{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,30]],"date-time":"2025-07-30T13:06:34Z","timestamp":1753880794689,"version":"3.41.2"},"reference-count":31,"publisher":"World Scientific Pub Co Pte Ltd","issue":"11","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["J CIRCUIT SYST COMP"],"published-print":{"date-parts":[[2023,7,30]]},"abstract":"<jats:p> In this paper, a third-order, high selectivity Substrate Integrated Waveguide (SIW) bandpass filter (BPF) loaded with Circular Complementary Split-Ring Resonator (CCSRR) is proposed for C band applications. The SIW cavity BPF comprises two stepped resonators ([Formula: see text] and [Formula: see text]) and one CSRR ([Formula: see text]) engraved on the top metal plate. Initially, the cavity loaded with stepped resonators ([Formula: see text] and [Formula: see text]) alone does not make a good selectivity on the lower out of band. Hence, the CCSRR is introduced between the stepped resonators ([Formula: see text] and [Formula: see text]) to improve the filter\u2019s selectivity and enhance the filter\u2019s bandwidth. The introduction of CCSRR enhances the selectivity on the lower out-of-band at 5.5[Formula: see text]GHz, and the extra pole increases the bandwidth. The metamaterial behavior of CCSRR is validated by permittivity extraction. The 3[Formula: see text]dB bandwidth of the third-order SIW filter is 840 MHz with a center frequency of 6.18[Formula: see text]GHz. The designed filter uses RTDuroid 5880 substrate of [Formula: see text] = 2.2 with a size of 28.4 \u00d7 28.4 \u00d7 0.51[Formula: see text]mm<jats:sup>3<\/jats:sup>. The proposed filter measurement and simulated results agree with each other. <\/jats:p>","DOI":"10.1142\/s0218126623501906","type":"journal-article","created":{"date-parts":[[2022,12,14]],"date-time":"2022-12-14T10:00:46Z","timestamp":1671012046000},"source":"Crossref","is-referenced-by-count":3,"title":["High Selectivity, Dual-Mode Substrate Integrated Waveguide Cavity Bandpass Filter Loaded Using CCSRR"],"prefix":"10.1142","volume":"32","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-8840-598X","authenticated-orcid":false,"given":"N.","family":"Praveena","sequence":"first","affiliation":[{"name":"National Institute of Technology Tiruchirappalli, Tiruchirappalli, India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"N.","family":"Gunavathi","sequence":"additional","affiliation":[{"name":"National Institute of Technology Tiruchirappalli, Tiruchirappalli, India"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"219","published-online":{"date-parts":[[2023,1,25]]},"reference":[{"key":"S0218126623501906BIB001","doi-asserted-by":"crossref","first-page":"593","DOI":"10.1109\/TMTT.2002.807820","volume":"51","author":"Deslandes D.","year":"2003","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"S0218126623501906BIB002","doi-asserted-by":"crossref","first-page":"345","DOI":"10.1109\/JMW.2020.3034379","volume":"1","author":"Wu K.","year":"2021","journal-title":"IEEE J. Microw."},{"key":"S0218126623501906BIB003","unstructured":"G. L. Matthaei,  E. M. T. Jones and  L. Young ,  Microwave Filters, Impedance-Matching Networks, and Coupling Structures (Artech House,  Norwood, MA,  1980), pp. 217\u2013228."},{"key":"S0218126623501906BIB004","doi-asserted-by":"crossref","first-page":"467","DOI":"10.1002\/mop.29599","volume":"58","author":"Gunavathi N.","year":"2016","journal-title":"Microw. Opt. Technol. Lett."},{"key":"S0218126623501906BIB005","doi-asserted-by":"crossref","first-page":"787","DOI":"10.1109\/LMWC.2005.859021","volume":"15","author":"Chen X. P.","year":"2005","journal-title":"IEEE Microw. Wireless Compon. Lett."},{"key":"S0218126623501906BIB006","doi-asserted-by":"crossref","first-page":"834","DOI":"10.1007\/s00339-021-04978-9","volume":"127","author":"Kumar A.","year":"2021","journal-title":"Appl. Phys. A"},{"key":"S0218126623501906BIB007","first-page":"3395","volume":"69","author":"Kumar A.","year":"2022","journal-title":"IEEE Trans. Circuits Syst. II, Express Briefs"},{"key":"S0218126623501906BIB008","doi-asserted-by":"crossref","first-page":"2968","DOI":"10.1109\/TMTT.2005.854232","volume":"53","author":"Hao Z. C.","year":"2005","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"S0218126623501906BIB009","doi-asserted-by":"crossref","first-page":"1233","DOI":"10.1049\/el.2016.1517","volume":"52","author":"Liu Q.","year":"2016","journal-title":"Electron. Lett."},{"key":"S0218126623501906BIB010","doi-asserted-by":"crossref","first-page":"824","DOI":"10.1109\/TMTT.2016.2633346","volume":"65","author":"Chu P.","year":"2017","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"S0218126623501906BIB011","doi-asserted-by":"crossref","first-page":"368","DOI":"10.1109\/LMWC.2009.2020017","volume":"19","author":"Shen W.","year":"2009","journal-title":"IEEE Microw. Wireless Compon. Lett."