{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2023,1,14]],"date-time":"2023-01-14T05:32:12Z","timestamp":1673674332300},"publisher-location":"New York, NY, USA","reference-count":0,"publisher":"ACM","isbn-type":[{"value":"9781450317849","type":"print"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,1,23]]},"DOI":"10.1145\/2482759","type":"proceedings","created":{"date-parts":[[2013,5,3]],"date-time":"2013-05-03T12:30:41Z","timestamp":1367584241000},"source":"Crossref","is-referenced-by-count":0,"title":["Proceedings of the 2013 Interconnection Network Architecture: On-Chip, Multi-Chip"],"prefix":"10.1145","member":"320","published-online":{"date-parts":[[2013,1,23]]},"event":{"name":"INA-OCMC '13: On-Chip, Multi-Chip","location":"Berlin Germany","acronym":"INA-OCMC '13"},"container-title":[],"original-title":[],"deposited":{"date-parts":[[2023,1,13]],"date-time":"2023-01-13T10:19:55Z","timestamp":1673605195000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/proceedings\/10.1145\/2482759"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,1,23]]},"ISBN":["9781450317849"],"references-count":0,"alternative-id":["10.1145\/2482759"],"URL":"https:\/\/doi.org\/10.1145\/2482759","relation":{},"subject":[],"published":{"date-parts":[[2013,1,23]]}}}