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At 32[Formula: see text]nm technology, a CMOS-based coupled driver-via-load (DVL) setup is introduced wherein each via is represented an equivalent RLGC model of MIS- and MES-based TSV shapes. The proposed electrical model accurately considers the impact of micro bump and inter-metal dielectric (IMD) effects at 32[Formula: see text]nm technology as per the fabrication house. A 3D electromagnetic (EM) structural wave simulation is performed to validate the RLGC model parameters of different TSV structures for an operating frequency of up to 20[Formula: see text]GHz. The proposed DVL setup is used to analyze the propagation delay, power dissipation, and dynamic crosstalk for different MIS- and MES-based TSV shapes. A significant improvement in the cross-coupling behavior can be obtained using the MES-based tapered TSV compared to the other MIS structures. Additionally, the power delay product (PDP) of the tapered MES is reduced by 92.4% compared to the conventional MIS-based cylindrical TSV.<\/jats:p>","DOI":"10.1142\/s0218126621500511","type":"journal-article","created":{"date-parts":[[2020,6,6]],"date-time":"2020-06-06T14:37:40Z","timestamp":1591454260000},"page":"2150051","source":"Crossref","is-referenced-by-count":19,"title":["Role of Through Silicon Via in 3D Integration: Impact on Delay and Power"],"prefix":"10.1142","volume":"30","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-3744-6917","authenticated-orcid":false,"given":"Shivangi","family":"Chandrakar","sequence":"first","affiliation":[{"name":"Department of Electronics and Communication Engineering, Dr. Shyama Prasad Mukherjee International Institute of Information Technology, Naya Raipur, Chhattisgarh \u2013 493661, India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Deepika","family":"Gupta","sequence":"additional","affiliation":[{"name":"Department of Electronics and Communication Engineering, Dr. Shyama Prasad Mukherjee International Institute of Information Technology, Naya Raipur, Chhattisgarh \u2013 493661, India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Manoj Kumar","family":"Majumder","sequence":"additional","affiliation":[{"name":"Department of Electronics and Communication Engineering, Dr. Shyama Prasad Mukherjee International Institute of Information Technology, Naya Raipur, Chhattisgarh \u2013 493661, India"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"219","published-online":{"date-parts":[[2020,9,4]]},"reference":[{"key":"S0218126621500511BIB001","first-page":"211","volume-title":"Microprocessor Design Using 3D Integration Technology","author":"Xie Y.","year":"2011"},{"key":"S0218126621500511BIB003","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.136"},{"key":"S0218126621500511BIB004","doi-asserted-by":"publisher","DOI":"10.1109\/N-SSC.2006.4785860"},{"key":"S0218126621500511BIB006","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898709"},{"key":"S0218126621500511BIB007","first-page":"1","volume-title":"Proc. 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