},{"key":"S0218126623501906BIB012","doi-asserted-by":"crossref","first-page":"3071","DOI":"10.1109\/TMTT.2012.2209437","volume":"60","author":"Gong K.","year":"2012","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"S0218126623501906BIB013","doi-asserted-by":"crossref","first-page":"667","DOI":"10.1109\/TMTT.2009.2013290","volume":"57","author":"Wang H.","year":"2009","journal-title":"IEEE Trans. Microw. Theory Tech."},{"first-page":"1","volume-title":"IEEE Electrical Design of Advanced Package and Systems Symp.","author":"Wu L.","key":"S0218126623501906BIB014"},{"key":"S0218126623501906BIB015","doi-asserted-by":"crossref","first-page":"2211","DOI":"10.1109\/TMTT.2009.2027156","volume":"57","author":"Dong Y. D.","year":"2009","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"S0218126623501906BIB016","doi-asserted-by":"crossref","first-page":"311","DOI":"10.1109\/LMWC.2018.2811251","volume":"28","author":"Zhang H.","year":"2018","journal-title":"IEEE Microw. Wireless Compon. Lett."},{"key":"S0218126623501906BIB017","doi-asserted-by":"crossref","first-page":"266","DOI":"10.1109\/TMTT.2013.2294861","volume":"62","author":"Chu P.","year":"2014","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"S0218126623501906BIB018","first-page":"2051","volume":"69","author":"Lin G.","year":"2022","journal-title":"IEEE Trans. Circuits Syst. II, Express Briefs"},{"key":"S0218126623501906BIB019","doi-asserted-by":"crossref","first-page":"777","DOI":"10.1109\/LMWC.2009.2033497","volume":"19","author":"Wu L. S.","year":"2009","journal-title":"IEEE Microw. Wireless Compon. Lett."},{"key":"S0218126623501906BIB020","doi-asserted-by":"crossref","first-page":"305","DOI":"10.1109\/LMWC.2018.2808408","volume":"28","author":"Shen W.","year":"2018","journal-title":"IEEE Microw. Wireless Compon. Lett."},{"key":"S0218126623501906BIB021","doi-asserted-by":"crossref","first-page":"1099","DOI":"10.1109\/TCPMT.2016.2574562","volume":"6","author":"Liu Z.","year":"2016","journal-title":"IEEE Trans. Compon. Packag. Manuf. Technol."},{"key":"S0218126623501906BIB022","doi-asserted-by":"crossref","first-page":"036617","DOI":"10.1103\/PhysRevE.71.036617","volume":"71","author":"Smith D. R.","year":"2005","journal-title":"Phys. Rev. E"},{"volume-title":"Electromagnetic Metamaterials: Transmission Line Theory and Microwave Applications","year":"2005","author":"Itoh T.","key":"S0218126623501906BIB023"},{"journal-title":"IEEE Trans. Circuits Syst. II, Express Briefs","year":"2022","author":"Reddy A.","key":"S0218126623501906BIB024"},{"volume-title":"Microstrip Filters for RF\/Microwave Applications","year":"2004","author":"Hong J. S. G.","key":"S0218126623501906BIB025"},{"key":"S0218126623501906BIB026","first-page":"32","volume":"67","author":"Su Z. L.","year":"2020","journal-title":"IEEE Trans. Circuits Syst. II, Express Briefs"},{"key":"S0218126623501906BIB027","volume-title":"Microwave Engineering","author":"Pozar D. M.","year":"2005","edition":"3"},{"key":"S0218126623501906BIB028","doi-asserted-by":"crossref","first-page":"79","DOI":"10.2528\/PIERL21091301","volume":"101","author":"Soundarya G.","year":"2021","journal-title":"Prog. Electromagn. Res. Lett."},{"key":"S0218126623501906BIB029","first-page":"2883","volume":"67","author":"Xie H. W.","year":"2020","journal-title":"IEEE Trans. Circuits Syst. II, Express Briefs"},{"key":"S0218126623501906BIB030","doi-asserted-by":"crossref","first-page":"654","DOI":"10.1109\/LMWC.2018.2842678","volume":"28","author":"Li M.","year":"2018","journal-title":"IEEE Microw. Wireless Compon. Lett."},{"key":"S0218126623501906BIB031","doi-asserted-by":"crossref","first-page":"894","DOI":"10.1017\/S1759078719000679","volume":"11","author":"Geng Q. F.","year":"2019","journal-title":"Int. J. Microw. Wireless Technol."}],"container-title":["Journal of Circuits, Systems and Computers"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.worldscientific.com\/doi\/pdf\/10.1142\/S0218126623501906","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,7,8]],"date-time":"2023-07-08T07:32:44Z","timestamp":1688801564000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.worldscientific.com\/doi\/10.1142\/S0218126623501906"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,1,25]]},"references-count":31,"journal-issue":{"issue":"11","published-print":{"date-parts":[[2023,7,30]]}},"alternative-id":["10.1142\/S0218126623501906"],"URL":"https:\/\/doi.org\/10.1142\/s0218126623501906","relation":{},"ISSN":["0218-1266","1793-6454"],"issn-type":[{"type":"print","value":"0218-1266"},{"type":"electronic","value":"1793-6454"}],"subject":[],"published":{"date-parts":[[2023,1,25]]},"article-number":"2350190"}}