{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T04:18:01Z","timestamp":1750306681463,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":17,"publisher":"ACM","license":[{"start":{"date-parts":[[2014,6,1]],"date-time":"2014-06-01T00:00:00Z","timestamp":1401580800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2014,6]]},"DOI":"10.1145\/2593069.2596694","type":"proceedings-article","created":{"date-parts":[[2014,5,27]],"date-time":"2014-05-27T12:57:10Z","timestamp":1401195430000},"page":"1-6","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":14,"title":["Workload- and Instruction-Aware Timing Analysis"],"prefix":"10.1145","author":[{"given":"Veit B.","family":"Kleeberger","sequence":"first","affiliation":[{"name":"Institute for Electronic Design Automation, Technische Universit\u00e4t M\u00fcnchen, Munich, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Petra R.","family":"Maier","sequence":"additional","affiliation":[{"name":"Institute for Electronic Design Automation, Technische Universit\u00e4t M\u00fcnchen, Munich, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ulf","family":"Schlichtmann","sequence":"additional","affiliation":[{"name":"Institute for Electronic Design Automation, Technische Universit\u00e4t M\u00fcnchen, Munich, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2014,6]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.5555\/2616606.2616982"},{"key":"e_1_3_2_1_2_1","volume-title":"Cross-Layer Dependability Modeling and Abstraction in System on Chip. In SELSE Workshop","author":"Herkersdorf A.","year":"2013","unstructured":"A. Herkersdorf Cross-Layer Dependability Modeling and Abstraction in System on Chip. In SELSE Workshop , 2013 . A. Herkersdorf et al. Cross-Layer Dependability Modeling and Abstraction in System on Chip. In SELSE Workshop, 2013."},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2013.12.012"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS.2012.6313849"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/54.485785"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.5555\/1015090.1015125"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS.2009.5195975"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISICir.2011.6131919"},{"key":"e_1_3_2_1_9_1","volume-title":"Timing","author":"Sapatnekar S.","year":"2004","unstructured":"S. Sapatnekar . Timing . Springer , 2004 . S. Sapatnekar. Timing. Springer, 2004."},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.862751"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2012.6241795"},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2013.12.002"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1109\/T-C.1975.224279"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1109\/ETC.1989.36234"},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2596682"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2596683"},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2596684"}],"event":{"name":"DAC '14: The 51st Annual Design Automation Conference 2014","sponsor":["EDAC Electronic Design Automation Consortium","SIGBED ACM Special Interest Group on Embedded Systems","SIGDA ACM Special Interest Group on Design Automation","IEEE-CEDA"],"location":"San Francisco CA USA","acronym":"DAC '14"},"container-title":["Proceedings of the 51st Annual Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2593069.2596694","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2593069.2596694","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T07:01:11Z","timestamp":1750230071000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2593069.2596694"}},"subtitle":["The missing Link between Technology and System-level Resilience"],"short-title":[],"issued":{"date-parts":[[2014,6]]},"references-count":17,"alternative-id":["10.1145\/2593069.2596694","10.1145\/2593069"],"URL":"https:\/\/doi.org\/10.1145\/2593069.2596694","relation":{},"subject":[],"published":{"date-parts":[[2014,6]]},"assertion":[{"value":"2014-06-01","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}