{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T17:53:26Z","timestamp":1775066006442,"version":"3.50.1"},"reference-count":22,"publisher":"Association for Computing Machinery (ACM)","issue":"2","license":[{"start":{"date-parts":[[2012,6,1]],"date-time":"2012-06-01T00:00:00Z","timestamp":1338508800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":["J. Emerg. Technol. Comput. Syst."],"published-print":{"date-parts":[[2012,6]]},"abstract":"<jats:p>Implantable systems for biomedical research and clinical care are now a flourishing field of activities in academia as well as industrial institutions. The broad field includes experimental explorations in electronics, mechanical, chemical, and biological components and systems, and the combination of all these. Today virtually all implants involve both electronic circuits and micro-electro-mechanical-systems (MEMS). This article offers a very brief glance back at the early history of implant electronics in the period from the 1950s to the 1970s, by employing selected examples from the author\u2019s research. This short review also discusses the challenges of implantable electronics at present, and suggests some potentially important trends in the future research and development of implantable microsystems. It is aimed as an introduction of implantable\/attached electronic systems to research engineers that are interested in implantable systems as a section of Biomedical Instrumentations.<\/jats:p>","DOI":"10.1145\/2180878.2180880","type":"journal-article","created":{"date-parts":[[2012,6,27]],"date-time":"2012-06-27T13:31:17Z","timestamp":1340803877000},"page":"1-9","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":33,"title":["Early History and Challenges of Implantable Electronics"],"prefix":"10.1145","volume":"8","author":[{"given":"Wen H.","family":"Ko","sequence":"first","affiliation":[{"name":"Case Western Reserve University"}]}],"member":"320","published-online":{"date-parts":[[2012,6]]},"reference":[{"key":"e_1_2_1_1_1","unstructured":"Amlaner C. G. and MacDonald D. M. Ed. 1986. A Handbook on Biotelemetry and Radio Tracking Pergamum Press New York. Amlaner C. G. and MacDonald D. M. Ed. 1986. 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T. and Reswick J. B. Eds. 1977. Functional Electrical Stimulation: Applications in Neural Prostheses. Marcel Dekker New York. Hambrecht F. T. and Reswick J. B. Eds. 1977. Functional Electrical Stimulation: Applications in Neural Prostheses . Marcel Dekker New York."},{"key":"e_1_2_1_9_1","unstructured":"Ko W. H. 1960. Tunnel diode FM wireless microphone. Electronics 11\/60. Ko W. H. 1960. Tunnel diode FM wireless microphone. Electronics 11\/60."},{"key":"e_1_2_1_10_1","unstructured":"Ko W. H. 1961. Designing tunnel diode oscillators. Electronics 2\/61. Ko W. H. 1961. Designing tunnel diode oscillators. Electronics 2\/61."},{"key":"e_1_2_1_11_1","first-page":"41","article-title":"Tunnel diode oscillator delivers RF and audio","volume":"35","author":"Ko W. H.","year":"1962","journal-title":"Electronics"},{"key":"e_1_2_1_12_1","first-page":"773","article-title":"Implant biotelemetry and microelectronics","volume":"156","author":"Ko W. 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F.","year":"1994","journal-title":"Biomed Eng."},{"key":"e_1_2_1_19_1","doi-asserted-by":"publisher","DOI":"10.1109\/TBME.1981.324740"},{"key":"e_1_2_1_20_1","unstructured":"Prescott G. B. 2009. Bell\u2019s Electric Speaking Telephone: Its Invention Construction Application Modification and History Appleton New York 72. Prescott G. B. 2009. Bell\u2019s Electric Speaking Telephone: Its Invention Construction Application Modification and History Appleton New York 72."},{"key":"e_1_2_1_21_1","volume-title":"Bio-Telemetry","author":"Slater L."},{"key":"e_1_2_1_22_1","unstructured":"Wong C. P. 1998. Polymers for encapsulation: Materials processes and reliability. Chip Scale Rev. 2. Wong C. P. 1998. Polymers for encapsulation: Materials processes and reliability. 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