{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,7]],"date-time":"2026-03-07T18:31:04Z","timestamp":1772908264435,"version":"3.50.1"},"reference-count":20,"publisher":"World Scientific Pub Co Pte Lt","issue":"11","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["J CIRCUIT SYST COMP"],"published-print":{"date-parts":[[2020,9,15]]},"abstract":"<jats:p> Due to the winding level of the thinned wafers and the surface roughness of silicon dies, the quality of through-silicon vias (TSVs) varies during the fabrication and bonding process. If one TSV exhibits a defect during its manufacturing process, the probability of multiple defects occurring in the TSVs neighboring increases the faulty TSVs (FTSV), i.e., the TSV defects tend to be clustered which significantly reduces the yield of three-dimensional integrated circuits (3D-ICs). To resolve the clustered TSV faults, router-based and ring-based redundant TSV (RTSV) architecture were proposed. However, the repair rate is low and the hardware overhead is high. In this paper, we propose a novel cross-cellular based RTSV architecture to utilize the area more efficiently as well as to maintain high yield. The simulation results show that the proposed architecture has higher repair rate as well as more cost-effective overhead, compared with router-based and ring-based methods. <\/jats:p>","DOI":"10.1142\/s0218126620501443","type":"journal-article","created":{"date-parts":[[2019,11,20]],"date-time":"2019-11-20T03:22:08Z","timestamp":1574220128000},"page":"2050144","source":"Crossref","is-referenced-by-count":2,"title":["CC-RTSV: Cross-Cellular Based Redundant TSV Design for 3D ICs"],"prefix":"10.1142","volume":"29","author":[{"given":"Tianming","family":"Ni","sequence":"first","affiliation":[{"name":"College of Electrical Engineering, Anhui Polytechnic University, Key Laboratory of Advanced Perception and Intelligent Control of High-end Equipment, Ministry of Education, Wuhu, Anhui 241000, P.\u00a0R.\u00a0China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yue","family":"Shu","sequence":"additional","affiliation":[{"name":"School of Electronic Science & Applied Physics, Hefei University of Technology, Hefei, Anhui 230009, P. 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China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hao","family":"Chang","sequence":"additional","affiliation":[{"name":"The Department of Computer Science and Technology, Anhui University of Finance and Economics, Bengbu, Anhui 233030, P.\u00a0R.\u00a0China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lin","family":"Lu","sequence":"additional","affiliation":[{"name":"College of Electrical Engineering, Anhui Polytechnic University, Key Laboratory of Advanced Perception and Intelligent Control of High-end Equipment, Ministry of Education, Wuhu, Anhui 241000, P.\u00a0R.\u00a0China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Guangzhen","family":"Dai","sequence":"additional","affiliation":[{"name":"College of Electrical Engineering, Anhui Polytechnic University, Key Laboratory of Advanced Perception and Intelligent Control of High-end Equipment, Ministry of Education, Wuhu, Anhui 241000, P.\u00a0R.\u00a0China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shidong","family":"Zhu","sequence":"additional","affiliation":[{"name":"College of Electrical Engineering, Anhui Polytechnic University, Key Laboratory of Advanced Perception and Intelligent Control of High-end Equipment, Ministry of Education, Wuhu, Anhui 241000, P.\u00a0R.\u00a0China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chengming","family":"Qu","sequence":"additional","affiliation":[{"name":"College of Electrical Engineering, Anhui Polytechnic University, Key Laboratory of Advanced Perception and Intelligent Control of High-end Equipment, Ministry of Education, Wuhu, Anhui 241000, P.\u00a0R.\u00a0China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhengfeng","family":"Huang","sequence":"additional","affiliation":[{"name":"The Department of Computer Science and Technology, Anhui University of Finance and Economics, Bengbu, Anhui 233030, P.\u00a0R.\u00a0China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"219","published-online":{"date-parts":[[2019,12,27]]},"reference":[{"key":"S0218126620501443BIB001","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2821559"},{"key":"S0218126620501443BIB002","doi-asserted-by":"publisher","DOI":"10.1587\/transele.E100.C.1108"},{"key":"S0218126620501443BIB003","first-page":"793","volume-title":"Proc. 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