{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,27]],"date-time":"2026-02-27T03:46:20Z","timestamp":1772163980834,"version":"3.50.1"},"publisher-location":"New York, NY, USA","reference-count":59,"publisher":"ACM","license":[{"start":{"date-parts":[[2007,6,9]],"date-time":"2007-06-09T00:00:00Z","timestamp":1181347200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2007,6,9]]},"DOI":"10.1145\/1250662.1250693","type":"proceedings-article","created":{"date-parts":[[2007,9,14]],"date-time":"2007-09-14T12:07:37Z","timestamp":1189771657000},"page":"244-253","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":9,"title":["Architectural implications of brick and mortar silicon manufacturing"],"prefix":"10.1145","author":[{"given":"Martha Mercaldi","family":"Kim","sequence":"first","affiliation":[{"name":"University of Washington, Seattle, WA"}]},{"given":"Mojtaba","family":"Mehrara","sequence":"additional","affiliation":[{"name":"University of Michigan, Ann Arbor, MI"}]},{"given":"Mark","family":"Oskin","sequence":"additional","affiliation":[{"name":"University of Washington, Seattle, WA"}]},{"given":"Todd","family":"Austin","sequence":"additional","affiliation":[{"name":"University of Michigan, Ann Arbor, MI"}]}],"member":"320","published-online":{"date-parts":[[2007,6,9]]},"reference":[{"key":"e_1_3_2_1_1_1","volume-title":"A bare-chip probe for high I\/O, high speed testing","author":"Alan Barber H. O.","year":"1994","unstructured":"H. O. Alan Barber , Ken Lee . A bare-chip probe for high I\/O, high speed testing . 1994 . H. O. Alan Barber, Ken Lee. A bare-chip probe for high I\/O, high speed testing. 1994."},{"key":"e_1_3_2_1_2_1","unstructured":"Alien technology website. www.alientechnology.com.  Alien technology website. www.alientechnology.com."},{"key":"e_1_3_2_1_3_1","unstructured":"Altera website. www.altera.com.  Altera website. www.altera.com."},{"key":"e_1_3_2_1_4_1","unstructured":"Ambric Inc. website. www.ambric.com.  Ambric Inc. website. www.ambric.com."},{"key":"e_1_3_2_1_5_1","unstructured":"AMI semiconductor website. www.amis.com.  AMI semiconductor website. www.amis.com."},{"key":"e_1_3_2_1_6_1","unstructured":"Amkor technology website. www.amkor.com.  Amkor technology website. www.amkor.com."},{"key":"e_1_3_2_1_7_1","unstructured":"Artisan website. www.artisan.org.  Artisan website. www.artisan.org."},{"key":"e_1_3_2_1_8_1","volume-title":"The promise of structured ASIC","author":"Ball R.","year":"2004","unstructured":"R. Ball . The promise of structured ASIC . Oct 2004 . www.electronicsweekly.com. R. Ball. The promise of structured ASIC. Oct 2004. www.electronicsweekly.com."},{"key":"e_1_3_2_1_9_1","volume-title":"Economic challenges on the path to 22 nm","author":"Brown K.","year":"2004","unstructured":"K. Brown . Economic challenges on the path to 22 nm . June 2004 . www.future-fab.com. K. Brown. Economic challenges on the path to 22 nm. June 2004. www.future-fab.com."},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1109\/T-C.1971.223159"},{"key":"e_1_3_2_1_11_1","volume-title":"FPGA gap","author":"Bursky D.","year":"2006","unstructured":"D. Bursky . Arrays narrow platform ASIC , FPGA gap . July 2006 . www.eetimes.com. D. Bursky. Arrays narrow platform ASIC, FPGA gap. July 2006. www.eetimes.com."},{"key":"e_1_3_2_1_12_1","unstructured":"ChipX website. www.chipx.com.  ChipX website. www.chipx.com."},{"key":"e_1_3_2_1_13_1","volume-title":"Template-directed self-assembly of 10-micron-sized hexagonal plates. 124","author":"Clark T.","year":"2002","unstructured":"T. Clark , R. Ferrigno , and Template-directed self-assembly of 10-micron-sized hexagonal plates. 124 , 2002 . T. Clark, R. Ferrigno, and et al. Template-directed self-assembly of 10-micron-sized hexagonal plates. 124, 2002."},{"key":"e_1_3_2_1_14_1","unstructured":"Cradle technologies website. www.cradle.com.  Cradle technologies website. www.cradle.com."