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In this article, we evaluate the performance and reliability of nanotube bundles for both local and global interconnect in future VLSI applications. To provide a holistic evaluation of SWCNT bundles for on-chip interconnect, we have developed an efficient equivalent circuit model that captures the statistical distribution of individual metallic and semiconducting nanotubes while accurately incorporating recent experimental and theoretical results on inductance, contact resistance, and ohmic resistance. Leveraging the circuit model, we examine the performance and reliability of nanotube bundles for both individual signal lines and system-level designs. SWCNT interconnect bundles can provide significant improvement in delay and maximum current density over traditional copper interconnect, depending on bundle geometry and process technology. However, for system-level designs, the statistical variation in the delay of SWCNT bundles may lead to reliability issues in future process technology. Consequently, if the SWCNT chirality can be effectively controlled and other manufacturing challenges are met, SWCNT bundles potentially are a viable alternative to standard copper interconnect as process technology scales.<\/jats:p>","DOI":"10.1145\/1167943.1167944","type":"journal-article","created":{"date-parts":[[2007,1,16]],"date-time":"2007-01-16T19:38:29Z","timestamp":1168976309000},"page":"155-196","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":93,"title":["Modeling and design challenges and solutions for carbon nanotube-based interconnect in future high performance integrated circuits"],"prefix":"10.1145","volume":"2","author":[{"given":"Yehia","family":"Massoud","sequence":"first","affiliation":[{"name":"Rice University, Houston, TX"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Arthur","family":"Nieuwoudt","sequence":"additional","affiliation":[{"name":"Rice University, Houston, TX"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2006,7]]},"reference":[{"volume-title":"Proceedings of the International Symposium on Quality Electronic Design. 419--424","author":"Acar E.","key":"e_1_2_1_1_1"},{"volume-title":"Proceedings of the IEEE\/ACM Design Automation Conference. 381--384","author":"Agarwal K.","key":"e_1_2_1_2_1"},{"volume-title":"Proceedings of the 46th IEEE Midwest Symposium on Circuits and Systems. 1510--1513","author":"Anis M.","key":"e_1_2_1_3_1"},{"key":"e_1_2_1_4_1","first-page":"11","article-title":"Carbon nanotube electronics","volume":"91","author":"Avouris P.","year":"2003","journal-title":"Proceedings of the IEEE"},{"volume-title":"Proceedings of the IEEE\/ACM Design Automation Conference. 58--63","author":"Bai X.","key":"e_1_2_1_5_1"},{"key":"e_1_2_1_6_1","doi-asserted-by":"crossref","first-page":"787","DOI":"10.1126\/science.1060928","article-title":"Carbon nanotubes\u00f2-The route toward applications","volume":"297","author":"Baughman R. 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