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New hurdles in scalability, programmability, power consumption, reliability, cost, and cooling are emerging, along with new technologies such as 3D integration, GP-GPUs, silicon-photonics, and other \"game changers\". Currently, they HPC community lacks a unified toolset to evaluate these technologies and design for these challenges.<\/jats:p>\n          <jats:p>To address this problem, a number of institutions have joined together to create the Structural Simulation Toolkit (SST), an open, modular, parallel, multi-criteria, multi-scale simulation framework. The SST includes a number of processor, memory, and network models. 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