{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,29]],"date-time":"2025-09-29T12:01:19Z","timestamp":1759147279878,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":15,"publisher":"ACM","license":[{"start":{"date-parts":[[2011,6,5]],"date-time":"2011-06-05T00:00:00Z","timestamp":1307232000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2011,6,5]]},"DOI":"10.1145\/2024724.2024748","type":"proceedings-article","created":{"date-parts":[[2011,9,6]],"date-time":"2011-09-06T15:10:46Z","timestamp":1315321846000},"page":"108-113","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":18,"title":["Thermal signature"],"prefix":"10.1145","author":[{"given":"Jaeha","family":"Kung","sequence":"first","affiliation":[{"name":"KAIST, Daejeon, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Inhak","family":"Han","sequence":"additional","affiliation":[{"name":"KAIST, Daejeon, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sachin","family":"Sapatnekar","sequence":"additional","affiliation":[{"name":"University of Minnesota, Minneapolis, MN"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Youngsoo","family":"Shin","sequence":"additional","affiliation":[{"name":"KAIST, Daejeon, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2011,6,5]]},"reference":[{"doi-asserted-by":"publisher","key":"e_1_3_2_1_1_1","DOI":"10.1109\/43.828548"},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_2_1","DOI":"10.1109\/95.725203"},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_3_1","DOI":"10.1145\/640000.640007"},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_4_1","DOI":"10.1166\/jolpe.2007.128"},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_5_1","DOI":"10.1109\/TVLSI.2006.876103"},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_6_1","DOI":"10.1109\/43.828554"},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_7_1","DOI":"10.1109\/ISQED.2005.122"},{"key":"e_1_3_2_1_8_1","article-title":"A case for thermal-aware floorplanning at the microarchitectural level","volume":"7","author":"Sankaranarayanan K.","year":"2005","unstructured":"K. Sankaranarayanan , S. Velusamy , M. Stan , and K. Skadron , \" A case for thermal-aware floorplanning at the microarchitectural level ,\" The Journal of Instruction-Level Parallelism , vol. 7 , Oct. 2005 , http:\/\/www.jilp.org\/vol7\/. K. Sankaranarayanan, S. Velusamy, M. Stan, and K. Skadron, \"A case for thermal-aware floorplanning at the microarchitectural level,\" The Journal of Instruction-Level Parallelism, vol. 7, Oct. 2005, http:\/\/www.jilp.org\/vol7\/.","journal-title":"The Journal of Instruction-Level Parallelism"},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_9_1","DOI":"10.1109\/ICCAD.2004.1382591"},{"key":"e_1_3_2_1_10_1","first-page":"635","volume-title":"Int. Conf. on Computer-Aided Design","author":"Zhan Y.","year":"2005","unstructured":"Y. Zhan and S. Sapatnekar , \" A high efficiency full-chip thermal simulation algorithm,\" in Proc . Int. Conf. on Computer-Aided Design , Nov. 2005 , pp. 635 -- 638 . Y. Zhan and S. Sapatnekar, \"A high efficiency full-chip thermal simulation algorithm,\" in Proc. Int. Conf. on Computer-Aided Design, Nov. 2005, pp. 635--638."},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_11_1","DOI":"10.1109\/TCAD.2006.883919"},{"unstructured":"\"Opencores \" http:\/\/www.opencores.org\/.  \"Opencores \" http:\/\/www.opencores.org\/.","key":"e_1_3_2_1_12_1"},{"volume-title":"Sept.","year":"2008","unstructured":"Synopsys , Design Compiler User Guide , Sept. 2008 . Synopsys, Design Compiler User Guide, Sept. 2008.","key":"e_1_3_2_1_13_1"},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_14_1","DOI":"10.1109\/TVLSI.2003.817546"},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_15_1","DOI":"10.5555\/224841.225094"}],"event":{"sponsor":["EDAC Electronic Design Automation Consortium","SIGDA ACM Special Interest Group on Design Automation","IEEE Council on Electronic Design Automation (CEDA)"],"acronym":"DAC '11","name":"DAC '11: The 48th Annual Design Automation Conference 2011","location":"San Diego California"},"container-title":["Proceedings of the 48th Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2024724.2024748","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2024724.2024748","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T09:54:14Z","timestamp":1750240454000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2024724.2024748"}},"subtitle":["a simple yet accurate thermal index for floorplan optimization"],"short-title":[],"issued":{"date-parts":[[2011,6,5]]},"references-count":15,"alternative-id":["10.1145\/2024724.2024748","10.1145\/2024724"],"URL":"https:\/\/doi.org\/10.1145\/2024724.2024748","relation":{},"subject":[],"published":{"date-parts":[[2011,6,5]]},"assertion":[{"value":"2011-06-05","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}