{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T04:32:12Z","timestamp":1750307532317,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":7,"publisher":"ACM","license":[{"start":{"date-parts":[[2009,5,10]],"date-time":"2009-05-10T00:00:00Z","timestamp":1241913600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2009,5,10]]},"DOI":"10.1145\/1531542.1531560","type":"proceedings-article","created":{"date-parts":[[2009,5,12]],"date-time":"2009-05-12T12:52:47Z","timestamp":1242132767000},"page":"63-68","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":3,"title":["Reducing temperature variability by routing heat pipes"],"prefix":"10.1145","author":[{"given":"Kunal P.","family":"Ganeshpure","sequence":"first","affiliation":[{"name":"University of Massachusetts Amherst, Amherst, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ilia","family":"Polian","sequence":"additional","affiliation":[{"name":"Albert-Ludwigs-University of Freiburg, Freiburg, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sandip","family":"Kundu","sequence":"additional","affiliation":[{"name":"University of Massachusetts Amherst, Amherst, MA, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bernd","family":"Becker","sequence":"additional","affiliation":[{"name":"Albert-Ludwigs-University of Freiburg, Freiburg, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2009,5,10]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1145\/980152.980157"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/IPDPS.2005.448"},{"key":"e_1_3_2_1_3_1","unstructured":"The International Technology Roadmap for Semiconductors (ITRS) 2003.  The International Technology Roadmap for Semiconductors (ITRS) 2003."},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2002.804385"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1145\/1055137.1055171"},{"key":"e_1_3_2_1_8_1","unstructured":"Ngspice: http:\/\/ngspice.sourceforge.net\/index.html  Ngspice: http:\/\/ngspice.sourceforge.net\/index.html"}],"event":{"name":"GLSVLSI '09: Great Lakes Symposium on VLSI 2009","sponsor":["ACM Association for Computing Machinery","SIGDA ACM Special Interest Group on Design Automation"],"location":"Boston Area MA USA","acronym":"GLSVLSI '09"},"container-title":["Proceedings of the 19th ACM Great Lakes symposium on VLSI"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1531542.1531560","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/1531542.1531560","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T12:23:13Z","timestamp":1750249393000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1531542.1531560"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,5,10]]},"references-count":7,"alternative-id":["10.1145\/1531542.1531560","10.1145\/1531542"],"URL":"https:\/\/doi.org\/10.1145\/1531542.1531560","relation":{},"subject":[],"published":{"date-parts":[[2009,5,10]]},"assertion":[{"value":"2009-05-10","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}