{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,4,5]],"date-time":"2022-04-05T14:06:21Z","timestamp":1649167581962},"reference-count":8,"publisher":"World Scientific Pub Co Pte Lt","issue":"01","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["J CIRCUIT SYST COMP"],"published-print":{"date-parts":[[2012,2]]},"abstract":"<jats:p> With the increasing deployment of Wi-Fi devices in portable embedded systems, the low power design at system level has attracted considerable research attention in the recent past. In this paper, based on hardware features and software architecture of the embedded Wi-Fi devices, we focus on dynamic power management, dynamic frequency scaling, and their influences upon the system power and performance. We propose effective and realizable system power management solution and application modes under various application requirements, such as response, bandwidth, and speed. Experimental results show that the proposed solutions can achieve significant energy savings. <\/jats:p>","DOI":"10.1142\/s021812661250003x","type":"journal-article","created":{"date-parts":[[2012,3,8]],"date-time":"2012-03-08T10:51:29Z","timestamp":1331203889000},"page":"1250003","source":"Crossref","is-referenced-by-count":1,"title":["INTELLIGENT POWER MANAGEMENT FOR EMBEDDED WI-FI DEVICES"],"prefix":"10.1142","volume":"21","author":[{"given":"WEIYIN","family":"HONG","sequence":"first","affiliation":[{"name":"Department of Computer Science and Technology, East China Normal University, Shanghai, China"}]},{"given":"XIN","family":"KUANG","sequence":"additional","affiliation":[{"name":"Department of Computer Science and Technology, East China Normal University, Shanghai, China"}]},{"given":"JIANHUA","family":"SHEN","sequence":"additional","affiliation":[{"name":"Department of Computer Science and Technology, East China Normal University, Shanghai, China"}]},{"given":"TONGQUAN","family":"WEI","sequence":"additional","affiliation":[{"name":"Department of Computer Science and Technology, East China Normal University, Shanghai, China"}]}],"member":"219","published-online":{"date-parts":[[2012,4,7]]},"reference":[{"key":"p_1","doi-asserted-by":"publisher","DOI":"10.1109\/5.964439"},{"key":"p_2","doi-asserted-by":"publisher","DOI":"10.1109\/4.126534"},{"key":"p_5","doi-asserted-by":"publisher","DOI":"10.1109\/98.683740"},{"key":"p_8","first-page":"41","author":"Das S.","year":"2006","journal-title":"J. Solid-State Circuits"},{"key":"p_9","first-page":"316","volume":"8","author":"Benini L.","year":"2000","journal-title":"IEEE Trans. Very Large Scale Integr. (VLSI) Syst."},{"key":"p_12","doi-asserted-by":"publisher","DOI":"10.1109\/43.766730"},{"key":"p_14","first-page":"1232","volume":"25","author":"Chandra S.","year":"2009","journal-title":"IEEE Trans. Very Large Scale Integr. (VLSI) Syst."},{"key":"p_18","first-page":"719","volume":"56","author":"Hwang Y. S.","year":"2010","journal-title":"IEEE Trans. Consumer Electron."}],"container-title":["Journal of Circuits, Systems and Computers"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.worldscientific.com\/doi\/pdf\/10.1142\/S021812661250003X","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,8,7]],"date-time":"2019-08-07T05:01:09Z","timestamp":1565154069000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.worldscientific.com\/doi\/abs\/10.1142\/S021812661250003X"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,2]]},"references-count":8,"journal-issue":{"issue":"01","published-online":{"date-parts":[[2012,4,7]]},"published-print":{"date-parts":[[2012,2]]}},"alternative-id":["10.1142\/S021812661250003X"],"URL":"https:\/\/doi.org\/10.1142\/s021812661250003x","relation":{},"ISSN":["0218-1266","1793-6454"],"issn-type":[{"value":"0218-1266","type":"print"},{"value":"1793-6454","type":"electronic"}],"subject":[],"published":{"date-parts":[[2012,2]]}}}