{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,27]],"date-time":"2025-10-27T15:59:20Z","timestamp":1761580760221,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":15,"publisher":"ACM","license":[{"start":{"date-parts":[[2010,3,14]],"date-time":"2010-03-14T00:00:00Z","timestamp":1268524800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2010,3,14]]},"DOI":"10.1145\/1735023.1735052","type":"proceedings-article","created":{"date-parts":[[2010,3,16]],"date-time":"2010-03-16T19:27:05Z","timestamp":1268767625000},"page":"105-111","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":19,"title":["Density gradient minimization with coupling-constrained dummy fill for CMP control"],"prefix":"10.1145","author":[{"given":"Huang-Yu","family":"Chen","sequence":"first","affiliation":[{"name":"National Taiwan University, Taipei 106, Taiwan Roc"}]},{"given":"Szu-Jui","family":"Chou","sequence":"additional","affiliation":[{"name":"National Taiwan University, Taipei 106, Taiwan Roc"}]},{"given":"Yao-Wen","family":"Chang","sequence":"additional","affiliation":[{"name":"National Taiwan University, Taipei 106, Taiwan Roc"}]}],"member":"320","published-online":{"date-parts":[[2010,3,14]]},"reference":[{"key":"e_1_3_2_1_1_1","first-page":"831","volume-title":"Proc. of IEEE\/ACM International Conf. on Computer-Aided Design","author":"Chen H.-Y.","year":"2007"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1145\/337292.337610"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1145\/505388.505422"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1145\/1233501.1233599"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2007.357785"},{"key":"e_1_3_2_1_6_1","unstructured":"GTstyle \"The Next Generation Tool for Dummy Filling available at http:\/\/www.xyalis.com\/gtstyle.htm  GTstyle \"The Next Generation Tool for Dummy Filling available at http:\/\/www.xyalis.com\/gtstyle.htm"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2007.907061"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2007.895587"},{"key":"e_1_3_2_1_9_1","unstructured":"T. H. Park Characterization and Modeling of Pattern Dependencies in Copper Interconnects for Integrated Circuits Ph.D. Dissertation Dep. of EECS MIT May 2002.  T. H. Park Characterization and Modeling of Pattern Dependencies in Copper Interconnects for Integrated Circuits Ph.D. Dissertation Dep. of EECS MIT May 2002."},{"key":"e_1_3_2_1_10_1","unstructured":"D. Reed \"Metal Fill Crosses the Threshold from Manufacturing to Design \" Electonic Design Jan. 7 2007.  D. Reed \"Metal Fill Crosses the Threshold from Manufacturing to Design \" Electonic Design Jan. 7 2007."},{"key":"e_1_3_2_1_11_1","unstructured":"D. Reed \"Dummy Fill Needs to Wise up \" Chip Design Jan. 15 2007.  D. Reed \"Dummy Fill Needs to Wise up \" Chip Design Jan. 15 2007."},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1016\/S0167-9317(03)00330-7"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1109\/16.661228"},{"key":"e_1_3_2_1_14_1","unstructured":"The VCMP team Taiwan Semiconductor Manufacturing Company (TSMC) Ltd.  The VCMP team Taiwan Semiconductor Manufacturing Company (TSMC) Ltd."},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1145\/1231996.1232001"}],"event":{"name":"ISPD '10: International Symposium on Physical Design","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE CAS"],"location":"San Francisco California USA","acronym":"ISPD '10"},"container-title":["Proceedings of the 19th international symposium on Physical design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1735023.1735052","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/1735023.1735052","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T22:29:43Z","timestamp":1750285783000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1735023.1735052"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,3,14]]},"references-count":15,"alternative-id":["10.1145\/1735023.1735052","10.1145\/1735023"],"URL":"https:\/\/doi.org\/10.1145\/1735023.1735052","relation":{},"subject":[],"published":{"date-parts":[[2010,3,14]]},"assertion":[{"value":"2010-03-14","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}