},{"key":"e_1_3_2_1_15_1","unstructured":"Cswitch website. www.cswitch.com.  Cswitch website. www.cswitch.com."},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1109\/ASYNC.2005.26"},{"key":"e_1_3_2_1_17_1","unstructured":"eASIC website. www.easic.com.  eASIC website. www.easic.com."},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.5555\/647923.741212"},{"key":"e_1_3_2_1_19_1","volume-title":"et. al. Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. 49","author":"J. U.","year":"2005","unstructured":"J. U. K. et. al. Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. 49 , 2005 . J. U. K. et. al. Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. 49, 2005."},{"key":"e_1_3_2_1_20_1","volume-title":"et al. 1.27gb\/s\/pin 3mw\/pin wireless superconnect (wsc) interface scheme","author":"K.","year":"2003","unstructured":"K. K. et al. 1.27gb\/s\/pin 3mw\/pin wireless superconnect (wsc) interface scheme . 2003 . K. K. et al. 1.27gb\/s\/pin 3mw\/pin wireless superconnect (wsc) interface scheme. 2003."},{"key":"e_1_3_2_1_21_1","volume-title":"Known good die: A practical solution","author":"Agahdel R. F.","year":"1993","unstructured":"R. F. Agahdel , C. Ho . Known good die: A practical solution . Apr 1993 . R. F. Agahdel, C. Ho. Known good die: A practical solution. Apr 1993."},{"key":"e_1_3_2_1_22_1","volume-title":"Wafer level packaging based on uniquely orienting self-assembly (the DUO-SPASS processes). 15","author":"Fang J.","year":"2006","unstructured":"J. Fang and K. F. B\u00f6hringer . Wafer level packaging based on uniquely orienting self-assembly (the DUO-SPASS processes). 15 , 2006 . J. Fang and K. F. B\u00f6hringer. Wafer level packaging based on uniquely orienting self-assembly (the DUO-SPASS processes). 15, 2006."},{"key":"e_1_3_2_1_23_1","unstructured":"Faraday electronics website. www.faradayelectronics.com.  Faraday electronics website. www.faradayelectronics.com."},{"key":"e_1_3_2_1_24_1","unstructured":"Fujitsu website. www.fujitsu.com.  Fujitsu website. www.fujitsu.com."},{"key":"e_1_3_2_1_25_1","first-page":"1441","volume":"2","author":"Heskins M.","year":"1968","unstructured":"M. Heskins and J. Guillet . Solution properties of poly(N-isopropylacrylamide). A2 : 1441 , 1968 . M. Heskins and J. Guillet. Solution properties of poly(N-isopropylacrylamide). A2:1441, 1968.","journal-title":"Solution properties of poly(N-isopropylacrylamide)."},{"key":"e_1_3_2_1_26_1","volume-title":"Programmed adsorption and release of proteins in a microfluidic device. 301","author":"Huber D.","year":"2003","unstructured":"D. Huber , R. Manginell , M. Samara , B. Kim , and B. Bunker . Programmed adsorption and release of proteins in a microfluidic device. 301 , 2003 . D. Huber, R. Manginell, M. Samara, B. Kim, and B. Bunker. Programmed adsorption and release of proteins in a microfluidic device. 301, 2003."},{"key":"e_1_3_2_1_27_1","doi-asserted-by":"publisher","DOI":"10.1145\/1117201.1117205"},{"key":"e_1_3_2_1_28_1","doi-asserted-by":"publisher","DOI":"10.1109\/2.982916"},{"key":"e_1_3_2_1_29_1","doi-asserted-by":"publisher","DOI":"10.1145\/1105734.1105747"},{"key":"e_1_3_2_1_30_1","unstructured":"Mathstar Inc. website. www.mathstar.com.  Mathstar Inc. website. www.mathstar.com."},{"key":"e_1_3_2_1_31_1","volume-title":"4Gbps high-density AC coupled interconnection","author":"Mick S.","year":"2002","unstructured":"S. Mick , J. Wilson , and P. Franzon . 4Gbps high-density AC coupled interconnection . 2002 . S. Mick, J. Wilson, and P. Franzon. 4Gbps high-density AC coupled interconnection. 2002."},{"key":"e_1_3_2_1_32_1","unstructured":"Nec website. www.nec.com.  Nec website. www.nec.com."},{"key":"e_1_3_2_1_33_1","doi-asserted-by":"publisher","DOI":"10.1145\/981066.981086"},{"key":"e_1_3_2_1_34_1","unstructured":"Opencores.org website. www.opencores.org.  Opencores.org website. www.opencores.org."