{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,6]],"date-time":"2025-10-06T19:02:29Z","timestamp":1759777349814,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":9,"publisher":"ACM","license":[{"start":{"date-parts":[[2014,9,13]],"date-time":"2014-09-13T00:00:00Z","timestamp":1410566400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"DOI":"10.13039\/501100004963","name":"Seventh Framework Programme","doi-asserted-by":"publisher","award":["323849"],"award-info":[{"award-number":["323849"]}],"id":[{"id":"10.13039\/501100004963","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2014,9,13]]},"DOI":"10.1145\/2641248.2666717","type":"proceedings-article","created":{"date-parts":[[2014,9,17]],"date-time":"2014-09-17T14:22:41Z","timestamp":1410963761000},"page":"255-260","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":3,"title":["Designing an interface between the textile and electronics using e-textile composites"],"prefix":"10.1145","author":[{"given":"Matija","family":"Varga","sequence":"first","affiliation":[{"name":"ETH Z\u00fcrich, Gloriastrasse, Z\u00fcrich"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gerhard","family":"Tr\u00f6ster","sequence":"additional","affiliation":[{"name":"ETH Z\u00fcrich, Gloriastrasse, Z\u00fcrich"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2014,9,13]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2004.826537"},{"key":"e_1_3_2_1_2_1","volume-title":"Microelectronics and Packaging Conference, 2009. EMPC 2009. European (June","author":"Brun J.","year":"2009","unstructured":"Brun , J. , Vicard , D. , Mourey , B. , Lepine , B. , and Frassati , F . Packaging and wired interconnections for insertion of miniaturized chips in smart fabrics . In Microelectronics and Packaging Conference, 2009. EMPC 2009. European (June 2009 ), 1--5. Brun, J., Vicard, D., Mourey, B., Lepine, B., and Frassati, F. Packaging and wired interconnections for insertion of miniaturized chips in smart fabrics. In Microelectronics and Packaging Conference, 2009. EMPC 2009. European (June 2009), 1--5."},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00779-007-0181-0"},{"key":"e_1_3_2_1_4_1","volume-title":"Smart fabric sensors and e-textile technologies: a review. Smart Materials and Structures","author":"Castano L. M.","year":"2014","unstructured":"Castano , L. M. , and Flatau , A. B . Smart fabric sensors and e-textile technologies: a review. Smart Materials and Structures ( 2014 ), 053001. Castano, L. M., and Flatau, A. B. Smart fabric sensors and e-textile technologies: a review. Smart Materials and Structures (2014), 053001."},{"key":"e_1_3_2_1_5_1","first-page":"196","article-title":"-J. Electrical characterization of screen-printed circuits on the fabric. Advanced Packaging","volume":"33","author":"Kim Y.","year":"2010","unstructured":"Kim , Y. , Kim , H. , and Yoo , H . -J. Electrical characterization of screen-printed circuits on the fabric. Advanced Packaging , IEEE Transactions on 33 ( 2010 ), 196 -- 205 . Kim, Y., Kim, H., and Yoo, H.-J. Electrical characterization of screen-printed circuits on the fabric. Advanced Packaging, IEEE Transactions on 33 (2010), 196--205.","journal-title":"IEEE Transactions on"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1080\/00405000.2012.664867"},{"key":"e_1_3_2_1_7_1","first-page":"541","article-title":"Fundamental building blocks for circuits on textiles. Advanced Packaging","author":"Locher I.","year":"2007","unstructured":"Locher , I. , and Troster , G . Fundamental building blocks for circuits on textiles. Advanced Packaging , IEEE Transactions on ( Aug 2007 ), 541 -- 550 . Locher, I., and Troster, G. Fundamental building blocks for circuits on textiles. Advanced Packaging, IEEE Transactions on (Aug 2007), 541--550.","journal-title":"IEEE Transactions on"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC.2012.6542057"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1177\/0040517512468813"}],"event":{"name":"UbiComp '14: The 2014 ACM Conference on Ubiquitous Computing","sponsor":["SIGMOBILE ACM Special Interest Group on Mobility of Systems, Users, Data and Computing","SIGCHI ACM Special Interest Group on Computer-Human Interaction","SIGSPATIAL ACM Special Interest Group on Spatial Information"],"location":"Seattle Washington","acronym":"UbiComp '14"},"container-title":["Proceedings of the 2014 ACM International Symposium on Wearable Computers: Adjunct Program"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2641248.2666717","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2641248.2666717","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T20:01:06Z","timestamp":1750276866000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2641248.2666717"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,9,13]]},"references-count":9,"alternative-id":["10.1145\/2641248.2666717","10.1145\/2641248"],"URL":"https:\/\/doi.org\/10.1145\/2641248.2666717","relation":{},"subject":[],"published":{"date-parts":[[2014,9,13]]},"assertion":[{"value":"2014-09-13","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}