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These complex embedded systems are also expected to perform under minimum power and energy consumptions. In this paper, we present efficient techniques for low-energy and thermal-aware schedules that meet the deadlines under chip reliability constraints. The presented techniques under different objective functions are implemented and executed on multiple embedded applications under multiple underlying system architectures to show the performance and efficiency of the techniques. <\/jats:p>","DOI":"10.1142\/s0218126620501352","type":"journal-article","created":{"date-parts":[[2019,9,18]],"date-time":"2019-09-18T08:43:52Z","timestamp":1568796232000},"page":"2050135","source":"Crossref","is-referenced-by-count":3,"title":["Energy-Aware Schedules Under Chip Reliability Constraint for Multi-Processor Systems-on-a-Chip"],"prefix":"10.1142","volume":"29","author":[{"given":"Hassan","family":"Salamy","sequence":"first","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Saint Thomas, 2115 Summit Avenue, St. Paul, MN 55105, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"219","published-online":{"date-parts":[[2019,10,29]]},"reference":[{"key":"S0218126620501352BIB001","doi-asserted-by":"publisher","DOI":"10.1002\/cpe.2899"},{"key":"S0218126620501352BIB002","doi-asserted-by":"publisher","DOI":"10.1016\/j.sysarc.2017.09.007"},{"key":"S0218126620501352BIB003","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2007.915477"},{"key":"S0218126620501352BIB005","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2883993"},{"key":"S0218126620501352BIB006","doi-asserted-by":"publisher","DOI":"10.1145\/774789.774817"},{"key":"S0218126620501352BIB007","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2501286"},{"key":"S0218126620501352BIB008","doi-asserted-by":"publisher","DOI":"10.1109\/ICPADS.2005.219"},{"key":"S0218126620501352BIB009","doi-asserted-by":"publisher","DOI":"10.1007\/s10617-007-9004-9"},{"key":"S0218126620501352BIB010","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2007.364540"},{"key":"S0218126620501352BIB011","doi-asserted-by":"publisher","DOI":"10.1145\/859618.859620"},{"key":"S0218126620501352BIB012","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"S0218126620501352BIB013","doi-asserted-by":"publisher","DOI":"10.1007\/s11265-006-9760-y"},{"key":"S0218126620501352BIB014","first-page":"183","volume-title":"39th Conf. 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