{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,30]],"date-time":"2025-07-30T13:07:12Z","timestamp":1753880832083,"version":"3.41.2"},"reference-count":25,"publisher":"World Scientific Pub Co Pte Ltd","issue":"17","funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["Grant U23A20291"],"award-info":[{"award-number":["Grant U23A20291"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Notional Natural Science Foundation of China","award":["Grant 62021004"],"award-info":[{"award-number":["Grant 62021004"]}]},{"name":"National Key Research and Development Program of China","award":["Grant 2023YFF0616600"],"award-info":[{"award-number":["Grant 2023YFF0616600"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["J CIRCUIT SYST COMP"],"published-print":{"date-parts":[[2024,11,30]]},"abstract":"<jats:p> High-performance three-dimensional integrated circuits (3D ICs) are now severely constrained by the thermal issue resulting from the high-power density and limited thermal conductivity among vertically stacked chips. The power distribution networks (PDNs) in 3D ICs are composed of good thermal conductors, but several existing methods are unable to demonstrate their heat dissipation effect successfully, and the thermal models of 3D ICs currently used are either incomplete or have significant errors. In this paper, the Adaptive Unit Difference Iterative (AUDI) method is proposed to establish the equivalent thermal model which can characterize the temperature distribution of 3D ICs accurately. Compared with the simulation results from the Finite Element Method (FEM) tool, the proposed model improves the computational efficiency greatly, and the error in temperature responses is within 3%. The model is used to analyze the effect of 3D PDNs parameters on temperature characteristics and the priority of temperature optimization is indicated, which is of significance for the thermal design. <\/jats:p>","DOI":"10.1142\/s0218126624503092","type":"journal-article","created":{"date-parts":[[2024,6,21]],"date-time":"2024-06-21T08:40:41Z","timestamp":1718959241000},"source":"Crossref","is-referenced-by-count":0,"title":["Thermal Modeling and Analysis of 3D ICS with Heat Dissipation Effect of Power Distribution Networks"],"prefix":"10.1142","volume":"33","author":[{"ORCID":"https:\/\/orcid.org\/0009-0006-0648-153X","authenticated-orcid":false,"given":"Yinghao","family":"Feng","sequence":"first","affiliation":[{"name":"School of Microelectronics, Xidian University, No. 2 South Taibai Road, Xi\u2019an 710071, P. R. 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