super-resolution capability reaches an enhancement factor of 5.517. Compared with conventional high-density sensing arrays, our approach reduces the number of interconnects by 91.5% (using a 4 by 4 array). Last, the developed super-resolution skin is applied in unmanned aerial vehicle flight control.<\/jats:p>","DOI":"10.1126\/sciadv.aee4065","type":"journal-article","created":{"date-parts":[[2026,6,12]],"date-time":"2026-06-12T17:58:47Z","timestamp":1781287127000},"update-policy":"https:\/\/doi.org\/10.34133\/aaas_crossmark","source":"Crossref","is-referenced-by-count":3,"title":["Flexible, super-resolution skin with in-sensor hyperdimensional computing for real-time pressure field perception"],"prefix":"10.1126","volume":"12","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-3658-9887","authenticated-orcid":true,"given":"Fan","family":"Zhang","sequence":"first","affiliation":[{"name":"State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Research Center for Advanced Electronics Manufacturing, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5179-9105","authenticated-orcid":true,"given":"Zhangyu","family":"Xu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Research Center for Advanced Electronics Manufacturing, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4598-8377","authenticated-orcid":true,"given":"Chao","family":"Hou","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Research Center for Advanced Electronics Manufacturing, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4785-5025","authenticated-orcid":true,"given":"Lang","family":"Yin","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Research Center for Advanced Electronics Manufacturing, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mengfei","family":"Yin","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Research Center for Advanced Electronics Manufacturing, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-1078-8119","authenticated-orcid":true,"given":"Mingyan","family":"Lian","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Research Center for Advanced Electronics Manufacturing, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-3094-1341","authenticated-orcid":true,"given":"Wei","family":"He","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Research Center for Advanced Electronics Manufacturing, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shuchuan","family":"Li","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Research Center for Advanced Electronics Manufacturing, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0005-3436-734X","authenticated-orcid":true,"given":"Pengyu","family":"Cheng","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Research Center for Advanced Electronics Manufacturing, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7713-8380","authenticated-orcid":true,"given":"YongAn","family":"Huang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Research Center for Advanced Electronics Manufacturing, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China."},{"name":"Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China."}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"221","reference":[{"key":"e_1_3_2_2_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-021-03847-y"},{"key":"e_1_3_2_3_2","first-page":"100752","article-title":"AI-assisted flexible electronics in humanoid robot heads for natural and authentic facial expressions","volume":"6","author":"Dai N.","year":"2025","unstructured":"N. Dai, K. Zhang, F. Zhang, J. Li, J. Zhong, Y. Huang, H. Ding, AI-assisted flexible electronics in humanoid robot heads for natural and authentic facial expressions. Innovation 6, 100752 (2025).","journal-title":"Innovation"},{"key":"e_1_3_2_4_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-020-03153-z"},{"key":"e_1_3_2_5_2","doi-asserted-by":"publisher","DOI":"10.1115\/1.4056303"},{"key":"e_1_3_2_6_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-021-03625-w"},{"key":"e_1_3_2_7_2","doi-asserted-by":"publisher","DOI":"10.1002\/adma.202201962"},{"key":"e_1_3_2_8_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-019-1424-8"},{"key":"e_1_3_2_9_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-024-53517-6"},{"key":"e_1_3_2_10_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-023-38486-6"},{"key":"e_1_3_2_11_2","doi-asserted-by":"crossref","unstructured":"T. Topac C. Gray F.-K. Chang \u201cFly-by-feel: Learning aerodynamics from multimodal wing mechanics \u201d in AIAA SCITECH 2024 Forum (American Institute of Aeronautics and Astronautics 2024) pp. 2024\u20132403; https:\/\/arc.aiaa.org\/doi\/10.2514\/6.2024-2403.","DOI":"10.2514\/6.2024-2403"},{"key":"e_1_3_2_12_2","doi-asserted-by":"publisher","DOI":"10.1007\/s11431-020-1793-0"},{"key":"e_1_3_2_13_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-024-51415-5"},{"key":"e_1_3_2_14_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-024-49864-z"},{"key":"e_1_3_2_15_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.nanoen.2021.106550"},{"key":"e_1_3_2_16_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-024-47284-7"},{"key":"e_1_3_2_17_2","doi-asserted-by":"publisher","DOI":"10.1002\/aisy.202100276"},{"key":"e_1_3_2_18_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41528-025-00434-3"},{"key":"e_1_3_2_19_2","doi-asserted-by":"publisher","DOI":"10.1007\/s11431-020-1642-4"},{"key":"e_1_3_2_20_2","doi-asserted-by":"publisher","DOI":"10.1089\/soro.2023.0173"},{"key":"e_1_3_2_21_2","doi-asserted-by":"publisher","DOI":"10.1109\/TMECH.2023.3269036"},{"key":"e_1_3_2_22_2","doi-asserted-by":"publisher","DOI":"10.20517\/ss.2023.15"},{"key":"e_1_3_2_23_2","doi-asserted-by":"publisher","DOI":"10.20517\/ss.2023.09"},{"key":"e_1_3_2_24_2","doi-asserted-by":"publisher","DOI":"10.1126\/sciadv.adi6633"},{"key":"e_1_3_2_25_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-019-1234-z"},{"key":"e_1_3_2_26_2","first-page":"8","article-title":"Progress