{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,28]],"date-time":"2026-07-28T14:27:19Z","timestamp":1785248839911,"version":"3.55.0"},"publisher-location":"New York, NY, USA","reference-count":24,"publisher":"ACM","license":[{"start":{"date-parts":[[2014,6,1]],"date-time":"2014-06-01T00:00:00Z","timestamp":1401580800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2014,6]]},"DOI":"10.1145\/2593069.2593157","type":"proceedings-article","created":{"date-parts":[[2014,5,27]],"date-time":"2014-05-27T12:57:10Z","timestamp":1401195430000},"page":"1-6","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":70,"title":["Low-cost On-Chip Structures for Combating Die and IC Recycling"],"prefix":"10.1145","author":[{"given":"Ujjwal","family":"Guin","sequence":"first","affiliation":[{"name":"ECE Department, University of Connecticut"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xuehui","family":"Zhang","sequence":"additional","affiliation":[{"name":"ECE Department, University of Connecticut"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Domenic","family":"Forte","sequence":"additional","affiliation":[{"name":"ECE Department, University of Connecticut"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mohammad","family":"Tehranipoor","sequence":"additional","affiliation":[{"name":"ECE Department, University of Connecticut"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"320","published-online":{"date-parts":[[2014,6]]},"reference":[{"key":"e_1_3_2_1_1_1","unstructured":"A. T. Appel. Rectangular contact used as a low voltage fuse element Aug 2004.  A. T. Appel. Rectangular contact used as a low voltage fuse element Aug 2004."},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1145\/2206781.2206793"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1109\/DFT.2013.6653606"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-013-5428-2"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-013-5430-8"},{"issue":"1","key":"e_1_3_2_1_6_1","first-page":"295","article-title":"Hot-Electron-Induced MOSFET Degradation - Model, Monitor, and Improvement","volume":"20","author":"Hu C.","year":"1985","journal-title":"JSSC"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1109\/DFT.2012.6378191"},{"key":"e_1_3_2_1_8_1","unstructured":"IDEA. Acceptability of electronic components distributed in the open market. http:\/\/www.idofea.org\/products\/118-idea-std-1010b.  IDEA. Acceptability of electronic components distributed in the open market. http:\/\/www.idofea.org\/products\/118-idea-std-1010b."},{"key":"e_1_3_2_1_9_1","unstructured":"IHS iSuppli. Top 5 Most Counterfeited Parts Represent a $169 Billion Potential Challenge for Global Semiconductor Market 2011.  IHS iSuppli. Top 5 Most Counterfeited Parts Represent a $169 Billion Potential Challenge for Global Semiconductor Market 2011."},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.5555\/648019.744971"},{"key":"e_1_3_2_1_11_1","article-title":"Faked Parts Detection. Circuits Assembly","author":"Kessler L. W.","year":"2010","journal-title":"The Journal for Surface Mount and Electronics Assembly"},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1145\/378239.378568"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.201101760"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.4271\/2012-01-2104"},{"key":"e_1_3_2_1_15_1","unstructured":"H. C. Nicolay. Integrated circuit fuse Jun 1981.  H. C. Nicolay. Integrated circuit fuse Jun 1981."},{"key":"e_1_3_2_1_16_1","volume-title":"Massachusetts Institute of Technology","author":"Pappu R.","year":"2001"},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2007.4405850"},{"key":"e_1_3_2_1_18_1","unstructured":"SAE. Counterfeit electronic parts; avoidance detection mitigation and disposition 2009. http:\/\/standards.sae.org\/as5553\/.  SAE. Counterfeit electronic parts; avoidance detection mitigation and disposition 2009. http:\/\/standards.sae.org\/as5553\/."},{"key":"e_1_3_2_1_19_1","unstructured":"Semiconductor Industry Association (SIA). Public Comments - DNA Authentication Marking on Items in FSC5962 November 2012.  Semiconductor Industry Association (SIA). Public Comments - DNA Authentication Marking on Items in FSC5962 November 2012."},{"key":"e_1_3_2_1_20_1","unstructured":"Synopsys. 90nm Generic Library.  Synopsys. 90nm Generic Library."},{"key":"e_1_3_2_1_21_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2011.12.008"},{"key":"e_1_3_2_1_22_1","author":"Zhang X.","year":"2013","journal-title":"IEEE Transactions on VLSI Systems"},{"key":"e_1_3_2_1_23_1","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228486"},{"key":"e_1_3_2_1_24_1","doi-asserted-by":"publisher","DOI":"10.1109\/DFT.2012.6378192"}],"event":{"name":"DAC '14: The 51st Annual Design Automation Conference 2014","location":"San Francisco CA USA","acronym":"DAC '14","sponsor":["EDAC Electronic Design Automation Consortium","SIGBED ACM Special Interest Group on Embedded Systems","SIGDA ACM Special Interest Group on Design Automation","IEEE-CEDA"]},"container-title":["Proceedings of the 51st Annual Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2593069.2593157","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2593069.2593157","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T07:01:24Z","timestamp":1750230084000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2593069.2593157"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,6]]},"references-count":24,"alternative-id":["10.1145\/2593069.2593157","10.1145\/2593069"],"URL":"https:\/\/doi.org\/10.1145\/2593069.2593157","relation":{},"subject":[],"published":{"date-parts":[[2014,6]]},"assertion":[{"value":"2014-06-01","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}