{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,7,3]],"date-time":"2024-07-03T12:36:22Z","timestamp":1720010182615},"reference-count":1,"publisher":"World Scientific Pub Co Pte Lt","issue":"10","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["J CIRCUIT SYST COMP"],"published-print":{"date-parts":[[2013,12]]},"abstract":"<jats:p> A low power readout integrated circuit (ROIC) for 512 \u00d7 512 cooled infrared focal plane array (IRFPA) is presented. A capacitive trans-impedance amplifier (CTIA) with high gain cascode amplifier and inherent correlated double sampling (CDS) configuration is employed to achieve a high performance readout interface for the IRFPA with a pixel size of 30 \u00d7 30 \u03bcm<jats:sup>2<\/jats:sup>. By optimizing column readout timing and using two operating modes in column amplifiers, the power consumption is significantly reduced. The readout chip is implemented in a standard 0.35 \u03bcm 2P4M CMOS technology. The measurement results show the proposed ROIC achieves a readout rate of 10 MHz with 70 mW power consumption under 3.3 V supply voltage from 77 K to 150 K operating temperature. And it occupies a chip area of 18.4 \u00d7 17.5 mm<jats:sup>2<\/jats:sup>. <\/jats:p>","DOI":"10.1142\/s0218126613400331","type":"journal-article","created":{"date-parts":[[2013,11,11]],"date-time":"2013-11-11T09:03:41Z","timestamp":1384160621000},"page":"1340033","source":"Crossref","is-referenced-by-count":4,"title":["A LOW POWER CRYOGENIC CMOS ROIC DESIGN FOR 512 \u00d7 512 IRFPA"],"prefix":"10.1142","volume":"22","author":[{"given":"HONGLIANG","family":"ZHAO","sequence":"first","affiliation":[{"name":"School of Electronic Information Engineering, Tianjin University, Tianjin 300072, China"},{"name":"College of Physics, Liaoning University, Shenyang 110036, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"YIQIANG","family":"ZHAO","sequence":"additional","affiliation":[{"name":"School of Electronic Information Engineering, Tianjin University, Tianjin 300072, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"YIWEI","family":"SONG","sequence":"additional","affiliation":[{"name":"School of Electronic Information Engineering, Tianjin University, Tianjin 300072, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"JUN","family":"LIAO","sequence":"additional","affiliation":[{"name":"School of Electronic Information Engineering, Tianjin University, Tianjin 300072, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"JUNFENG","family":"GENG","sequence":"additional","affiliation":[{"name":"School of Electronic Information Engineering, Tianjin University, Tianjin 300072, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"219","published-online":{"date-parts":[[2014,1]]},"reference":[{"key":"rf7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2007.908873"}],"container-title":["Journal of Circuits, Systems and Computers"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.worldscientific.com\/doi\/pdf\/10.1142\/S0218126613400331","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,8,6]],"date-time":"2019-08-06T21:18:32Z","timestamp":1565126312000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.worldscientific.com\/doi\/abs\/10.1142\/S0218126613400331"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,12]]},"references-count":1,"journal-issue":{"issue":"10","published-online":{"date-parts":[[2014,1]]},"published-print":{"date-parts":[[2013,12]]}},"alternative-id":["10.1142\/S0218126613400331"],"URL":"https:\/\/doi.org\/10.1142\/s0218126613400331","relation":{},"ISSN":["0218-1266","1793-6454"],"issn-type":[{"value":"0218-1266","type":"print"},{"value":"1793-6454","type":"electronic"}],"subject":[],"published":{"date-parts":[[2013,12]]}}}