{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T04:23:02Z","timestamp":1750306982246,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":19,"publisher":"ACM","license":[{"start":{"date-parts":[[2013,5,29]],"date-time":"2013-05-29T00:00:00Z","timestamp":1369785600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2013,5,29]]},"DOI":"10.1145\/2463209.2488937","type":"proceedings-article","created":{"date-parts":[[2013,5,28]],"date-time":"2013-05-28T16:35:41Z","timestamp":1369758941000},"page":"1-9","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":9,"title":["SAW"],"prefix":"10.1145","author":[{"given":"Chundong","family":"Wang","sequence":"first","affiliation":[{"name":"National University of Singapore"}]},{"given":"Weng-Fai","family":"Wong","sequence":"additional","affiliation":[{"name":"National University of Singapore"}]}],"member":"320","published-online":{"date-parts":[[2013,5,29]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1145\/1244002.1244248"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1145\/1967677.1967683"},{"key":"e_1_3_2_1_3_1","unstructured":"Intel Corporation. What are the advantages of TRIM and how can I use it with my SSD? http:\/\/www.intel.com\/support\/ssdc\/hpssd\/sb\/CS-031846.htm.  Intel Corporation. What are the advantages of TRIM and how can I use it with my SSD? http:\/\/www.intel.com\/support\/ssdc\/hpssd\/sb\/CS-031846.htm."},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1145\/1367829.1367831"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1145\/1138041.1138043"},{"volume-title":"ICAC '04","author":"Mesnier M.","key":"e_1_3_2_1_6_1"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228518"},{"volume-title":"DATE '09","author":"Wu P.-L.","key":"e_1_3_2_1_8_1"},{"volume-title":"DATE '09","author":"Mylavarapu S. K.","key":"e_1_3_2_1_9_1"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1145\/1278480.1278533"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1109\/SIMUL.2009.17"},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228401"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"crossref","unstructured":"A. Hunter. A brief introduction to the design of UBIFS 2008.  A. Hunter. A brief introduction to the design of UBIFS 2008.","DOI":"10.5949\/liverpool\/9780973893465.003.0001"},{"key":"e_1_3_2_1_14_1","unstructured":"Micron Technology Inc. TN-26-61: Wear-leveling in Micron\u00ae NAND flash memory. Technical report Oct 2011.  Micron Technology Inc. TN-26-61: Wear-leveling in Micron\u00ae NAND flash memory. Technical report Oct 2011."},{"key":"e_1_3_2_1_15_1","unstructured":"Micron Technology Feburary 2012.  Micron Technology Inc. NAND flash memory datasheet (MT29F16G08AJADAWP) Feburary 2012."},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1109\/MSST.2011.5937216"},{"key":"e_1_3_2_1_18_1","unstructured":"File system and Storage Lab. Filebench benchmark 2011. http:\/\/sourceforge.net\/projects\/filebench\/.  File system and Storage Lab. Filebench benchmark 2011. http:\/\/sourceforge.net\/projects\/filebench\/."},{"volume-title":"DATE '12","author":"Wang C.","key":"e_1_3_2_1_19_1"},{"key":"e_1_3_2_1_20_1","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228405"}],"event":{"name":"DAC '13: The 50th Annual Design Automation Conference 2013","sponsor":["EDAC Electronic Design Automation Consortium","SIGDA ACM Special Interest Group on Design Automation","IEEE-CEDA","SIGBED ACM Special Interest Group on Embedded Systems"],"location":"Austin Texas","acronym":"DAC '13"},"container-title":["Proceedings of the 50th Annual Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2463209.2488937","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2463209.2488937","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T08:39:39Z","timestamp":1750235979000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2463209.2488937"}},"subtitle":["system-assisted wear leveling on the write endurance of NAND flash devices"],"short-title":[],"issued":{"date-parts":[[2013,5,29]]},"references-count":19,"alternative-id":["10.1145\/2463209.2488937","10.1145\/2463209"],"URL":"https:\/\/doi.org\/10.1145\/2463209.2488937","relation":{},"subject":[],"published":{"date-parts":[[2013,5,29]]},"assertion":[{"value":"2013-05-29","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}