{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,3,29]],"date-time":"2022-03-29T16:45:01Z","timestamp":1648572301002},"reference-count":1,"publisher":"World Scientific Pub Co Pte Lt","issue":"02","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Int. J. Comp. Eng. Sci."],"published-print":{"date-parts":[[2003,6]]},"DOI":"10.1142\/s1465876303001216","type":"journal-article","created":{"date-parts":[[2004,2,5]],"date-time":"2004-02-05T22:46:30Z","timestamp":1076021190000},"page":"335-338","source":"Crossref","is-referenced-by-count":3,"title":["HERMETIC PACKAGING OF MEMS WITH THICK ELECTRODES BY  SILICON-GLASS ANODIC BONDING"],"prefix":"10.1142","volume":"04","author":[{"given":"YUFENG","family":"JIN","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"JUN","family":"WEI","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"PECK CHENG","family":"LIM","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"ZHENFENG","family":"WANG","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"219","reference":[{"key":"rf2","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(97)80290-7"}],"container-title":["International Journal of Computational Engineering Science"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/www.worldscientific.com\/doi\/pdf\/10.1142\/S1465876303001216","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2016,12,1]],"date-time":"2016-12-01T12:16:37Z","timestamp":1480594597000},"score":1,"resource":{"primary":{"URL":"http:\/\/www.worldscientific.com\/doi\/abs\/10.1142\/S1465876303001216"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2003,6]]},"references-count":1,"journal-issue":{"issue":"02","published-print":{"date-parts":[[2003,6]]}},"alternative-id":["10.1142\/S1465876303001216"],"URL":"https:\/\/doi.org\/10.1142\/s1465876303001216","relation":{},"ISSN":["1465-8763"],"issn-type":[{"value":"1465-8763","type":"print"}],"subject":[],"published":{"date-parts":[[2003,6]]}}}