{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T04:32:14Z","timestamp":1750307534882,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":30,"publisher":"ACM","license":[{"start":{"date-parts":[[2009,7,26]],"date-time":"2009-07-26T00:00:00Z","timestamp":1248566400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2009,7,26]]},"DOI":"10.1145\/1629911.1629945","type":"proceedings-article","created":{"date-parts":[[2009,10,13]],"date-time":"2009-10-13T15:11:11Z","timestamp":1255446671000},"page":"104-109","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":13,"title":["Physically justifiable die-level modeling of spatial variation in view of systematic across wafer variability"],"prefix":"10.1145","author":[{"given":"Lerong","family":"Cheng","sequence":"first","affiliation":[{"name":"University of California, Los Angeles"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Puneet","family":"Gupta","sequence":"additional","affiliation":[{"name":"University of California, Los Angeles"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Costas","family":"Spanos","sequence":"additional","affiliation":[{"name":"University of California, Berkeley"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kun","family":"Qian","sequence":"additional","affiliation":[{"name":"University of California, Berkeley"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lei","family":"He","sequence":"additional","affiliation":[{"name":"University of California, Los Angeles"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2009,7,26]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1145\/1119772.1119825"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2003.129"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1145\/1123008.1123011"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1145\/1278480.1278684"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1145\/1391469.1391648"},{"key":"e_1_3_2_1_6_1","volume-title":"Feb","author":"Sato T.","year":"2008","unstructured":"T. Sato , H. Ueyama , N. Nakayama , and K. Masu , \" Determination of optimal polynomial regression function to decompose on-die systematic and random variations,\" in ASPDAC , Feb 2008 . T. Sato, H. Ueyama, N. Nakayama, and K. Masu, \"Determination of optimal polynomial regression function to decompose on-die systematic and random variations,\" in ASPDAC, Feb 2008."},{"key":"e_1_3_2_1_7_1","volume-title":"May","author":"Boning D.","year":"1997","unstructured":"D. Boning , J. Chung , D. Ouma , and R. Divecha , \" Spatial variation in semiconductor processes: Modeling for control,\" in Proceedings Process Control Diagnostics and Modeling in Semiconductor Manufacturing II Electrochemical Society Meeting , May 1997 . D. Boning, J. Chung, D. Ouma, and R. Divecha, \"Spatial variation in semiconductor processes: Modeling for control,\" in Proceedings Process Control Diagnostics and Modeling in Semiconductor Manufacturing II Electrochemical Society Meeting, May 1997."},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1145\/775832.775920"},{"key":"e_1_3_2_1_9_1","volume-title":"Feb","author":"Chopra K.","year":"2007","unstructured":"K. Chopra , N. Shenoy , and D. Blaauw , \" Variogram based robust extraction of process variation,\" in ACM\/IEEE International Workshop on Timing Issues , Feb 2007 . K. Chopra, N. Shenoy, and D. Blaauw, \"Variogram based robust extraction of process variation,\" in ACM\/IEEE International Workshop on Timing Issues, Feb 2007."},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1145\/1403375.1403502"},{"key":"e_1_3_2_1_11_1","volume-title":"Mar","author":"W.","year":"2008","unstructured":"W. Z. ect., \"An efficient method for chip-level statistical capacitance extractionion via random field simulation and production considering process variations with spatial correlation,\" in DATE , Mar 2008 . W. Z. ect., \"An efficient method for chip-level statistical capacitance extractionion via random field simulation and production considering process variations with spatial correlation,\" in DATE, Mar 2008."