on flexible tactile sensors in robotic applications on objects properties recognition, manipulation and human-machine interactions","volume":"3","author":"Jin J.","year":"2023","unstructured":"J. Jin, S. Wang, Z. Zhang, D. Mei, Y. Wang, Progress on flexible tactile sensors in robotic applications on objects properties recognition, manipulation and human-machine interactions. Soft Sci. 3, 8 (2023).","journal-title":"Soft Sci."},{"key":"e_1_3_2_27_2","doi-asserted-by":"publisher","DOI":"10.1177\/14759217231161812"},{"key":"e_1_3_2_28_2","doi-asserted-by":"publisher","DOI":"10.3390\/s19020275"},{"key":"e_1_3_2_29_2","doi-asserted-by":"publisher","DOI":"10.34133\/research.0154"},{"key":"e_1_3_2_30_2","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2020.2988236"},{"key":"e_1_3_2_31_2","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2024.3423434"},{"key":"e_1_3_2_32_2","doi-asserted-by":"publisher","DOI":"10.1126\/scirobotics.abc8801"},{"key":"e_1_3_2_33_2","doi-asserted-by":"publisher","DOI":"10.1126\/scirobotics.abm0608"},{"key":"e_1_3_2_34_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41528-024-00325-z"},{"key":"e_1_3_2_35_2","doi-asserted-by":"publisher","DOI":"10.1126\/sciadv.adf8831"},{"key":"e_1_3_2_36_2","doi-asserted-by":"publisher","DOI":"10.1126\/sciadv.adr1099"},{"key":"e_1_3_2_37_2","doi-asserted-by":"publisher","DOI":"10.1126\/scirobotics.abm7187"},{"key":"e_1_3_2_38_2","doi-asserted-by":"publisher","DOI":"10.1089\/soro.2017.0052"},{"key":"e_1_3_2_39_2","doi-asserted-by":"publisher","DOI":"10.1007\/s11431-023-2622-x"},{"key":"e_1_3_2_40_2","doi-asserted-by":"publisher","DOI":"10.1017\/jfm.2024.1202"},{"key":"e_1_3_2_41_2","doi-asserted-by":"publisher","DOI":"10.1017\/jfm.2020.1028"},{"key":"e_1_3_2_42_2","doi-asserted-by":"publisher","DOI":"10.1038\/s42256-025-01063-1"},{"key":"e_1_3_2_43_2","doi-asserted-by":"publisher","DOI":"10.1038\/s42256-023-00746-x"},{"key":"e_1_3_2_44_2","doi-asserted-by":"publisher","DOI":"10.1126\/science.aau0780"},{"key":"e_1_3_2_45_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-025-60911-1"},{"key":"e_1_3_2_46_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-020-00510-8"},{"key":"e_1_3_2_47_2","doi-asserted-by":"publisher","DOI":"10.1109\/MCAS.2023.3302182"},{"key":"e_1_3_2_48_2","doi-asserted-by":"publisher","DOI":"10.34133\/research.0497"},{"key":"e_1_3_2_49_2","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2022.3209104"},{"key":"e_1_3_2_50_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-025-63881-6"},{"key":"e_1_3_2_51_2","first-page":"1","article-title":"A survey on hyperdimensional computing aka vector symbolic architectures, part II: Applications, cognitive models, and challenges","volume":"55","author":"Kleyko D.","year":"2022","unstructured":"D. Kleyko, D. A. Rachkovskij, E. Osipov, A. Rahimi, A survey on hyperdimensional computing aka vector symbolic architectures, part II: Applications, cognitive models, and challenges. ACM Comput Surv 55, 1\u201352 (2022).","journal-title":"ACM Comput Surv"},{"key":"e_1_3_2_52_2","doi-asserted-by":"publisher","DOI":"10.1038\/s42256-023-00630-8"},{"key":"e_1_3_2_53_2","doi-asserted-by":"publisher","DOI":"10.1109\/MCAS.2020.2988388"},{"key":"e_1_3_2_54_2","unstructured":"J. Lin W.-M. Chen H. Cai C. Gan S. Han \u201cMCUNetV2: Memory-efficient patch-based inference for tiny deep learning \u201d in Advances in Neural Information Processing Systems (Curran Associates Inc. 2021) vol. 34 pp. 2346\u20132358; https:\/\/papers.nips.cc\/paper\/2021\/hash\/1371bccec2447b5aa6d96d2a540fb401-Abstract.html."},{"key":"e_1_3_2_55_2","doi-asserted-by":"publisher","DOI":"10.1126\/sciadv.adv2124"},{"key":"e_1_3_2_56_2","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.202003491"},{"key":"e_1_3_2_57_2","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.202214119"}],"container-title":["Science Advances"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.science.org\/doi\/pdf\/10.1126\/sciadv.aee4065","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,12]],"date-time":"2026-06-12T18:00:09Z","timestamp":1781287209000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.science.org\/doi\/10.1126\/sciadv.aee4065"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,6,12]]},"references-count":56,"journal-issue":{"issue":"24","published-print":{"date-parts":[[2026,6,12]]}},"alternative-id":["10.1126\/sciadv.aee4065"],"URL":"https:\/\/doi.org\/10.1126\/sciadv.aee4065","relation":{},"ISSN":["2375-2548"],"issn-type":[{"value":"2375-2548","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,6,12]]},"assertion":[{"value":"2025-12-02","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2026-04-30","order":2,"name":"accepted","label":"Accepted","group":{"name":"publication_history","label":"Publication History"}},{"value":"2026-06-12","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}],"article-number":"eaee4065"}}