},{"key":"e_1_3_2_1_35_1","volume-title":"Plasma polymerized N-Isopropylacrylamide: Synthesis and characterization of a smart thermally responsive coating. 2","author":"Pan Y.","year":"2001","unstructured":"Y. Pan , R. Wesley , R. Luginbuhl , D. Denton , and B. Ratner . Plasma polymerized N-Isopropylacrylamide: Synthesis and characterization of a smart thermally responsive coating. 2 , 2001 . Y. Pan, R. Wesley, R. Luginbuhl, D. Denton, and B. Ratner. Plasma polymerized N-Isopropylacrylamide: Synthesis and characterization of a smart thermally responsive coating. 2, 2001."},{"key":"e_1_3_2_1_36_1","volume-title":"Magnetically assisted statistical assembly of III-V heterostructures on silicon: Initial process and technology development","author":"Perkins J. M.","year":"2002","unstructured":"J. M. Perkins . Magnetically assisted statistical assembly of III-V heterostructures on silicon: Initial process and technology development . 2002 . J. M. Perkins. Magnetically assisted statistical assembly of III-V heterostructures on silicon: Initial process and technology development. 2002."},{"key":"e_1_3_2_1_37_1","unstructured":"picochip website. www.picochip.com.  picochip website. www.picochip.com."},{"key":"e_1_3_2_1_38_1","unstructured":"Quicksilver technology website. www.qstech.com.  Quicksilver technology website. www.qstech.com."},{"key":"e_1_3_2_1_39_1","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2004.1289290"},{"key":"e_1_3_2_1_40_1","volume-title":"Optoelectronic integration using the magnetically assisted statistical assembly technique: Initial magnetic characterization and process development","author":"Rumpler J.","year":"2002","unstructured":"J. Rumpler . Optoelectronic integration using the magnetically assisted statistical assembly technique: Initial magnetic characterization and process development . 2002 . J. Rumpler. Optoelectronic integration using the magnetically assisted statistical assembly technique: Initial magnetic characterization and process development. 2002."},{"key":"e_1_3_2_1_41_1","volume-title":"Optoelectronic integration using statistical assembly and magnetic retention of heterostructure pills. 2","author":"Rumpler J.","year":"2004","unstructured":"J. Rumpler , M. Perkins , and Optoelectronic integration using statistical assembly and magnetic retention of heterostructure pills. 2 , 2004 . J. Rumpler, M. Perkins, and et al. Optoelectronic integration using statistical assembly and magnetic retention of heterostructure pills. 2, 2004."},{"key":"e_1_3_2_1_42_1","volume-title":"Capacitive coupling solves the known good die problem","author":"Saltzman D.","year":"1994","unstructured":"D. Saltzman and J. Knight , T. Capacitive coupling solves the known good die problem . 1994 . D. Saltzman and J. Knight, T. Capacitive coupling solves the known good die problem. 1994."},{"key":"e_1_3_2_1_43_1","unstructured":"E. Schuman. Rfid bellwether alien again postpones its ipo. July 2006. www.eweek.com.  E. Schuman. Rfid bellwether alien again postpones its ipo. July 2006. www.eweek.com."},{"key":"e_1_3_2_1_44_1","doi-asserted-by":"publisher","DOI":"10.1145\/130823.130824"},{"key":"e_1_3_2_1_45_1","unstructured":"Software\/hardware generation for dsp algorithms. ttp:\/\/www.spiral.net.  Software\/hardware generation for dsp algorithms. ttp:\/\/www.spiral.net."},{"key":"e_1_3_2_1_46_1","unstructured":"http:\/\/www-vlsi.stanford.edu\/ee272\/proj99\/babyviterbi\/verilogcode.html.  http:\/\/www-vlsi.stanford.edu\/ee272\/proj99\/babyviterbi\/verilogcode.html."},{"key":"e_1_3_2_1_47_1","unstructured":"Sun ultrasparc-t1. http:\/\/www.sun.com\/processors\/UltraSPARC-T1\/.  Sun ultrasparc-t1. http:\/\/www.sun.com\/processors\/UltraSPARC-T1\/."},{"key":"e_1_3_2_1_48_1","volume-title":"Surface tension-powered self-assembly of microstrutures: The state-of-the-art. 12","author":"Syms R. R. A.","year":"2003","unstructured":"R. R. A. Syms , E. M. Yeatman , and Surface tension-powered self-assembly of microstrutures: The state-of-the-art. 12 , 2003 . R. R. A. Syms, E. M. Yeatman, and et al. Surface tension-powered self-assembly of microstrutures: The state-of-the-art. 12, 2003."