{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,10]],"date-time":"2026-07-10T20:31:37Z","timestamp":1783715497816,"version":"3.55.0"},"publisher-location":"New York, NY, USA","reference-count":23,"publisher":"ACM","license":[{"start":{"date-parts":[[2012,6,3]],"date-time":"2012-06-03T00:00:00Z","timestamp":1338681600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2012,6,3]]},"DOI":"10.1145\/2228360.2228539","type":"proceedings-article","created":{"date-parts":[[2012,5,31]],"date-time":"2012-05-31T12:10:51Z","timestamp":1338466251000},"page":"994-999","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":10,"title":["Embedding statistical tests for on-chip dynamic voltage and temperature monitoring"],"prefix":"10.1145","author":[{"given":"Lionel","family":"Vincent","sequence":"first","affiliation":[{"name":"CEA-LETI, Grenoble Cedex, France"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Philippe","family":"Maurine","sequence":"additional","affiliation":[{"name":"LIRMM, Universit\u00e9 Montpellier, Montpellier, Cedex, France"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Suzanne","family":"Lesecq","sequence":"additional","affiliation":[{"name":"CEA-LETI, Grenoble Cedex, France"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Edith","family":"Beign\u00e9","sequence":"additional","affiliation":[{"name":"CEA-LETI, Grenoble Cedex, France"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"320","published-online":{"date-parts":[[2012,6,3]]},"reference":[{"key":"e_1_3_2_1_1_1","first-page":"81","article-title":"Thermal coupling in integrated circuits: application to thermal testing. Solid-State Circuits","volume":"36","author":"Altet J.","year":"2001","unstructured":"J. Altet , A. Rubio , E. Schaub , S. Dilhaire , and W. Claeys . Thermal coupling in integrated circuits: application to thermal testing. Solid-State Circuits , IEEE Journal of , 36 : 81 -- 91 , 2001 . J. Altet, A. Rubio, E. Schaub, S. Dilhaire, and W. Claeys. Thermal coupling in integrated circuits: application to thermal testing. Solid-State Circuits, IEEE Journal of, 36:81--91, 2001.","journal-title":"IEEE Journal of"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1214\/aoms\/1177704477"},{"key":"e_1_3_2_1_3_1","first-page":"112","volume-title":"Microelectronic Test Structures, 2000. ICMTS 2000. Proceedings of the 2000 International Conference on","author":"Aoki H.","year":"2000","unstructured":"H. Aoki , M. Ikeda , and K. Asada . On-chip voltage noise monitor for measuring voltage bounce in power supply tines using a digital tester . Microelectronic Test Structures, 2000. ICMTS 2000. Proceedings of the 2000 International Conference on , pages 112 -- 117 , 2000 . H. Aoki, M. Ikeda, and K. Asada. On-chip voltage noise monitor for measuring voltage bounce in power supply tines using a digital tester. Microelectronic Test Structures, 2000. ICMTS 2000. Proceedings of the 2000 International Conference on, pages 112--117, 2000."},{"key":"e_1_3_2_1_4_1","first-page":"1167","article-title":"An Asynchronous Power Aware and Adaptive NoC Based Circuit. Solid-State Circuits","volume":"44","author":"Beigne E.","year":"2009","unstructured":"E. Beigne , F. Clermidy , H. Lhermet , S. Miermont , Y. Thonnart , X.-T. Tran , A. Valentian , D. Varreau , P. Vivet , X. Popon , and H. Lebreton . An Asynchronous Power Aware and Adaptive NoC Based Circuit. Solid-State Circuits , IEEE Journal of , 44 : 1167 -- 1177 , 2009 . E. Beigne, F. Clermidy, H. Lhermet, S. Miermont, Y. Thonnart, X.