{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,11]],"date-time":"2025-12-11T07:33:05Z","timestamp":1765438385344,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":28,"publisher":"ACM","license":[{"start":{"date-parts":[[2014,8,11]],"date-time":"2014-08-11T00:00:00Z","timestamp":1407715200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"DOI":"10.13039\/100000185","name":"Defense Advanced Research Projects Agency","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100000185","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2014,8,11]]},"DOI":"10.1145\/2627369.2627641","type":"proceedings-article","created":{"date-parts":[[2014,8,1]],"date-time":"2014-08-01T20:13:39Z","timestamp":1406924019000},"page":"117-122","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":54,"title":["Therminator"],"prefix":"10.1145","author":[{"given":"Qing","family":"Xie","sequence":"first","affiliation":[{"name":"University of Southern California, Los Angeles, CA, USA"}]},{"given":"Mohammad Javad","family":"Dousti","sequence":"additional","affiliation":[{"name":"University of Southern California, Los Angeles, CA, USA"}]},{"given":"Massoud","family":"Pedram","sequence":"additional","affiliation":[{"name":"University of Southern California, Los Angeles, CA, USA"}]}],"member":"320","published-online":{"date-parts":[[2014,8,11]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.879797"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"crossref","unstructured":"J. Srinivasan etal \"The case for lifetime reliability-aware microprocessors \" in ISCA 2004.   J. Srinivasan et al. \"The case for lifetime reliability-aware microprocessors \" in ISCA 2004.","DOI":"10.1145\/1028176.1006725"},{"key":"e_1_3_2_1_3_1","first-page":"1488","article-title":"Generic thermal analysis for phone and tablet systems","author":"Gurrum S. P.","year":"2012","journal-title":"ECTC"},{"key":"e_1_3_2_1_4_1","first-page":"30","article-title":"Thermal management of embedded devices","author":"Rajmond J.","year":"2013","journal-title":"ISSE"},{"key":"e_1_3_2_1_5_1","unstructured":"A. L. Shimpi \"The ARM vs x86 Wars Have Begun: In-Depth Power Analysis of Atom Krait & Cortex A15.\" {Online}. Available: http:\/\/www.anandtech.com\/show\/6536\/arm-vs-x86-the-real-showdown.  A. L. Shimpi \"The ARM vs x86 Wars Have Begun: In-Depth Power Analysis of Atom Krait & Cortex A15.\" {Online}. Available: http:\/\/www.anandtech.com\/show\/6536\/arm-vs-x86-the-real-showdown."},{"volume-title":"Qual.","year":"2006","author":"Arens E.","key":"e_1_3_2_1_6_1"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.clinph.2008.07.223"},{"key":"e_1_3_2_1_8_1","unstructured":"A. Ku \"Asus Transformer Pad TF300T Review: Tegra 3 More Affordable - An Affordable Transformer Prime Derivative\" \" Tom's Hardware. {Online}. Available: http:\/\/www.tomshardware.com\/reviews\/transformer-pad-tf300t-tegra-3-benchmark-review 3179.html.  A. Ku \"Asus Transformer Pad TF300T Review: Tegra 3 More Affordable - An Affordable Transformer Prime Derivative\" \" Tom's Hardware. {Online}. Available: http:\/\/www.tomshardware.com\/reviews\/transformer-pad-tf300t-tegra-3-benchmark-review 3179.html."},{"key":"e_1_3_2_1_9_1","article-title":"New Apple iPad hits 116 degrees, Consumer Reports says","volume":"2012","author":"Kaplan J. A.","journal-title":"FoxNews.com. {Online}. Available: http:\/\/www.foxnews.com\/tech\/"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2002.808009"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1145\/980152.980157"},{"key":"e_1_3_2_1_12_1","unstructured":"\"Snapdragon MDP Mobile Development Platform - Legacy Devices \" Qualcomm Developer Network. {Online}. Available: https:\/\/developer.qualcomm.com\/mobile-development\/development-devices-boards\/mobile-development-devices\/snapdragon-mdp-legacy-devices.  \"Snapdragon MDP Mobile Development Platform - Legacy Devices \" Qualcomm Developer Network. {Online}. Available: https:\/\/developer.qualcomm.com\/mobile-development\/development-devices-boards\/mobile-development-devices\/snapdragon-mdp-legacy-devices."