{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,30]],"date-time":"2025-07-30T14:09:43Z","timestamp":1753884583182,"version":"3.41.2"},"reference-count":38,"publisher":"World Scientific Pub Co Pte Ltd","issue":"11","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["J CIRCUIT SYST COMP"],"published-print":{"date-parts":[[2022,7,30]]},"abstract":"<jats:p> With China\u2019s economic transformation into a high-quality development stage, the importance of credit system construction has become increasingly prominent. The problems existing in the current telecom credit system include: (1) insufficient coverage of credit features; (2) traditional credit assessment models are difficult to reflect user credit status objectively, comprehensively and timely; (3) user demand for credit management and credit services are ignored. Due to these deficiencies, a new multi-level credit system is necessary to meet the rapid development of market economy. Telecom operators have large amount of precious data, with the advantages of large-scale, high-precision and data-diversity, which can provide new ideas for the construction of credit system. This work focuses on the current problems and conducts research as follows: design a Telecom Credit Assessment Model based on Boosting and Stacking ensemble techniques, called TCAMBS, to improve the evaluation accuracy, and to select the best model according to the experimental results. On the one hand, this work can promote the innovation of telecom credit assessment models and provide new ideas for the construction of the credit system. On the other hand, this work will also help telecom operations to improve the quality of telecom credit services. <\/jats:p>","DOI":"10.1142\/s0218126622501973","type":"journal-article","created":{"date-parts":[[2022,4,11]],"date-time":"2022-04-11T12:41:20Z","timestamp":1649680880000},"source":"Crossref","is-referenced-by-count":0,"title":["TCA: Telecom Credit Assessment Assisted by Edge Intelligence"],"prefix":"10.1142","volume":"31","author":[{"given":"Hao","family":"Hu","sequence":"first","affiliation":[{"name":"Hainan Digital Grid Research Institute, China Southern Power Grid, No. 32, Haifu Road, Haikou 570204, P.\u00a0R.\u00a0China"}]},{"given":"Xu","family":"Du","sequence":"additional","affiliation":[{"name":"Hainan Digital Grid Research Institute, China Southern Power Grid, No. 32, Haifu Road, Haikou 570204, P.\u00a0R.\u00a0China"}]},{"given":"Feier","family":"Qiu","sequence":"additional","affiliation":[{"name":"Chengdu Software R&D Center, Postal Savings Bank of China, Chengdu 610094, P.\u00a0R.\u00a0China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7831-9615","authenticated-orcid":false,"given":"Shiwei","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Information and Safety Engineering, Zhongnan University of Economics and Law, No. 82, Nanhu Avenue, Wuhan 430073, P.\u00a0R.\u00a0China"}]}],"member":"219","published-online":{"date-parts":[[2022,4,8]]},"reference":[{"key":"S0218126622501973BIB001","doi-asserted-by":"publisher","DOI":"10.1016\/j.inffus.2021.11.018"},{"key":"S0218126622501973BIB002","doi-asserted-by":"publisher","DOI":"10.26599\/BDMA.2018.9020020"},{"key":"S0218126622501973BIB003","doi-asserted-by":"publisher","DOI":"10.1109\/MWC.2019.1800401"},{"key":"S0218126622501973BIB004","doi-asserted-by":"publisher","DOI":"10.1109\/TFUZZ.2021.3130311"},{"key":"S0218126622501973BIB005","doi-asserted-by":"publisher","DOI":"10.1109\/TNSE.2020.2990963"},{"key":"S0218126622501973BIB006","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2019.2936792"},{"key":"S0218126622501973BIB007","doi-asserted-by":"publisher","DOI":"10.1109\/TMM.2018.2882744"},{"key":"S0218126622501973BIB008","doi-asserted-by":"publisher","DOI":"10.1093\/wber\/lhz006"},{"key":"S0218126622501973BIB009","doi-asserted-by":"publisher","DOI":"10.1109\/TITS.2020.2990214"},{"key":"S0218126622501973BIB010","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2019.2908056"},{"journal-title":"IEEE Trans. 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