},{"key":"e_1_3_2_1_12_1","volume-title":"Mar","author":"Fu Q.","year":"2008","unstructured":"Q. Fu , W.-S. Luk , J. Tao , C. Yan , and X. Zeng , \" Characterizing intradie spatial correlation using spectral density method,\" in International Symposium on Quality of Electronic Design , Mar 2008 . Q. Fu, W.-S. Luk, J. Tao, C. Yan, and X. Zeng, \"Characterizing intradie spatial correlation using spectral density method,\" in International Symposium on Quality of Electronic Design, Mar 2008."},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1093\/ietfec\/e91-a.4.1062"},{"key":"e_1_3_2_1_14_1","volume-title":"Sep","author":"Zhao W.","year":"2007","unstructured":"W. Zhao , Y. Cao , F. Liu , K. Agarwal , D. Acharyya , S. Nassif , and K. Nowka , \" Rigorous extraction of process variations for 65nm cmos design,\" in Solid State Device Research Conference , Sep 2007 . W. Zhao, Y. Cao, F. Liu, K. Agarwal, D. Acharyya, S. Nassif, and K. Nowka, \"Rigorous extraction of process variations for 65nm cmos design,\" in Solid State Device Research Conference, Sep 2007."},{"key":"e_1_3_2_1_15_1","volume-title":"Spatial modeling of micronscale gate length variation,\" in Proc","author":"Friedberg P.","year":"2006","unstructured":"P. Friedberg , W. Cheung , and C. J. Spanos , \" Spatial modeling of micronscale gate length variation,\" in Proc . SPIE , 2006 . P. Friedberg, W. Cheung, and C. J. Spanos, \"Spatial modeling of micronscale gate length variation,\" in Proc. SPIE, 2006."},{"key":"e_1_3_2_1_16_1","unstructured":"IEEE Trans. on Semiconductor Manufacturing to be appeared. Lack of spatial correlation in mosfet threshold voltage variation and implications for voltage scaling"},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1117\/12.711232"},{"key":"e_1_3_2_1_18_1","volume-title":"A comprehensive model of process variability for statistical timing optimization,\" in Proc","author":"Qian K.","year":"2008","unstructured":"K. Qian and C. J. Spanos , \" A comprehensive model of process variability for statistical timing optimization,\" in Proc . SPIE , 2008 . K. Qian and C. J. Spanos, \"A comprehensive model of process variability for statistical timing optimization,\" in Proc. SPIE, 2008."},{"key":"e_1_3_2_1_19_1","volume-title":"Microlithography Science and Technology. CRC","author":"Sheats J. R.","year":"1998","unstructured":"J. R. Sheats , Microlithography Science and Technology. CRC , 1998 . J. R. Sheats, Microlithography Science and Technology. CRC, 1998."},{"key":"e_1_3_2_1_20_1","unstructured":"S. J. V. P. S. B. J. S. R. and T. M. G. \"Hot-wire cvd growth simulation for thickness uniformity \" in International Conference on Cat-CVD Process 2001.  S. J. V. P. S. B. J. S. R. and T. M. G. \"Hot-wire cvd growth simulation for thickness uniformity \" in International Conference on Cat-CVD Process 2001."},{"key":"e_1_3_2_1_21_1","volume-title":"Deposition uniformity control in a commercial scale HTO-CVD reactor,\" MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS","author":"Sakai S.","year":"2007","unstructured":"S. Sakai , M. Ogino , R. Shimizu , and Y. Shimogaki , \" Deposition uniformity control in a commercial scale HTO-CVD reactor,\" MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS , 2007 . S. Sakai, M. Ogino, R. Shimizu, and Y. Shimogaki, \"Deposition uniformity control in a commercial scale HTO-CVD reactor,\" MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS, 2007."