},{"key":"e_1_3_2_1_13_1","unstructured":"\"Simulation Software | Mechanical CFD Plastics | Autodesk.\" {Online}. Available: http:\/\/www.autodesk.com\/products\/autodesk-simulation-family\/overview.  \"Simulation Software | Mechanical CFD Plastics | Autodesk.\" {Online}. Available: http:\/\/www.autodesk.com\/products\/autodesk-simulation-family\/overview."},{"key":"e_1_3_2_1_14_1","unstructured":"Y. Han etal \"Temptor: A Lightweight Runtime Temperature Monitoring Tool Using Performance Counters \" in TACS 2006.  Y. Han et al. \"Temptor: A Lightweight Runtime Temperature Monitoring Tool Using Performance Counters \" in TACS 2006."},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228477"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"crossref","unstructured":"M. J. Dousti and M. Pedram \"Platform-dependent leakage-aware control of the driving current of embedded thermoelectric coolers \" in ISLPED 2013.   M. J. Dousti and M. Pedram \"Platform-dependent leakage-aware control of the driving current of embedded thermoelectric coolers \" in ISLPED 2013.","DOI":"10.1109\/ISLPED.2013.6629315"},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"crossref","unstructured":"A. Sridhar etal \"3D-ICE: Fast Compact Transient Thermal Modeling for 3D ICs with Inter-tier Liquid Cooling \" in ICCAD 2010.   A. Sridhar et al. \"3D-ICE: Fast Compact Transient Thermal Modeling for 3D ICs with Inter-tier Liquid Cooling \" in ICCAD 2010.","DOI":"10.1109\/ICCAD.2010.5653749"},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2007.11.025"},{"key":"e_1_3_2_1_19_1","doi-asserted-by":"publisher","DOI":"10.1145\/1878961.1878982"},{"key":"e_1_3_2_1_20_1","doi-asserted-by":"publisher","DOI":"10.1145\/2168836.2168841"},{"volume-title":"CRC Press","year":"2000","author":"Kreith F.","key":"e_1_3_2_1_21_1"},{"volume-title":"Boston: McGraw-Hill","year":"2007","author":"Cengel Y. A.","key":"e_1_3_2_1_22_1"},{"key":"e_1_3_2_1_23_1","unstructured":"\"pugixml \" pugixml. {Online}. Available: http:\/\/pugixml.org\/.  \"pugixml \" pugixml. {Online}. Available: http:\/\/pugixml.org\/."},{"key":"e_1_3_2_1_24_1","unstructured":"\"CULA.\" {Online}. Available: http:\/\/www.culatools.com.  \"CULA.\" {Online}. Available: http:\/\/www.culatools.com."},{"key":"e_1_3_2_1_25_1","unstructured":"\"StabilityTest.\" {Online}. Available: https:\/\/play.google.com\/store\/apps\/details?id=com.into.stability&hl=en.  \"StabilityTest.\" {Online}. Available: https:\/\/play.google.com\/store\/apps\/details?id=com.into.stability&hl=en."},{"key":"e_1_3_2_1_26_1","unstructured":"\"Trepn Profiler \" Qualcomm Developer Network. {Online}. Available: https:\/\/developer.qualcomm.com\/mobile-development\/performance-tools\/trepn-profiler.  \"Trepn Profiler \" Qualcomm Developer Network. {Online}. Available: https:\/\/developer.qualcomm.com\/mobile-development\/performance-tools\/trepn-profiler."},{"key":"e_1_3_2_1_27_1","doi-asserted-by":"publisher","DOI":"10.1145\/2444776.2444781"},{"key":"e_1_3_2_1_28_1","doi-asserted-by":"publisher","DOI":"10.1145\/1669112.1669172"}],"event":{"name":"ISLPED'14: International Symposium on Low Power Electronics and Design","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE CAS"],"location":"La Jolla California USA","acronym":"ISLPED'14"},"container-title":["Proceedings of the 2014 international symposium on Low power electronics and design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2627369.2627641","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2627369.2627641","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T06:56:08Z","timestamp":1750229768000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2627369.2627641"}},"subtitle":["a thermal simulator for smartphones producing accurate chip and skin temperature maps"],"short-title":[],"issued":{"date-parts":[[2014,8,11]]},"references-count":28,"alternative-id":["10.1145\/2627369.2627641","10.1145\/2627369"],"URL":"https:\/\/doi.org\/10.1145\/2627369.2627641","relation":{},"subject":[],"published":{"date-parts":[[2014,8,11]]},"assertion":[{"value":"2014-08-11","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}