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In this paper, analysis models of PCBs thermal performance are built based on the principles of fluid mechanics and the finite element method, and we obtain the influence and analysis of internal heat sources on PCBs thermal performance. The study provides a theoretical basis for PCBs thermal reliability design which can be applied to high-density Internet of Things and blockchain ICT integration. <\/jats:p>","DOI":"10.1142\/s0218126623502250","type":"journal-article","created":{"date-parts":[[2023,1,31]],"date-time":"2023-01-31T02:14:40Z","timestamp":1675131280000},"source":"Crossref","is-referenced-by-count":4,"title":["Thermal Performance Analysis and Prediction of Printed Circuit Boards"],"prefix":"10.1142","volume":"32","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-5518-9208","authenticated-orcid":false,"given":"Yi","family":"Wan","sequence":"first","affiliation":[{"name":"Department of Computer Science and Engineering, Shaoxing University, Shaoxing, 312000, P. R. 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