},{"key":"e_1_3_2_1_49_1","unstructured":"Synopsys website. http:\/\/www.synopsys.com.  Synopsys website. http:\/\/www.synopsys.com."},{"key":"e_1_3_2_1_50_1","unstructured":"TSMC 90nm technology platform. http:\/\/www.tsmc.com\/download\/english\/a05 literature\/90nm Brochure.pdf.  TSMC 90nm technology platform. http:\/\/www.tsmc.com\/download\/english\/a05 literature\/90nm Brochure.pdf."},{"key":"e_1_3_2_1_51_1","doi-asserted-by":"publisher","DOI":"10.1109\/INFCOM.2004.1354682"},{"key":"e_1_3_2_1_52_1","doi-asserted-by":"publisher","DOI":"10.1145\/981066.981088"},{"key":"e_1_3_2_1_53_1","unstructured":"Xilinx website. www.xilinx.com.  Xilinx website. www.xilinx.com."},{"key":"e_1_3_2_1_54_1","unstructured":"I. Xilinx. Virtex-II Pro and Virtex-II Pro X FPGA user guide. www.xilinx.com.  I. Xilinx. Virtex-II Pro and Virtex-II Pro X FPGA user guide. www.xilinx.com."},{"key":"e_1_3_2_1_55_1","volume-title":"Controlled multibatch self-assembly of microdevices. 12","author":"Xiong X.","year":"2003","unstructured":"X. Xiong , Y. Hanein , J. Fang , Y. Wang , W. Wang , D. Schwartz , and K. B\u00f6hringer . Controlled multibatch self-assembly of microdevices. 12 , 2003 . X. Xiong, Y. Hanein, J. Fang, Y. Wang, W. Wang, D. Schwartz, and K. B\u00f6hringer. Controlled multibatch self-assembly of microdevices. 12, 2003."},{"key":"e_1_3_2_1_56_1","volume-title":"VLSI Test Symposium, 00","author":"Yang Z.","year":"1999","unstructured":"Z. Yang , K.-T. Cheng , and K. Tai . A new bare die test methodology . VLSI Test Symposium, 00 , 1999 . Z. Yang, K.-T. Cheng, and K. Tai. A new bare die test methodology. VLSI Test Symposium, 00, 1999."},{"key":"e_1_3_2_1_57_1","volume-title":"Fluidic assembly for the integration of GaAs light-emitting diodes on Si substrates. 6","author":"Yeh H.-J. J.","year":"1994","unstructured":"H.-J. J. Yeh and J. S. Smith . Fluidic assembly for the integration of GaAs light-emitting diodes on Si substrates. 6 , 1994 . H.-J. J. Yeh and J. S. Smith. Fluidic assembly for the integration of GaAs light-emitting diodes on Si substrates. 6, 1994."},{"key":"e_1_3_2_1_58_1","volume-title":"International Conference on Computer Design","author":"Zahiri B.","year":"2003","unstructured":"B. Zahiri . Structured ASI Cs : Opportunities and challenges . International Conference on Computer Design , 2003 . B. Zahiri. Structured ASICs: Opportunities and challenges. International Conference on Computer Design, 2003."},{"key":"e_1_3_2_1_59_1","unstructured":"Zyvex nanotechnology website. http:\/\/www.zyvex.com.  Zyvex nanotechnology website. http:\/\/www.zyvex.com."}],"event":{"name":"SPAA07: 19th ACM Symposium on Parallelism in Algorithms and Architectures","location":"San Diego California USA","acronym":"SPAA07","sponsor":["SIGARCH ACM Special Interest Group on Computer Architecture","IEEE-CS Computer Society"]},"container-title":["Proceedings of the 34th annual international symposium on Computer architecture"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1250662.1250693","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/1250662.1250693","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T10:52:18Z","timestamp":1750243938000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1250662.1250693"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2007,6,9]]},"references-count":59,"alternative-id":["10.1145\/1250662.1250693","10.1145\/1250662"],"URL":"https:\/\/doi.org\/10.1145\/1250662.1250693","relation":{"is-identical-to":[{"id-type":"doi","id":"10.1145\/1273440.1250693","asserted-by":"object"}]},"subject":[],"published":{"date-parts":[[2007,6,9]]},"assertion":[{"value":"2007-06-09","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}