{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T04:17:29Z","timestamp":1750306649871,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":19,"publisher":"ACM","license":[{"start":{"date-parts":[[2014,8,11]],"date-time":"2014-08-11T00:00:00Z","timestamp":1407715200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2014,8,11]]},"DOI":"10.1145\/2627369.2631641","type":"proceedings-article","created":{"date-parts":[[2014,8,1]],"date-time":"2014-08-01T20:13:39Z","timestamp":1406924019000},"page":"131-136","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":27,"title":["Unified embedded non-volatile memory for emerging mobile markets"],"prefix":"10.1145","author":[{"given":"Kangho","family":"Lee","sequence":"first","affiliation":[{"name":"Qualcomm Technologies Incorporated, San Diego, CA, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jimmy J.","family":"Kan","sequence":"additional","affiliation":[{"name":"Qualcomm Technologies Incorporated, San Diego, CA, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Seung H.","family":"Kang","sequence":"additional","affiliation":[{"name":"Qualcomm Technologies Incorporated, San Diego, CA, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2014,8,11]]},"reference":[{"key":"e_1_3_2_1_1_1","unstructured":"A. Niebel. 2013. Semiconductors and Memory Shaping Up for Growth in 2013. (January 2013). Retrieved July 1 2014 from http:\/\/www.kilopass.com\/semiconductors-and-memory-shaping-up-for-growth-in-2013  A. Niebel. 2013. Semiconductors and Memory Shaping Up for Growth in 2013. (January 2013). Retrieved July 1 2014 from http:\/\/www.kilopass.com\/semiconductors-and-memory-shaping-up-for-growth-in-2013"},{"volume-title":"Proc. ICICDT, (May","year":"2011","author":"Hidaka H.","key":"e_1_3_2_1_2_1"},{"volume-title":"Proc. IEDM, (Dec.","year":"2011","author":"Strenz R.","key":"e_1_3_2_1_3_1"},{"volume-title":"Proc. IMW, (May","year":"2012","author":"Baker K.","key":"e_1_3_2_1_4_1"},{"key":"e_1_3_2_1_5_1","unstructured":"E. Hsiao. 2013. Using Non-volatile Memory IP in System on Chip Designs. (June 2013). Retrieved June 20 2014 from http:\/\/www.eetimes.com  E. Hsiao. 2013. Using Non-volatile Memory IP in System on Chip Designs. (June 2013). Retrieved June 20 2014 from http:\/\/www.eetimes.com"},{"key":"e_1_3_2_1_6_1","unstructured":"MSP430FRxx series product spec. Retrieved June 20 2014 from http:\/\/www.ti.com  MSP430FRxx series product spec. Retrieved June 20 2014 from http:\/\/www.ti.com"},{"key":"e_1_3_2_1_7_1","unstructured":"AM1(MN101) series product spec Retrieved June 20 2014 from http:\/\/www.semicon.panasonic.co.jp  AM1(MN101) series product spec Retrieved June 20 2014 from http:\/\/www.semicon.panasonic.co.jp"},{"key":"e_1_3_2_1_8_1","unstructured":"MR series product spec Retrieved June 20 2014 from http:\/\/www.everspin.com  MR series product spec Retrieved June 20 2014 from http:\/\/www.everspin.com"},{"key":"e_1_3_2_1_9_1","unstructured":"C. Bohac. 2013. Comparing FRAM and MRAM. Application Note 02130. Everspin Technologies Inc. Chandler AZ.  C. Bohac. 2013. Comparing FRAM and MRAM. Application Note 02130. Everspin Technologies Inc. Chandler AZ."},{"volume-title":"VLSI, (June 2014)","author":"Jan G.","key":"e_1_3_2_1_10_1"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2014.6858403"},{"volume-title":"Proc. ISSCC, (Feb.","year":"2013","author":"Bartling S. C.","key":"e_1_3_2_1_12_1"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757392"},{"key":"e_1_3_2_1_14_1","unstructured":"iFixit. 2013. Teardown. (March 2013). Retrieved March 5 2014 from http:\/\/www.ifixit.com  iFixit. 2013. Teardown. (March 2013). Retrieved March 5 2014 from http:\/\/www.ifixit.com"},{"key":"e_1_3_2_1_15_1","unstructured":"Tech Insights. 2013. Qualcomm Toq Smartwatch Sample Report. (Dec 2013). Retrieved March 5 2014 from http:\/\/www.techinsights.com  Tech Insights. 2013. Qualcomm Toq Smartwatch Sample Report. (Dec 2013). Retrieved March 5 2014 from http:\/\/www.techinsights.com"},{"key":"e_1_3_2_1_16_1","first-page":"2244","author":"Sakimura N.","year":"2009","journal-title":"JSSCC"},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2005.1609379"},{"volume-title":"Proc. IEDM, (Dec.","year":"2012","author":"Slaughter J. M.","key":"e_1_3_2_1_18_1"},{"volume-title":"Symp. VLSI, (June","year":"2014","author":"Kang S. H.","key":"e_1_3_2_1_19_1"}],"event":{"name":"ISLPED'14: International Symposium on Low Power Electronics and Design","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE CAS"],"location":"La Jolla California USA","acronym":"ISLPED'14"},"container-title":["Proceedings of the 2014 international symposium on Low power electronics and design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2627369.2631641","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2627369.2631641","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T06:56:08Z","timestamp":1750229768000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2627369.2631641"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,8,11]]},"references-count":19,"alternative-id":["10.1145\/2627369.2631641","10.1145\/2627369"],"URL":"https:\/\/doi.org\/10.1145\/2627369.2631641","relation":{},"subject":[],"published":{"date-parts":[[2014,8,11]]},"assertion":[{"value":"2014-08-11","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}