{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,4,4]],"date-time":"2022-04-04T02:49:32Z","timestamp":1649040572494},"reference-count":2,"publisher":"World Scientific Pub Co Pte Lt","issue":"02","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Int. J. Comp. Eng. Sci."],"published-print":{"date-parts":[[2003,6]]},"DOI":"10.1142\/s1465876303000971","type":"journal-article","created":{"date-parts":[[2004,2,6]],"date-time":"2004-02-06T03:46:30Z","timestamp":1076039190000},"page":"235-238","source":"Crossref","is-referenced-by-count":0,"title":["FLIP-CHIP PACKAGED MICRO-PLATE FOR LOW COST THERMAL MULTIPLEXING"],"prefix":"10.1142","volume":"04","author":[{"given":"YUBO","family":"MIAO","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"CHONG SER","family":"CHONG","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"TAICHONG","family":"CHAI","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"YU","family":"CHEN","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"QUANBO","family":"ZOU","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"TIE","family":"YAN","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"CHEW KIAT","family":"HENG","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"TIT MENG","family":"LIM","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"219","reference":[{"key":"p_2","first-page":"5939312","author":"Volker Baier","year":"1999","journal-title":"USpatent"},{"key":"p_4","first-page":"6521447","author":"Quanbo Zou","year":"2003","journal-title":"USpatent"}],"container-title":["International Journal of Computational Engineering Science"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/www.worldscientific.com\/doi\/pdf\/10.1142\/S1465876303000971","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2016,12,1]],"date-time":"2016-12-01T17:15:56Z","timestamp":1480612556000},"score":1,"resource":{"primary":{"URL":"http:\/\/www.worldscientific.com\/doi\/abs\/10.1142\/S1465876303000971"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2003,6]]},"references-count":2,"journal-issue":{"issue":"02","published-print":{"date-parts":[[2003,6]]}},"alternative-id":["10.1142\/S1465876303000971"],"URL":"https:\/\/doi.org\/10.1142\/s1465876303000971","relation":{},"ISSN":["1465-8763"],"issn-type":[{"value":"1465-8763","type":"print"}],"subject":[],"published":{"date-parts":[[2003,6]]}}}