{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T04:58:02Z","timestamp":1750309082703,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":9,"publisher":"ACM","license":[{"start":{"date-parts":[[2005,4,2]],"date-time":"2005-04-02T00:00:00Z","timestamp":1112400000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2005,4,2]]},"DOI":"10.1145\/1053355.1053359","type":"proceedings-article","created":{"date-parts":[[2005,8,3]],"date-time":"2005-08-03T08:31:47Z","timestamp":1123057907000},"page":"7-12","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":2,"title":["Prediction of delay time for future LSI using on-chip transmission line interconnects"],"prefix":"10.1145","author":[{"given":"Takumi","family":"Uezono","sequence":"first","affiliation":[{"name":"Tokyo Institute of Technology"}]},{"given":"Junpei","family":"Inoue","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology"}]},{"given":"Takanori","family":"Kyogoku","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology"}]},{"given":"Kenichi","family":"Okada","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology"}]},{"given":"Kazuya","family":"Masu","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology"}]}],"member":"320","published-online":{"date-parts":[[2005,4,2]]},"reference":[{"key":"e_1_3_2_1_1_1","unstructured":"ITRS\n  : http:\/\/public.itrs.net\/Files\/2003ITRS\/Home2003.htm.  ITRS: http:\/\/public.itrs.net\/Files\/2003ITRS\/Home2003.htm."},{"key":"e_1_3_2_1_2_1","volume-title":"Circuits, Intreconnections, and Pack-aging for VLSI. Reading","author":"Bakoglu H. B.","year":"1990","unstructured":"H. B. Bakoglu . Circuits, Intreconnections, and Pack-aging for VLSI. Reading . MA : Addision-Wesley , 1990 . H. B. Bakoglu. Circuits, Intreconnections, and Pack-aging for VLSI. Reading. MA: Addision-Wesley, 1990."},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1109\/55.144942"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/16.661219"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2004.1358811"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1145\/1120725.1120789"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2004.1419258"},{"key":"e_1_3_2_1_8_1","article-title":"High density differential transmission line structure on si ulsi","author":"Ito H.","year":"2004","unstructured":"H. Ito , K. Nakamura , K. Okada , and K. Masu . High density differential transmission line structure on si ulsi . IEICE Trans. on Electronics, (6):942--948 , 2004 . H. Ito, K. Nakamura, K. Okada, and K. Masu. High density differential transmission line structure on si ulsi. IEICE Trans. on Electronics, (6):942--948, 2004.","journal-title":"IEICE Trans. on Electronics, (6):942--948"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1109\/16.902722"}],"event":{"name":"SLIP05: International Workshop on System Level Interconnect Prediction","sponsor":["ACM Association for Computing Machinery","SIGDA ACM Special Interest Group on Design Automation"],"location":"San Francisco California USA","acronym":"SLIP05"},"container-title":["Proceedings of the 2005 international workshop on System level interconnect prediction"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1053355.1053359","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/1053355.1053359","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T22:43:28Z","timestamp":1750286608000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1053355.1053359"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2005,4,2]]},"references-count":9,"alternative-id":["10.1145\/1053355.1053359","10.1145\/1053355"],"URL":"https:\/\/doi.org\/10.1145\/1053355.1053359","relation":{},"subject":[],"published":{"date-parts":[[2005,4,2]]},"assertion":[{"value":"2005-04-02","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}