{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,29]],"date-time":"2026-03-29T16:31:14Z","timestamp":1774801874390,"version":"3.50.1"},"publisher-location":"New York, NY, USA","reference-count":15,"publisher":"ACM","license":[{"start":{"date-parts":[[2008,5,4]],"date-time":"2008-05-04T00:00:00Z","timestamp":1209859200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2008,5,4]]},"DOI":"10.1145\/1366110.1366195","type":"proceedings-article","created":{"date-parts":[[2008,5,6]],"date-time":"2008-05-06T14:37:21Z","timestamp":1210084641000},"page":"359-362","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":1,"title":["Efficient and optimal post-layout double-cut via insertion by network relaxation and min-cost maximum flow"],"prefix":"10.1145","author":[{"given":"Lun-Chun","family":"Wei","sequence":"first","affiliation":[{"name":"National Chiao Tung University, Hsinchu, Taiwan Roc"}]},{"given":"Hung-Ming","family":"Chen","sequence":"additional","affiliation":[{"name":"National Chiao Tung University, Hsinchu, Taiwan Roc"}]},{"given":"Li-Da","family":"Huang","sequence":"additional","affiliation":[{"name":"Magma Design Automation Inc., Austin, TX, USA"}]},{"given":"Sarah Songjie","family":"Xu","sequence":"additional","affiliation":[{"name":"Magma Design Automation Inc., Austin, TX, USA"}]}],"member":"320","published-online":{"date-parts":[[2008,5,4]]},"reference":[{"key":"e_1_3_2_1_1_1","first-page":"768","volume-title":"Proc. of ASPDAC","author":"Scheffer L. K.","year":"2004","unstructured":"L. K. Scheffer ,\"Physical CAD Changes to Incorporate Design for Lithography and Manufacturability,\"In Proc. of ASPDAC , pp. 768 -- 773 , 2004 . L. K. Scheffer,\"Physical CAD Changes to Incorporate Design for Lithography and Manufacturability,\"In Proc. of ASPDAC, pp. 768--773, 2004."},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2004.12"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICVD.2005.80"},{"key":"e_1_3_2_1_4_1","first-page":"163","volume":"6","author":"Christiansen C.","year":"2006","unstructured":"C. Christiansen , B. Li , J. Gill , R. Filippi and M. Angyal , Via--Depletion Electromigration in Copper Interconnects,\" In IEEE Transactions on Device and Materials Reliability , vol. 6 , pp. 163 -- 168 , 2006 . C. Christiansen, B. Li, J. Gill, R. Filippi and M. Angyal, Via--Depletion Electromigration in Copper Interconnects,\" In IEEE Transactions on Device and Materials Reliability, vol. 6, pp. 163--168, 2006.","journal-title":"Via--Depletion Electromigration in Copper Interconnects,\" In IEEE Transactions on Device and Materials Reliability"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1145\/1146909.1146962"},{"key":"e_1_3_2_1_6_1","unstructured":"J. G. Xi \"Improving Yield in RTL--to--GDSII Flows \" In EE Times Jul. 2005.  J. G. Xi \"Improving Yield in RTL--to--GDSII Flows \" In EE Times Jul. 2005."},{"key":"e_1_3_2_1_7_1","unstructured":"Taiwan Semiconductor Manufacturing Company (TSMC) Referecne Flows 5.0 -- 8.0  Taiwan Semiconductor Manufacturing Company (TSMC) Referecne Flows 5.0 -- 8.0"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2004.835727"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1145\/1118299.1118469"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1145\/1118299.1118376"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1145\/1233501.1233631"},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1145\/1146909.1147101"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1145\/1120725.1120927"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1145\/1057661.1057696"},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2007.138"}],"event":{"name":"GLSVLSI08: Great Lakes Symposium on VLSI 2008","location":"Orlando Florida USA","acronym":"GLSVLSI08","sponsor":["ACM Association for Computing Machinery","SIGDA ACM Special Interest Group on Design Automation"]},"container-title":["Proceedings of the 18th ACM Great Lakes symposium on VLSI"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1366110.1366195","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/1366110.1366195","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T13:56:29Z","timestamp":1750254989000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1366110.1366195"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2008,5,4]]},"references-count":15,"alternative-id":["10.1145\/1366110.1366195","10.1145\/1366110"],"URL":"https:\/\/doi.org\/10.1145\/1366110.1366195","relation":{},"subject":[],"published":{"date-parts":[[2008,5,4]]},"assertion":[{"value":"2008-05-04","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}