{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,23]],"date-time":"2025-10-23T11:01:40Z","timestamp":1761217300839,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":17,"publisher":"ACM","license":[{"start":{"date-parts":[[2009,8,19]],"date-time":"2009-08-19T00:00:00Z","timestamp":1250640000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2009,8,19]]},"DOI":"10.1145\/1594233.1594258","type":"proceedings-article","created":{"date-parts":[[2009,8,24]],"date-time":"2009-08-24T14:08:35Z","timestamp":1251122915000},"page":"111-116","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":14,"title":["Dynamic thermal management using thin-film thermoelectric cooling"],"prefix":"10.1145","author":[{"given":"Pedro","family":"Chaparro","sequence":"first","affiliation":[{"name":"Intel Barcelona Research Center, Intel Labs-UPC, Barcelona, Spain"}]},{"given":"Jos\u00e9","family":"Gonz\u00e1lez","sequence":"additional","affiliation":[{"name":"Intel, Barcelona, Spain"}]},{"given":"Qiong","family":"Cai","sequence":"additional","affiliation":[{"name":"Intel Barcelona Research Center, Intel Labs-UPC, Barcelona, Spain"}]},{"given":"Greg","family":"Chrysler","sequence":"additional","affiliation":[{"name":"Intel, Santa Clara, USA"}]}],"member":"320","published-online":{"date-parts":[[2009,8,19]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2004.1319241"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/40.888701"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.5555\/580550.876439"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1145\/339647.339657"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2007.1092"},{"key":"e_1_3_2_1_6_1","first-page":"464","volume-title":"ITHERM 06 {12}","author":"Chau S.","unstructured":"David. S. Chau, Greg Chrysler, Sridhar Narasimhan, D. Ganapathy, and K. Lofgreen. Feasibility Study of Using Solid State Refrigeration Technologies for Electronic Cooling. In ITHERM 06 {12}, pages 464--469."},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1145\/1105734.1105745"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2006.39"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1145\/1024393.1024424"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1145\/871506.871561"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1145\/1077603.1077662"},{"key":"e_1_3_2_1_12_1","unstructured":"ITHERM-2006 San Diego CA USA May--June 2006."},{"key":"e_1_3_2_1_13_1","first-page":"491","volume-title":"ITHERM 06 {12}","author":"Koester David","unstructured":"David Koester, Rama Venkatasubramanian, Bob Conner, and G. Jeffrey Snyder. Embedded Thermoelectric Coolers for Semiconductor Hot Spot Cooling. In ITHERM 06 {12}, pages 491--496."},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1535\/itj.0904.03"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1145\/859618.859620"},{"key":"e_1_3_2_1_17_1","first-page":"252","volume-title":"Proceedings 15th International Conference on Thermoelectrics","author":"Jan","year":"1996","unstructured":"Jan W. Vandersande and Jean-Pierre Fleurial. Thermal Management of Power Electronics Using Thermoelectric Coolers. In Proceedings 15th International Conference on Thermoelectrics, pages 252--255, Pasadena, CA, USA, March 1996."},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1038\/35098012"}],"event":{"name":"ISLPED'09: International Symposium on Low Power Electronics and Design","sponsor":["ACM Association for Computing Machinery","SIGDA ACM Special Interest Group on Design Automation"],"location":"San Fancisco CA USA","acronym":"ISLPED'09"},"container-title":["Proceedings of the 2009 ACM\/IEEE international symposium on Low power electronics and design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1594233.1594258","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/1594233.1594258","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T13:30:01Z","timestamp":1750253401000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1594233.1594258"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,8,19]]},"references-count":17,"alternative-id":["10.1145\/1594233.1594258","10.1145\/1594233"],"URL":"https:\/\/doi.org\/10.1145\/1594233.1594258","relation":{},"subject":[],"published":{"date-parts":[[2009,8,19]]},"assertion":[{"value":"2009-08-19","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}