},{"key":"e_1_3_2_1_22_1","doi-asserted-by":"publisher","DOI":"10.1109\/TPS.2006.889294"},{"key":"e_1_3_2_1_23_1","article-title":"Investigation of etch rate uniformity of 60 mhz plasma etching equipment","author":"Kim T. W.","year":"2001","unstructured":"T. W. Kim and E. S. Aydil , \" Investigation of etch rate uniformity of 60 mhz plasma etching equipment ,\" Japanese Journal of Applied Physics , Nov 2001 . T. W. Kim and E. S. Aydil, \"Investigation of etch rate uniformity of 60 mhz plasma etching equipment,\" Japanese Journal of Applied Physics, Nov 2001.","journal-title":"Japanese Journal of Applied Physics"},{"key":"e_1_3_2_1_24_1","article-title":"Effects of chamber wall conditions on cl concertration and si etch rate uniformity in palsma etching reactors","author":"Kim T. W.","year":"2003","unstructured":"T. W. Kim and E. S. Aydil , \" Effects of chamber wall conditions on cl concertration and si etch rate uniformity in palsma etching reactors ,\" Journal of The Electrochemical Society , June 2003 . T. W. Kim and E. S. Aydil, \"Effects of chamber wall conditions on cl concertration and si etch rate uniformity in palsma etching reactors,\" Journal of The Electrochemical Society, June 2003.","journal-title":"Journal of The Electrochemical Society"},{"key":"e_1_3_2_1_25_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jprocont.2008.04.016"},{"key":"e_1_3_2_1_26_1","first-page":"24","article-title":"Analysis and decomposition of spatial variation in integrated circuit processes and devices,\" in Semiconductor Manufacturing","author":"Stine B.","year":"1997","unstructured":"B. Stine , D. Boning , and J. Chung , \" Analysis and decomposition of spatial variation in integrated circuit processes and devices,\" in Semiconductor Manufacturing , IEEE Transactions on , pp. 24 -- 41 , Feb. 1997 . B. Stine, D. Boning, and J. Chung, \"Analysis and decomposition of spatial variation in integrated circuit processes and devices,\" in Semiconductor Manufacturing, IEEE Transactions on, pp. 24--41, Feb. 1997.","journal-title":"IEEE Transactions on"},{"key":"e_1_3_2_1_27_1","volume-title":"Hierachical Modeling of Spatial Variability of a 45nm Test Chip,\" in SPIE","author":"Qian K.","year":"2009","unstructured":"K. Qian and K. Spanos , \" Hierachical Modeling of Spatial Variability of a 45nm Test Chip,\" in SPIE , 2009 . K. Qian and K. Spanos, \"Hierachical Modeling of Spatial Variability of a 45nm Test Chip,\" in SPIE, 2009."},{"key":"e_1_3_2_1_28_1","unstructured":"Predictive Technology Model in http:\/\/www.eas.asu.edu\/ptm\/.  Predictive Technology Model in http:\/\/www.eas.asu.edu\/ptm\/."},{"key":"e_1_3_2_1_29_1","volume-title":"Feb","author":"Cheng L.","year":"2008","unstructured":"L. Cheng , J. Xiong , and L. He , \" Non-gaussian statistical timing analysis using Second-Order polynomial fitting,\" in ASPDAC , Feb 2008 . L. Cheng, J. Xiong, and L. He, \"Non-gaussian statistical timing analysis using Second-Order polynomial fitting,\" in ASPDAC, Feb 2008."},{"key":"e_1_3_2_1_30_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2007.79"}],"event":{"name":"DAC '09: The 46th Annual Design Automation Conference 2009","sponsor":["EDAC Electronic Design Automation Consortium","SIGDA ACM Special Interest Group on Design Automation","IEEE-CAS Circuits & Systems"],"location":"San Francisco California","acronym":"DAC '09"},"container-title":["Proceedings of the 46th Annual Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1629911.1629945","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/1629911.1629945","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T12:23:16Z","timestamp":1750249396000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1629911.1629945"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,7,26]]},"references-count":30,"alternative-id":["10.1145\/1629911.1629945","10.1145\/1629911"],"URL":"https:\/\/doi.org\/10.1145\/1629911.1629945","relation":{},"subject":[],"published":{"date-parts":[[2009,7,26]]},"assertion":[{"value":"2009-07-26","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}