{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,7]],"date-time":"2026-03-07T18:31:28Z","timestamp":1772908288358,"version":"3.50.1"},"publisher-location":"New York, NY, USA","reference-count":14,"publisher":"ACM","license":[{"start":{"date-parts":[[2012,6,3]],"date-time":"2012-06-03T00:00:00Z","timestamp":1338681600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"DOI":"10.13039\/501100001868","name":"National Science Council Taiwan","doi-asserted-by":"publisher","award":["NSC-99-2220-E-007-009"],"award-info":[{"award-number":["NSC-99-2220-E-007-009"]}],"id":[{"id":"10.13039\/501100001868","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2012,6,3]]},"DOI":"10.1145\/2228360.2228546","type":"proceedings-article","created":{"date-parts":[[2012,5,31]],"date-time":"2012-05-31T12:10:51Z","timestamp":1338466251000},"page":"1031-1036","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":27,"title":["Small delay testing for TSVs in 3-D ICs"],"prefix":"10.1145","author":[{"given":"Shi-Yu","family":"Huang","sequence":"first","affiliation":[{"name":"National Tsing Hua University, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu-Hsiang","family":"Lin","sequence":"additional","affiliation":[{"name":"National Tsing Hua University, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kun-Han (Hans)","family":"Tsai","sequence":"additional","affiliation":[{"name":"Silicon Test Solutions, Mentor Graphics"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wu-Tung","family":"Cheng","sequence":"additional","affiliation":[{"name":"Silicon Test Solutions, Mentor Graphics"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Stephen","family":"Sunter","sequence":"additional","affiliation":[{"name":"Silicon Test Solutions, Mentor Graphics"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yung-Fa","family":"Chou","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ding-Ming","family":"Kwai","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2012,6,3]]},"reference":[{"key":"e_1_3_2_1_1_1","first-page":"214","volume-title":"Microelectronic Test Structures","author":"Bassi A.","year":"2003","unstructured":"A. Bassi , A. Veggetti , L. Croce , and A. Bogliolo , \" Measuring the Effects of Process Variations on Circuit Performance by Means of Digitally Controllable Ring Oscillators,\" Proc. of Int'l Conf . Microelectronic Test Structures , pp. 214 -- 217 , Mar. 2003 . A. Bassi, A. Veggetti, L. Croce, and A. Bogliolo, \"Measuring the Effects of Process Variations on Circuit Performance by Means of Digitally Controllable Ring Oscillators,\" Proc. of Int'l Conf. Microelectronic Test Structures, pp. 214--217, Mar. 2003."},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2009.42"},{"key":"e_1_3_2_1_3_1","first-page":"133","article-title":"Within-Die Gate Delay Variability Measurement using Re-configurable Ring Oscillator","author":"Das B. P.","year":"2008","unstructured":"B. P. Das , B Amrutur , H. S. Jamadagni , N. V. Arvind , and V. Visvanathan , \" Within-Die Gate Delay Variability Measurement using Re-configurable Ring Oscillator ,\" Proc. of IEEE Custom Integrated Circuits Conf. (CICC) , pp. 133 -- 136 , Sept. 2008 . B. P. Das, B Amrutur, H. S. Jamadagni, N. V. Arvind, and V. Visvanathan, \"Within-Die Gate Delay Variability Measurement using Re-configurable Ring Oscillator,\" Proc. of IEEE Custom Integrated Circuits Conf. (CICC), pp. 133--136, Sept. 2008.","journal-title":"Proc. of IEEE Custom Integrated Circuits Conf. (CICC)"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/96.475271"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2034508"},{"key":"e_1_3_2_1_6_1","first-page":"598","volume-title":"Computer-Aided Design","author":"Loi I.","year":"2008","unstructured":"I. Loi , S. Mitra , T. H. Lee , S. Fujita , and L. Benini . \" A Low-Overhead Fault Tolerance Scheme for TSV-Based 3D Network on Chip Links,\" Proc. of Int'l Conf . Computer-Aided Design , pp. 598 -- 602 , Nov. 2008 . I. Loi, S. Mitra, T. H. Lee, S. Fujita, and L. Benini. \"A Low-Overhead Fault Tolerance Scheme for TSV-Based 3D Network on Chip Links,\" Proc. of Int'l Conf. Computer-Aided Design, pp. 598--602, Nov. 2008."},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1145\/1120725.1120800"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-007-0759-5"},{"key":"e_1_3_2_1_9_1","first-page":"1","article-title":"Testing 3D Chips Containing Through-Silicon Vias","author":"Marinissen E. J.","year":"2009","unstructured":"E. J. Marinissen and Y. Zorian , \" Testing 3D Chips Containing Through-Silicon Vias ,\" Proc. of Int'l Test Conf. , pp. 1 -- 11 , 2009 . E. J. Marinissen and Y. Zorian, \"Testing 3D Chips Containing Through-Silicon Vias,\" Proc. of Int'l Test Conf., pp. 1--11, 2009.","journal-title":"Proc. of Int'l Test Conf."},{"key":"e_1_3_2_1_10_1","first-page":"512","article-title":"Modeling the Driving-Point Characteristic of Resistive Interconnect for Accurate Delay Estimation","author":"O'Brien P. R.","year":"1989","unstructured":"P. R. O'Brien and T. L. Savarino , \" Modeling the Driving-Point Characteristic of Resistive Interconnect for Accurate Delay Estimation ,\" Proc. of Design Automation Conf. , pp. 512 -- 515 , Nov. 1989 . P. R. O'Brien and T. L. Savarino, \"Modeling the Driving-Point Characteristic of Resistive Interconnect for Accurate Delay Estimation,\" Proc. of Design Automation Conf., pp. 512--515, Nov. 1989.","journal-title":"Proc. of Design Automation Conf."},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1145\/343647.343841"},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1023\/A:1008365428314"},{"key":"e_1_3_2_1_13_1","first-page":"521","article-title":"Compact AC Modeling and Analysis of Cu, W, and CNT Based Through-Silicion Vias (TSVs) in 3D ICs","author":"Xu C.","year":"2009","unstructured":"C. Xu , H. Li , R. Suaya , and K. Banerjee , \" Compact AC Modeling and Analysis of Cu, W, and CNT Based Through-Silicion Vias (TSVs) in 3D ICs ,\" Tech. Digest of Int'l Electron Devices Meeting (IEDM) , pp. 521 -- 524 , ( 2009 ). C. Xu, H. Li, R. Suaya, and K. Banerjee, \"Compact AC Modeling and Analysis of Cu, W, and CNT Based Through-Silicion Vias (TSVs) in 3D ICs,\" Tech. Digest of Int'l Electron Devices Meeting (IEDM), pp. 521--524, (2009).","journal-title":"Tech. Digest of Int'l Electron Devices Meeting (IEDM)"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2010.73"}],"event":{"name":"DAC '12: The 49th Annual Design Automation Conference 2012","location":"San Francisco California","acronym":"DAC '12","sponsor":["EDAC Electronic Design Automation Consortium","SIGDA ACM Special Interest Group on Design Automation","IEEE-CEDA","SIGBED ACM Special Interest Group on Embedded Systems"]},"container-title":["Proceedings of the 49th Annual Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2228360.2228546","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2228360.2228546","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T08:48:58Z","timestamp":1750236538000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2228360.2228546"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,6,3]]},"references-count":14,"alternative-id":["10.1145\/2228360.2228546","10.1145\/2228360"],"URL":"https:\/\/doi.org\/10.1145\/2228360.2228546","relation":{},"subject":[],"published":{"date-parts":[[2012,6,3]]},"assertion":[{"value":"2012-06-03","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}