{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T04:35:32Z","timestamp":1750307732361,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":24,"publisher":"ACM","license":[{"start":{"date-parts":[[2009,3,29]],"date-time":"2009-03-29T00:00:00Z","timestamp":1238284800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2009,3,29]]},"DOI":"10.1145\/1514932.1514961","type":"proceedings-article","created":{"date-parts":[[2009,4,6]],"date-time":"2009-04-06T16:34:53Z","timestamp":1239035693000},"page":"131-138","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":5,"title":["Wire shaping is practical"],"prefix":"10.1145","author":[{"given":"Hongbo","family":"Zhang","sequence":"first","affiliation":[{"name":"University of Illinois at Urbana-Champaign, Urbana, IL, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Martin D.F.","family":"Wong","sequence":"additional","affiliation":[{"name":"University of Illinois at Urbana-Champaign, Urbana, IL, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kai-Yuan","family":"Chao","sequence":"additional","affiliation":[{"name":"Intel Corp., Hillsboro, OR, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Liang","family":"Deng","sequence":"additional","affiliation":[{"name":"Broadcom Corp., Irvine, CA, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2009,3,29]]},"reference":[{"key":"e_1_3_2_1_1_1","unstructured":"Star-HSpice Manual. Avant! 1998.  Star-HSpice Manual. Avant! 1998."},{"key":"e_1_3_2_1_2_1","unstructured":"Design Data Translator's Reference. Cadence 2005.  Design Data Translator's Reference. Cadence 2005."},{"volume-title":"Semiconductor Industry Association","year":"2006","key":"e_1_3_2_1_3_1","unstructured":"International Technology Roadmap for Semiconductors (ITRS). Semiconductor Industry Association , San Jose, CA , 2006 . International Technology Roadmap for Semiconductors (ITRS). Semiconductor Industry Association, San Jose, CA, 2006."},{"key":"e_1_3_2_1_4_1","volume-title":"Mentor Graphics","author":"Users Manual OPC","year":"2007","unstructured":"Calibre Model-Based OPC Users Manual . Mentor Graphics , 2007 . Calibre Model-Based OPC Users Manual. Mentor Graphics, 2007."},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/43.905678"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2002.804706"},{"key":"e_1_3_2_1_7_1","volume-title":"Nonlinear Programming","author":"Bertsekas D. P.","year":"2003","unstructured":"D. P. Bertsekas . Nonlinear Programming : Second Edition. Athena Scientific , 2 nd edition, 2003 . D. P. Bertsekas. Nonlinear Programming: Second Edition. Athena Scientific, 2nd edition, 2003."},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/5.371964"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1145\/240518.240611"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1145\/288548.289097"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1145\/266021.266295"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1109\/43.752925"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1109\/92.335010"},{"key":"e_1_3_2_1_15_1","first-page":"65210H","article-title":"Coupling-aware dummy metal insertion for lithography","volume":"6521","author":"Deng L.","year":"2007","unstructured":"L. Deng , M. D. F. Wong , K.-Y. Chao , and H. Xiang . Coupling-aware dummy metal insertion for lithography . SPIE , 6521 : 65210H , 2007 . L. Deng, M. D. F. Wong, K.-Y. Chao, and H. Xiang. Coupling-aware dummy metal insertion for lithography. SPIE, 6521:65210H, 2007.","journal-title":"SPIE"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2006.1692628"},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.857313"},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1145\/1142980.1142988"},{"key":"e_1_3_2_1_19_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2004.828111"},{"issue":"3","key":"e_1_3_2_1_20_1","first-page":"437","article-title":"Optimal wire sizing and buffer insertion for low power and a generalized delay model. Solid-State Circuits","volume":"31","author":"Lillis J.","year":"1996","unstructured":"J. Lillis , C.-K. Cheng , and T.-T. Y. Lin . Optimal wire sizing and buffer insertion for low power and a generalized delay model. Solid-State Circuits , IEEE Journal of , 31 ( 3 ): 437 -- 447 , Mar. 1996 . J. Lillis, C.-K. Cheng, and T.-T. Y. Lin. Optimal wire sizing and buffer insertion for low power and a generalized delay model. Solid-State Circuits, IEEE Journal of, 31(3):437--447, Mar. 1996.","journal-title":"IEEE Journal of"},{"key":"e_1_3_2_1_21_1","first-page":"119","volume-title":"Computer-Aided Design, 2007. ICCAD 2007. IEEE\/ACM International Conference on","author":"Lin I.-J.","year":"2007","unstructured":"I.-J. Lin and Y.-W. Chang . An efficient algorithm for statistical circuit optimization using lagrangian relaxation . Computer-Aided Design, 2007. ICCAD 2007. IEEE\/ACM International Conference on , pages 119 -- 124 , Nov. 2007 . I.-J. Lin and Y.-W. Chang. An efficient algorithm for statistical circuit optimization using lagrangian relaxation. Computer-Aided Design, 2007. ICCAD 2007. IEEE\/ACM International Conference on, pages 119--124, Nov. 2007."},{"key":"e_1_3_2_1_22_1","doi-asserted-by":"publisher","DOI":"10.1109\/43.511579"},{"issue":"4","key":"e_1_3_2_1_23_1","first-page":"468","article-title":"Short-circuit dissipation of static cmos circuitry and its impact on the design of buffer circuits. Solid-State Circuits","volume":"19","author":"Veendrick H. J. M.","year":"1984","unstructured":"H. J. M. Veendrick . Short-circuit dissipation of static cmos circuitry and its impact on the design of buffer circuits. Solid-State Circuits , IEEE Journal of , 19 ( 4 ): 468 -- 473 , Aug. 1984 . H. J. M. Veendrick. Short-circuit dissipation of static cmos circuitry and its impact on the design of buffer circuits. Solid-State Circuits, IEEE Journal of, 19(4):468--473, Aug. 1984.","journal-title":"IEEE Journal of"},{"key":"e_1_3_2_1_24_1","doi-asserted-by":"publisher","DOI":"10.1117\/3.401208"},{"key":"e_1_3_2_1_25_1","first-page":"69250G","article-title":"Manufacturing for design: a novel interconnect optimization method","volume":"6925","author":"Zhang H.","year":"2008","unstructured":"H. Zhang , L. Deng , K.-Y. Chao , and M. D. F. Wong . Manufacturing for design: a novel interconnect optimization method . SPIE , 6925 : 69250G , 2008 . H. Zhang, L. Deng, K.-Y. Chao, and M. D. F. Wong. Manufacturing for design: a novel interconnect optimization method. SPIE, 6925:69250G, 2008.","journal-title":"SPIE"}],"event":{"name":"ISPD09: International Symposium on Physical Design","sponsor":["ACM Association for Computing Machinery","SIGDA ACM Special Interest Group on Design Automation"],"location":"San Diego California USA","acronym":"ISPD09"},"container-title":["Proceedings of the 2009 international symposium on Physical design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1514932.1514961","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/1514932.1514961","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T13:38:44Z","timestamp":1750253924000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1514932.1514961"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,3,29]]},"references-count":24,"alternative-id":["10.1145\/1514932.1514961","10.1145\/1514932"],"URL":"https:\/\/doi.org\/10.1145\/1514932.1514961","relation":{},"subject":[],"published":{"date-parts":[[2009,3,29]]},"assertion":[{"value":"2009-03-29","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}