{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,4]],"date-time":"2026-04-04T22:25:11Z","timestamp":1775341511793,"version":"3.50.1"},"publisher-location":"New York, NY, USA","reference-count":0,"publisher":"ACM","license":[{"start":{"date-parts":[[2010,6,13]],"date-time":"2010-06-13T00:00:00Z","timestamp":1276387200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2010,6,13]]},"DOI":"10.1145\/1837274.1837350","type":"proceedings-article","created":{"date-parts":[[2010,10,28]],"date-time":"2010-10-28T14:47:40Z","timestamp":1288277260000},"page":"298-299","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":3,"title":["3-D stacked die"],"prefix":"10.1145","author":[{"given":"Samta","family":"Bansal","sequence":"first","affiliation":[{"name":"Cadence, San Jose, California"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Juan C.","family":"Rey","sequence":"additional","affiliation":[{"name":"Mentor Graphics, San Jose, California"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Andrew","family":"Yang","sequence":"additional","affiliation":[{"name":"Apache Design Solutions, San Jose, CA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Myung-Soo","family":"Jang","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Yongin-City, Gyeonggi-Do, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"LC","family":"Lu","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Co., Hsinchu, Taiwan R.O.C"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Philippe","family":"Magarshack","sequence":"additional","affiliation":[{"name":"ST Microelectronics, Crolles, Cedex, France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Marchal","family":"Pol","sequence":"additional","affiliation":[{"name":"IMEC, Leuven, Belgium"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Riko","family":"Radojcic","sequence":"additional","affiliation":[{"name":"Qualcomm, San Diego, CA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2010,6,13]]},"event":{"name":"DAC '10: The 47th Annual Design Automation Conference 2010","location":"Anaheim California","acronym":"DAC '10","sponsor":["EDAC Electronic Design Automation Consortium","SIGDA ACM Special Interest Group on Design Automation","IEEE-CEDA"]},"container-title":["Proceedings of the 47th Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1837274.1837350","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/1837274.1837350","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T11:39:35Z","timestamp":1750246775000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/1837274.1837350"}},"subtitle":["now or future?"],"short-title":[],"issued":{"date-parts":[[2010,6,13]]},"references-count":0,"alternative-id":["10.1145\/1837274.1837350","10.1145\/1837274"],"URL":"https:\/\/doi.org\/10.1145\/1837274.1837350","relation":{},"subject":[],"published":{"date-parts":[[2010,6,13]]},"assertion":[{"value":"2010-06-13","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}