-T. Tran, A. Valentian, D. Varreau, P. Vivet, X. Popon, and H. Lebreton. An Asynchronous Power Aware and Adaptive NoC Based Circuit. Solid-State Circuits, IEEE Journal of, 44:1167--1177, 2009.","journal-title":"IEEE Journal of"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/NEWCAS.2011.5981331"},{"key":"e_1_3_2_1_6_1","first-page":"350","volume-title":"Proceedings of SPIE","volume":"5038","author":"Cain J.","year":"2003","unstructured":"J. Cain and C. Spanos , \" Electrical linewidth metrology for systematic CD variation characterization and causal analysis,\" Metrology, Inspection, and Process Control for Microlithography XVII , Proceedings of SPIE , vol. 5038 , pp. 350 -- 361 , 2003 . J. Cain and C. Spanos, \"Electrical linewidth metrology for systematic CD variation characterization and causal analysis,\" Metrology, Inspection, and Process Control for Microlithography XVII, Proceedings of SPIE, vol. 5038, pp. 350--361, 2003."},{"key":"e_1_3_2_1_7_1","first-page":"1642","article-title":"A time-to-digital-converter-based CMOS smart temperature sensor. Solid-State Circuits","volume":"40","author":"Chen P.","year":"2005","unstructured":"P. Chen , C.-C. Chen , C.-C. Tsai , and W.-F. Lu . A time-to-digital-converter-based CMOS smart temperature sensor. Solid-State Circuits , IEEE Journal of , 40 : 1642 -- 1648 , 2005 . P. Chen, C.-C. Chen, C.-C. Tsai, and W.-F. Lu. A time-to-digital-converter-based CMOS smart temperature sensor. Solid-State Circuits, IEEE Journal of, 40:1642--1648, 2005.","journal-title":"IEEE Journal of"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2010.5501259"},{"key":"e_1_3_2_1_9_1","first-page":"32","article-title":"Razorll: In Situ Error Detection and Correction for PVT and SER Tolerance. Solid-State Circuits","volume":"44","author":"Das S.","year":"2009","unstructured":"S. Das , C. Tokunaga , S. Pant , W.-H. Ma , S. Kalaiselvan , K. Lai , D. Bull , and D. Blaauw . Razorll: In Situ Error Detection and Correction for PVT and SER Tolerance. Solid-State Circuits , IEEE Journal of , 44 : 32 -- 18 , 2009 . S. Das, C. Tokunaga, S. Pant, W.-H. Ma, S. Kalaiselvan, K. Lai, D. Bull, and D. Blaauw. Razorll: In Situ Error Detection and Correction for PVT and SER Tolerance. Solid-State Circuits, IEEE Journal of, 44:32--18, 2009.","journal-title":"IEEE Journal of"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS.2007.4488534"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2002.1010946"},{"key":"e_1_3_2_1_12_1","first-page":"56","article-title":"Hotspot-Limited Microprocessors: Direct Temperature and Power Distribution Measurements. Solid-State Circuits","volume":"42","author":"Hamann H. F.","year":"2007","unstructured":"H. F. Hamann , A. Weger , J. A. Lacey , Z. Hu , P. Bose , E. Cohen , and J. Wakil . Hotspot-Limited Microprocessors: Direct Temperature and Power Distribution Measurements. Solid-State Circuits , IEEE Journal of , 42 : 56 -- 65 , 2007 . H. F. Hamann, A. Weger, J. A. Lacey, Z. Hu, P. Bose, E. Cohen, and J. Wakil. Hotspot-Limited Microprocessors: Direct Temperature and Power Distribution Measurements. Solid-State Circuits, IEEE Journal of, 42:56--65, 2007.","journal-title":"IEEE Journal of"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2008.2010399"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2007.164"},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1145\/2024724.2024748"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1109\/VLSISOC.2009.6041332"},{"key":"e_1_3_2_1_17_1","first-page":"651","article-title":"On-die droop detector for analog sensing of power supply noise. Solid-State Circuits","volume":"39","author":"Muhtaroglu A.","year":"2004","unstructured":"A. Muhtaroglu , G. Taylor , and T. Rahal-Arabi . On-die droop detector for analog sensing of power supply noise. Solid-State Circuits , IEEE Journal of , 39 : 651 -- 660 , 2004 . A. Muhtaroglu, G. Taylor, and T. Rahal-Arabi. On-die droop detector for analog sensing of power supply noise. Solid-State Circuits, IEEE Journal of, 39:651--660, 2004.","journal-title":"IEEE Journal of"},{"key":"e_1_3_2_1_18_1","first-page":"28","article-title":"Dynamic Voltage and Frequency Management for a Low-Power Embedded Microprocessor. Solid-State Circuits","volume":"40","author":"Nakai M.","year":"2005","unstructured":"M. Nakai , S. Akui , K. Seno , T. Meguro , T. Seki , T. Kondo . A. Hashiguchi , H. Kawahara , K. Kumano , and M. Shimura . Dynamic Voltage and Frequency Management for a Low-Power Embedded Microprocessor. Solid-State Circuits , IEEE Journal of , 40 : 28 -- 35 , 2005 . M. Nakai, S. Akui, K. Seno, T. Meguro, T. Seki, T. Kondo. A. Hashiguchi, H. Kawahara, K. Kumano, and M. Shimura. Dynamic Voltage and Frequency Management for a Low-Power Embedded Microprocessor. Solid-State Circuits, IEEE Journal of, 40:28--35, 2005.","journal-title":"IEEE Journal of"},{"key":"e_1_3_2_1_19_1","doi-asserted-by":"publisher","DOI":"10.1109\/EUASIC.1991.212842"},{"key":"e_1_3_2_1_20_1","doi-asserted-by":"publisher","DOI":"10.1109\/VLSISOC.2009.6041336"},{"key":"e_1_3_2_1_21_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2007.09.001"},{"key":"e_1_3_2_1_22_1","volume-title":"VARI'11","author":"Vincent L.","year":"2011","unstructured":"L. Vincent , E. Beign\u00e9 , L. Alacoque , S. Lesecq , C. Bour and P. Maurine , \" A Fully Integrated 32 nm MultiProbe for Dynamic PVT Measurements within Complex Digital SoC,\" 2nd European Workshop on CMOS Variability , VARI'11 , 2011 . L. Vincent, E. Beign\u00e9, L. Alacoque, S. Lesecq, C. Bour and P. Maurine, \"A Fully Integrated 32 nm MultiProbe for Dynamic PVT Measurements within Complex Digital SoC,\" 2nd European Workshop on CMOS Variability, VARI'11, 2011."},{"key":"e_1_3_2_1_23_1","first-page":"427","volume-title":"CICC '09 IEEE","author":"Zheng R.","year":"2009","unstructured":"R. Zheng , J. Velamala , V. Reddy , V. Balakrishnan , E. Mintarno , S. Mitra , S. Krishnan , and Y. Cao , \" Circuit aging prediction for low-power operation,\" Custom Integrated Circuits Conference, 2009 . CICC '09 IEEE , pp. 427 -- 130 , 2009 . R. Zheng, J. Velamala, V. Reddy, V. Balakrishnan, E. Mintarno, S. Mitra, S. Krishnan, and Y. Cao, \"Circuit aging prediction for low-power operation,\" Custom Integrated Circuits Conference, 2009. CICC '09 IEEE, pp. 427--130, 2009."}],"event":{"name":"DAC '12: The 49th Annual Design Automation Conference 2012","location":"San Francisco California","acronym":"DAC '12","sponsor":["EDAC Electronic Design Automation Consortium","SIGDA ACM Special Interest Group on Design Automation","IEEE-CEDA","SIGBED ACM Special Interest Group on Embedded Systems"]},"container-title":["Proceedings of the 49th Annual Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2228360.2228539","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2228360.2228539","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T08:48:58Z","timestamp":1750236538000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2228360.2228539"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,6,3]]},"references-count":23,"alternative-id":["10.1145\/2228360.2228539","10.1145\/2228360"],"URL":"https:\/\/doi.org\/10.1145\/2228360.2228539","relation":{},"subject":[],"published":{"date-parts":[[2012,6,3]]},"assertion":[{"value":"2012-06-03","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}