{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,29]],"date-time":"2026-03-29T16:29:17Z","timestamp":1774801757845,"version":"3.50.1"},"publisher-location":"New York, NY, USA","reference-count":19,"publisher":"ACM","license":[{"start":{"date-parts":[[2007,8,27]],"date-time":"2007-08-27T00:00:00Z","timestamp":1188172800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2007,8,27]]},"DOI":"10.1145\/1283780.1283826","type":"proceedings-article","created":{"date-parts":[[2010,11,1]],"date-time":"2010-11-01T13:32:23Z","timestamp":1288618343000},"page":"213-218","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":119,"title":["Thermal-aware task scheduling at the system software level"],"prefix":"10.1145","author":[{"given":"Jeonghwan","family":"Choi","sequence":"first","affiliation":[{"name":"IBM T.J. Watson Research center, Yortown Heights, NY"}]},{"given":"Chen-Yong","family":"Cher","sequence":"additional","affiliation":[{"name":"IBM T.J. Watson Research center, Yortown Heights, NY"}]},{"given":"Hubertus","family":"Franke","sequence":"additional","affiliation":[{"name":"IBM T.J. Watson Research center, Yortown Heights, NY"}]},{"given":"Henrdrik","family":"Hamann","sequence":"additional","affiliation":[{"name":"IBM T.J. Watson Research center, Yortown Heights, NY"}]},{"given":"Alan","family":"Weger","sequence":"additional","affiliation":[{"name":"IBM T.J. Watson Research center, Yortown Heights, NY"}]},{"given":"Pradip","family":"Bose","sequence":"additional","affiliation":[{"name":"IBM T.J. Watson Research center, Yortown Heights, NY"}]}],"member":"320","published-online":{"date-parts":[[2007,8,27]]},"reference":[{"key":"e_1_3_2_1_1_1","unstructured":"International Technology Roadmap for Semiconductors 2005.  International Technology Roadmap for Semiconductors 2005."},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/43.828553"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2002.804706"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1145\/513918.514035"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1145\/996566.996576"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1145\/1077603.1077639"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2003.1269421"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1145\/996566.996572"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1145\/1077603.1077662"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.852039"},{"key":"e_1_3_2_1_11_1","volume-title":"Circuits, Interconnections, and Packaging for VLSI","author":"Bakoglu H.","year":"1990","unstructured":"H. Bakoglu , Circuits, Interconnections, and Packaging for VLSI . MA : Addision-Wesley , 1990 . H. Bakoglu, Circuits, Interconnections, and Packaging for VLSI. MA: Addision-Wesley, 1990."},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1109\/4.52187"},{"key":"e_1_3_2_1_13_1","first-page":"680","volume-title":"DATE","author":"Daga J.","year":"1998","unstructured":"J. Daga , E. Ottaviano , D. Auvergne , \"Temperature effect on delay for low voltage applications,\" in Proc . DATE , pp. 680 -- 685 , 1998 . J. Daga, E. Ottaviano, D. Auvergne, \"Temperature effect on delay for low voltage applications,\" in Proc. DATE, pp. 680--685, 1998."},{"key":"e_1_3_2_1_14_1","first-page":"71","volume-title":"IEDM","author":"Park C.","year":"1995","unstructured":"C. Park of temperature dependence of integrated circuits operating at very low voltages,\" in Proc . IEDM , pp. 71 -- 74 , 1995 . C. Park et al., \"Reversal of temperature dependence of integrated circuits operating at very low voltages,\" in Proc. IEDM, pp. 71--74, 1995."},{"key":"e_1_3_2_1_15_1","first-page":"201","volume-title":"CICC","author":"Cao Y.","year":"2000","unstructured":"Y. Cao , T. Sato , D. Sylvester , M. Orshansky , and C. Hu , \" New paradigm of predictive MOSFET and interconnect modeling for early circuit design,\" in Proc . CICC , pp. 201 -- 204 , 2000 . (http:\/\/www.eas.asu.edu\/~ptm) Y. Cao, T. Sato, D. Sylvester, M. Orshansky, and C. Hu, \"New paradigm of predictive MOSFET and interconnect modeling for early circuit design,\" in Proc. CICC, pp. 201--204, 2000. (http:\/\/www.eas.asu.edu\/~ptm)"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2002.808156"},{"key":"e_1_3_2_1_17_1","volume-title":"Fundamentals of modern VLSI devices","author":"Taur Y.","year":"1998","unstructured":"Y. Taur and T. Ning , Fundamentals of modern VLSI devices , Cambridge University Press , 1998 . Y. Taur and T. Ning, Fundamentals of modern VLSI devices, Cambridge University Press, 1998."},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1145\/871506.871529"},{"key":"e_1_3_2_1_19_1","volume-title":"Fundamentals of heat transfer","author":"Chapman A.","year":"1987","unstructured":"A. Chapman , Fundamentals of heat transfer . Macmillan Press , 1987 . A. Chapman, Fundamentals of heat transfer. Macmillan Press, 1987."}],"event":{"name":"ISLPED07: International Symposium on Low Power Electronics and Design","location":"Portland OR USA","acronym":"ISLPED07","sponsor":["ACM Association for Computing Machinery","SIGDA ACM Special Interest Group on Design Automation"]},"container-title":["Proceedings of the 2007 international symposium on Low power electronics and design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1283780.1283826","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/1283780.1283826","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T15:13:59Z","timestamp":1750259639000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1283780.1283826"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2007,8,27]]},"references-count":19,"alternative-id":["10.1145\/1283780.1283826","10.1145\/1283780"],"URL":"https:\/\/doi.org\/10.1145\/1283780.1283826","relation":{},"subject":[],"published":{"date-parts":[[2007,8,27]]},"assertion":[{"value":"2007-08-27","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}