{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T18:00:40Z","timestamp":1648836040949},"reference-count":8,"publisher":"World Scientific Pub Co Pte Lt","issue":"03","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["J CIRCUIT SYST COMP"],"published-print":{"date-parts":[[2007,6]]},"abstract":"<jats:p> A novel logic family, called Split-Level Charge-Sharing Differential Logic (SCSDL), is proposed in this letter. The SCSDL uses the charge recycling technique to reduce power dissipation of differential logic in the precharge phase. The simulation results show that the SCSDL has the best power-delay product compared to several other differential logic families. An eight-bit carry lookahead adder (CLA) designed using the proposed SCSDL can reduce at least 30.64% of power-delay product compared to DCVSL CLA dissipation. A test chip was fabricated to illustrate the feasibility of the SCSDL circuit. <\/jats:p>","DOI":"10.1142\/s0218126607003733","type":"journal-article","created":{"date-parts":[[2007,10,11]],"date-time":"2007-10-11T10:04:36Z","timestamp":1192097076000},"page":"389-402","source":"Crossref","is-referenced-by-count":0,"title":["LOW-POWER EIGHT-BIT SCSDL CLA WITH A NOVEL SPLIT-LEVEL CHARGE-SHARING DIFFERENTIAL LOGIC (SCSDL)"],"prefix":"10.1142","volume":"16","author":[{"given":"ROBERT C.","family":"CHANG","sequence":"first","affiliation":[{"name":"Department of Electrical Engineering, National Chung Hsing University, Taichung City 402, Taiwan, ROC"}]},{"given":"HSIN-LEI","family":"LIN","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Chung Hsing University, Taichung City 402, Taiwan, ROC"}]},{"given":"I-HAO","family":"WANG","sequence":"additional","affiliation":[{"name":"Lite-On Technology Corporation, Hsin Chu City 300, Taiwan, ROC"}]}],"member":"219","published-online":{"date-parts":[[2011,11,21]]},"reference":[{"key":"rf2","doi-asserted-by":"publisher","DOI":"10.1109\/4.354"},{"key":"rf3","doi-asserted-by":"publisher","DOI":"10.1109\/4.508212"},{"key":"rf4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1987.1052767"},{"key":"rf5","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4615-5573-5"},{"key":"rf6","first-page":"1267","volume":"21","author":"Kong B.-S.","journal-title":"IEEE J. Solid-State Circuits"},{"key":"rf7","doi-asserted-by":"publisher","DOI":"10.1109\/4.766829"},{"key":"rf9","doi-asserted-by":"publisher","DOI":"10.1109\/92.736130"},{"key":"rf11","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4615-2355-0"}],"container-title":["Journal of Circuits, Systems and Computers"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.worldscientific.com\/doi\/pdf\/10.1142\/S0218126607003733","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,8,7]],"date-time":"2019-08-07T03:41:33Z","timestamp":1565149293000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.worldscientific.com\/doi\/abs\/10.1142\/S0218126607003733"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2007,6]]},"references-count":8,"journal-issue":{"issue":"03","published-online":{"date-parts":[[2011,11,21]]},"published-print":{"date-parts":[[2007,6]]}},"alternative-id":["10.1142\/S0218126607003733"],"URL":"https:\/\/doi.org\/10.1142\/s0218126607003733","relation":{},"ISSN":["0218-1266","1793-6454"],"issn-type":[{"value":"0218-1266","type":"print"},{"value":"1793-6454","type":"electronic"}],"subject":[],"published":{"date-parts":[[2007,6]]}}}